Interconnect yield analysis and fault tolerance for field programmable gate arrays

Imperial Users onl

Investigations into the feasibility of an on-line test methodology

This thesis aims to understand how information coding and the protocol that it supports can affect the characteristics of electronic circuits. More specifically, it investigates an on-line test methodology called IFIS (If it Fails It Stops) and its impact on the design, implementation and subsequent characteristics of circuits intended for application specific lC (ASIC) technology. The first study investigates the influences of information coding and protocol on the characteristics of IFIS systems. The second study investigates methods of circuit design applicable to IFIS cells and identifies the· technique possessing the characteristics most suitable for on-line testing. The third study investigates the characteristics of a 'real-life' commercial UART re-engineered using the techniques resulting from the previous two studies. The final study investigates the effects of the halting properties endowed by the protocol on failure diagnosis within IFIS systems. The outcome of this work is an identification and characterisation of the factors that influence behaviour, implementation costs and the ability to test and diagnose IFIS designs

An efficient logic fault diagnosis framework based on effect-cause approach

Fault diagnosis plays an important role in improving the circuit design process and the manufacturing yield. With the increasing number of gates in modern circuits, determining the source of failure in a defective circuit is becoming more and more challenging. In this research, we present an efficient effect-cause diagnosis framework for combinational VLSI circuits. The framework consists of three stages to obtain an accurate and reasonably precise diagnosis. First, an improved critical path tracing algorithm is proposed to identify an initial suspect list by backtracing from faulty primary outputs toward primary inputs. Compared to the traditional critical path tracing approach, our algorithm is faster and exact. Second, a novel probabilistic ranking model is applied to rank the suspects so that the most suspicious one will be ranked at or near the top. Several fast filtering methods are used to prune unrelated suspects. Finally, to refine the diagnosis, fault simulation is performed on the top suspect nets using several common fault models. The difference between the observed faulty behavior and the simulated behavior is used to rank each suspect. Experimental results on ISCAS85 benchmark circuits show that this diagnosis approach is efficient both in terms of memory space and CPU time and the diagnosis results are accurate and reasonably precise

New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs

Tesis por compendio[EN] Relevance of electronics towards safety of common devices has only been growing, as an ever growing stake of the functionality is assigned to them. But of course, this comes along the constant need for higher performances to fulfill such functionality requirements, while keeping power and budget low. In this scenario, industry is struggling to provide a technology which meets all the performance, power and price specifications, at the cost of an increased vulnerability to several types of known faults or the appearance of new ones. To provide a solution for the new and growing faults in the systems, designers have been using traditional techniques from safety-critical applications, which offer in general suboptimal results. In fact, modern embedded architectures offer the possibility of optimizing the dependability properties by enabling the interaction of hardware, firmware and software levels in the process. However, that point is not yet successfully achieved. Advances in every level towards that direction are much needed if flexible, robust, resilient and cost effective fault tolerance is desired. The work presented here focuses on the hardware level, with the background consideration of a potential integration into a holistic approach. The efforts in this thesis have focused several issues: (i) to introduce additional fault models as required for adequate representativity of physical effects blooming in modern manufacturing technologies, (ii) to provide tools and methods to efficiently inject both the proposed models and classical ones, (iii) to analyze the optimum method for assessing the robustness of the systems by using extensive fault injection and later correlation with higher level layers in an effort to cut development time and cost, (iv) to provide new detection methodologies to cope with challenges modeled by proposed fault models, (v) to propose mitigation strategies focused towards tackling such new threat scenarios and (vi) to devise an automated methodology for the deployment of many fault tolerance mechanisms in a systematic robust way. The outcomes of the thesis constitute a suite of tools and methods to help the designer of critical systems in his task to develop robust, validated, and on-time designs tailored to his application.[ES] La relevancia que la electrónica adquiere en la seguridad de los productos ha crecido inexorablemente, puesto que cada vez ésta copa una mayor influencia en la funcionalidad de los mismos. Pero, por supuesto, este hecho viene acompañado de una necesidad constante de mayores prestaciones para cumplir con los requerimientos funcionales, al tiempo que se mantienen los costes y el consumo en unos niveles reducidos. En este escenario, la industria está realizando esfuerzos para proveer una tecnología que cumpla con todas las especificaciones de potencia, consumo y precio, a costa de un incremento en la vulnerabilidad a múltiples tipos de fallos conocidos o la introducción de nuevos. Para ofrecer una solución a los fallos nuevos y crecientes en los sistemas, los diseñadores han recurrido a técnicas tradicionalmente asociadas a sistemas críticos para la seguridad, que ofrecen en general resultados sub-óptimos. De hecho, las arquitecturas empotradas modernas ofrecen la posibilidad de optimizar las propiedades de confiabilidad al habilitar la interacción de los niveles de hardware, firmware y software en el proceso. No obstante, ese punto no está resulto todavía. Se necesitan avances en todos los niveles en la mencionada dirección para poder alcanzar los objetivos de una tolerancia a fallos flexible, robusta, resiliente y a bajo coste. El trabajo presentado aquí se centra en el nivel de hardware, con la consideración de fondo de una potencial integración en una estrategia holística. Los esfuerzos de esta tesis se han centrado en los siguientes aspectos: (i) la introducción de modelos de fallo adicionales requeridos para la representación adecuada de efectos físicos surgentes en las tecnologías de manufactura actuales, (ii) la provisión de herramientas y métodos para la inyección eficiente de los modelos propuestos y de los clásicos, (iii) el análisis del método óptimo para estudiar la robustez de sistemas mediante el uso de inyección de fallos extensiva, y la posterior correlación con capas de más alto nivel en un esfuerzo por recortar el tiempo y coste de desarrollo, (iv) la provisión de nuevos métodos de detección para cubrir los retos planteados por los modelos de fallo propuestos, (v) la propuesta de estrategias de mitigación enfocadas hacia el tratamiento de dichos escenarios de amenaza y (vi) la introducción de una metodología automatizada de despliegue de diversos mecanismos de tolerancia a fallos de forma robusta y sistemática. Los resultados de la presente tesis constituyen un conjunto de herramientas y métodos para ayudar al diseñador de sistemas críticos en su tarea de desarrollo de diseños robustos, validados y en tiempo adaptados a su aplicación.[CA] La rellevància que l'electrònica adquireix en la seguretat dels productes ha crescut inexorablement, puix cada volta més aquesta abasta una major influència en la funcionalitat dels mateixos. Però, per descomptat, aquest fet ve acompanyat d'un constant necessitat de majors prestacions per acomplir els requeriments funcionals, mentre es mantenen els costos i consums en uns nivells reduïts. Donat aquest escenari, la indústria està fent esforços per proveir una tecnologia que complisca amb totes les especificacions de potència, consum i preu, tot a costa d'un increment en la vulnerabilitat a diversos tipus de fallades conegudes, i a la introducció de nous tipus. Per oferir una solució a les noves i creixents fallades als sistemes, els dissenyadors han recorregut a tècniques tradicionalment associades a sistemes crítics per a la seguretat, que en general oferixen resultats sub-òptims. De fet, les arquitectures empotrades modernes oferixen la possibilitat d'optimitzar les propietats de confiabilitat en habilitar la interacció dels nivells de hardware, firmware i software en el procés. Tot i això eixe punt no està resolt encara. Es necessiten avanços a tots els nivells en l'esmentada direcció per poder assolir els objectius d'una tolerància a fallades flexible, robusta, resilient i a baix cost. El treball ací presentat se centra en el nivell de hardware, amb la consideració de fons d'una potencial integració en una estratègia holística. Els esforços d'esta tesi s'han centrat en els següents aspectes: (i) la introducció de models de fallada addicionals requerits per a la representació adequada d'efectes físics que apareixen en les tecnologies de fabricació actuals, (ii) la provisió de ferramentes i mètodes per a la injecció eficient del models proposats i dels clàssics, (iii) l'anàlisi del mètode òptim per estudiar la robustesa de sistemes mitjançant l'ús d'injecció de fallades extensiva, i la posterior correlació amb capes de més alt nivell en un esforç per retallar el temps i cost de desenvolupament, (iv) la provisió de nous mètodes de detecció per cobrir els reptes plantejats pels models de fallades proposats, (v) la proposta d'estratègies de mitigació enfocades cap al tractament dels esmentats escenaris d'amenaça i (vi) la introducció d'una metodologia automatitzada de desplegament de diversos mecanismes de tolerància a fallades de forma robusta i sistemàtica. Els resultats de la present tesi constitueixen un conjunt de ferramentes i mètodes per ajudar el dissenyador de sistemes crítics en la seua tasca de desenvolupament de dissenys robustos, validats i a temps adaptats a la seua aplicació.Espinosa García, J. (2016). New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/73146TESISCompendi

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits

A Behavioral Model of a Built-in Current Sensor for IDDQ Testing

IDDQ testing is one of the most effective methods for detecting defects in integrated circuits. Higher leakage currents in more advanced semiconductor technologies have reduced the resolution of IDDQ test. One solution is to use built-in current sensors. Several sensor techniques for measuring the current based on the magnetic field or voltage drop across the supply line have been proposed. In this work, we develop a behavioral model for a built-in current sensor measuring voltage drop and use this model to better understand sensor operation, identify the effect of different parameters on sensor resolution, and suggest design modifications to improve future sensor performance

Learning digital test and diagnostics via Internet

An environment targeted to e-learning is presented for teaching design and test of electronic systems. The environment consists of a set of Java applets, and of web based access to the hardware equipments, which can be used in the classroom, for learning at home, in laboratory research and training, or for carrying out testing of students during exams. The tools support university courses on digital electronics, computer hardware, testing and design for testability to learn by hands-on exercises how to design digital systems, how to make them testable, how to build self-testing systems, how to generate test patterns, how to analyze the quality of tests, and how to localize faults in hardware. The tasks chosen for hands-on training represent simultaneously research problems, which allow to fostering in students critical thinking, problem solving skills and creativity

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification