Visual Inspection System To Detect Connector Tilts In PCBAs [TS156. V844 2005 f rb] [Microfiche 7845].

Sistem pemeriksaan visual automatic memainkan peranan penting dalam bahagian tapisan kualiti di industri eletronik. AVI’s are playing important roles in quality inspection in the electronic industry

A Hierarchical, Fuzzy Inference Approach to Data Filtration and Feature Prioritization in the Connected Manufacturing Enterprise

The current big data landscape is one such that the technology and capability to capture and storage of data has preceded and outpaced the corresponding capability to analyze and interpret it. This has led naturally to the development of elegant and powerful algorithms for data mining, machine learning, and artificial intelligence to harness the potential of the big data environment. A competing reality, however, is that limitations exist in how and to what extent human beings can process complex information. The convergence of these realities is a tension between the technical sophistication or elegance of a solution and its transparency or interpretability by the human data scientist or decision maker. This dissertation, contextualized in the connected manufacturing enterprise, presents an original Fuzzy Approach to Feature Reduction and Prioritization (FAFRAP) approach that is designed to assist the data scientist in filtering and prioritizing data for inclusion in supervised machine learning models. A set of sequential filters reduces the initial set of independent variables, and a fuzzy inference system outputs a crisp numeric value associated with each feature to rank order and prioritize for inclusion in model training. Additionally, the fuzzy inference system outputs a descriptive label to assist in the interpretation of the feature’s usefulness with respect to the problem of interest. Model testing is performed using three publicly available datasets from an online machine learning data repository and later applied to a case study in electronic assembly manufacture. Consistency of model results is experimentally verified using Fisher’s Exact Test, and results of filtered models are compared to results obtained by the unfiltered sets of features using a proposed novel metric of performance-size ratio (PSR)

Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics

The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for ‘power-by-the-hour’ commercial aircraft operation business models. [Continues.

Visual Inspection System To Detect Connector Tilts In Pcbas

Sistem pemeriksaan visual automatic memainkan peranan penting dalam bahagian tapisan kualiti di industri eletronik. AVI’s are playing important roles in quality inspection in the electronic industry

Acoustic Emission Monitoring of Prefabricated and Prestressed Reinforced Concrete Bridge Elements and Structures

Prefabricated and pre-stressed reinforced concrete beams and girders are integral components of many highway structures, including those build by rapid construction techniques. Concerns exist regarding the development of cracks during curing, form removal, detensioning, transport, installation, and operation. Non-destructive, Acoustic Emission (AE) sensing techniques have the potential for detecting and locating cracking in prefabricated, prestressed concrete girders used as Prefabricated Bridge Elements and Systems (PBES) in rapid construction practices as part of a Quality Assurance/Quality Control (QA/QC) program. AE sensing records transient elastic waves produced by the release of stored elastic energy resulting in plastic deformations (i.e., crack nucleation and growth) with an array of point sensors. The AE instrument system is relatively portable which can allow for it to be an option for both off-site fabrication QA/QC as well as on-site field QA/QC. This report presents a multi-stage research initiative on acoustic emission measurements of prefabricated and pre-stressed concrete beams used in highway bridge construction during detensioning, craned removal from formwork and transport to bridge sites, along with supporting laboratory tests and numerical analysis. The project objectives are: 1. Identify suitable instruments to monitor pre-stressed and/or post-tensioned concrete girders for cracking activity; 2. Design and develop a reusable instrumentation package; 3. Measure performance and condition of concrete girders during fabrication and transport; 4. Identify test protocols and possible accept/fix/reject criteria for structural elements based on information from monitoring system; and 5. Develop plans for reusing monitoring instruments on multiple bridge projects. Presented are results from laboratory, full-scale girder fabrication, and transport monitoring, along with recommendations for future testing procedures and quality assurance protocol development

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.Framework of the IQONIC Project; European Union’s Horizon 2020 Research and Innovation Program

Development of a Rapid Fatigue Life Testing Method for Reliability Assessment of Flip-Chip Solder Interconnects

The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability at high frequency (60 cycles/minute) with the first being a single-directional unit capable of exerting large forces (up to 20 N) on solder interconnects in one direction. The second test stand was developed to allow for bi-directional application of stress and the integration of an oven to enable testing at elevated steady-state temperatures. Given the high frequency of testing, elevated temperatures are used to emulate the effects of creep on solder fatigue lifetime. Utilizing the mechanical force of springs to apply shear loads to solder interconnects within the devices, the reliability of a given device to withstand repeated cycling was studied using resistance monitoring techniques to detect the number of cycles-to-failure (CTF). Resistance monitoring was performed using specially designed and fabricated, device analogous test vehicles assembled with the ability to monitor circuit resistance in situ. When a resistance rise of 30 % was recorded, the device was said to have failed. A mathematical method for quantifying the plastic work density (amount of damage) sustained by the solder interconnects prior to failure was developed relying on the relationship between Hooke’s Law for springs and damage deflection to accurately assess the mechanical strength of tested devices