SoC Test: Trends and Recent Standards

The well-known approaching test cost crisis, where semiconductor test costs begin to approach or exceed manufacturing costs has led test engineers to apply new solutions to the problem of testing System-On-Chip (SoC) designs containing multiple IP (Intellectual Property) cores. While it is not yet possible to apply generic test architectures to an IP core within a SoC, the emergence of a number of similar approaches, and the release of new industry standards, such as IEEE 1500 and IEEE 1450.6, may begin to change this situation. This paper looks at these standards and at some techniques currently used by SoC test engineers. An extensive reference list is included, reflecting the purpose of this publication as a review paper

A FPGA-Based Reconfigurable Software Architecture for Highly Dependable Systems

Nowadays, systems-on-chip are commonly equipped with reconfigurable hardware. The use of hybrid architectures based on a mixture of general purpose processors and reconfigurable components has gained importance across the scientific community allowing a significant improvement of computational performance. Along with the demand for performance, the great sensitivity of reconfigurable hardware devices to physical defects lead to the request of highly dependable and fault tolerant systems. This paper proposes an FPGA-based reconfigurable software architecture able to abstract the underlying hardware platform giving an homogeneous view of it. The abstraction mechanism is used to implement fault tolerance mechanisms with a minimum impact on the system performanc

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification

Training Multilayer Perceptron with Genetic Algorithms and Particle Swarm Optimization for Modeling Stock Price Index Prediction

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DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

On-Chip Analog Circuit Design Using Built-In Self-Test and an Integrated Multi-Dimensional Optimization Platform

Nowadays, the rapid development of system-on-chip (SoC) market introduces tremendous complexity into the integrated circuit (IC) design. Meanwhile, the IC fabrication process is scaling down to allow higher density of integration but makes the chips more sensitive to the process-voltage-temperature (PVT) variations. A successful IC product not only imposes great pressure on the IC designers, who have to handle wider variations and enforce more design margins, but also challenges the test procedure, leading to more check points and longer test time. To relax the designers’ burden and reduce the cost of testing, it is valuable to make the IC chips able to test and tune itself to some extent. In this dissertation, a fully integrated in-situ design validation and optimization (VO) hardware for analog circuits is proposed. It implements in-situ built-in self-test (BIST) techniques for analog circuits. Based on the data collected from BIST, the error between the measured and the desired performance of the target circuit is evaluated using a cost function. A digital multi-dimensional optimization engine is implemented to adaptively adjust the analog circuit parameters, seeking the minimum value of the cost function and achieving the desired performance. To verify this concept, study cases of a 2nd/4th active-RC band-pass filter (BPF) and a 2nd order Gm-C BPF, as well as all BIST and optimization blocks, are adopted on-chip. Apart from the VO system, several improved BIST techniques are also proposed in this dissertation. A single-tone sinusoidal waveform generator based on a finite-impulse-response (FIR) architecture, which utilizes an optimization algorithm to enhance its spur free dynamic range (SFDR), is proposed. It achieves an SFDR of 59 to 70 dBc from 150 to 850 MHz after the optimization procedure. A low-distortion current-steering two-tone sinusoidal signal synthesizer based on a mixing-FIR architecture is also proposed. The two-tone synthesizer extends the FIR architecture to two stages and implements an up-conversion mixer to generate the two tones, achieving better than -68 dBc IM3 below 480 MHz LO frequency without calibration. Moreover, an on-chip RF receiver linearity BIST methodology for continuous and discrete-time hybrid baseband chain is proposed. The proposed receiver chain implements a charge-domain FIR filter to notch the two excitation signals but expose the third order intermodulation (IM3) tones. It simplifies the linearity measurement procedure–using a power detector is enough to analyze the receiver’s linearity. Finally, a low cost fully digital built-in analog tester for linear-time-invariant (LTI) analog blocks is proposed. It adopts a time-to-digital converter (TDC) to measure the delays corresponded to a ramp excitation signal and is able to estimate the pole or zero locations of a low-pass LTI system

Software-Based Self-Test of Set-Associative Cache Memories

Embedded microprocessor cache memories suffer from limited observability and controllability creating problems during in-system tests. This paper presents a procedure to transform traditional march tests into software-based self-test programs for set-associative cache memories with LRU replacement. Among all the different cache blocks in a microprocessor, testing instruction caches represents a major challenge due to limitations in two areas: 1) test patterns which must be composed of valid instruction opcodes and 2) test result observability: the results can only be observed through the results of executed instructions. For these reasons, the proposed methodology will concentrate on the implementation of test programs for instruction caches. The main contribution of this work lies in the possibility of applying state-of-the-art memory test algorithms to embedded cache memories without introducing any hardware or performance overheads and guaranteeing the detection of typical faults arising in nanometer CMOS technologie

Memory built-in self-repair and correction for improving yield: a review

Nanometer memories are highly prone to defects due to dense structure, necessitating memory built-in self-repair as a must-have feature to improve yield. Today’s system-on-chips contain memories occupying an area as high as 90% of the chip area. Shrinking technology uses stricter design rules for memories, making them more prone to manufacturing defects. Further, using 3D-stacked memories makes the system vulnerable to newer defects such as those coming from through-silicon-vias (TSV) and micro bumps. The increased memory size is also resulting in an increase in soft errors during system operation. Multiple memory repair techniques based on redundancy and correction codes have been presented to recover from such defects and prevent system failures. This paper reviews recently published memory repair methodologies, including various built-in self-repair (BISR) architectures, repair analysis algorithms, in-system repair, and soft repair handling using error correcting codes (ECC). It provides a classification of these techniques based on method and usage. Finally, it reviews evaluation methods used to determine the effectiveness of the repair algorithms. The paper aims to present a survey of these methodologies and prepare a platform for developing repair methods for upcoming-generation memories