1,977 research outputs found

    New Structure of Test Pattern Generator Stimulating Crosstalks in Bus-type Connections

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    The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of crosstalk faults that may happen to bus-type interconnections between built-in blocks within a System on a Chip structure. The new idea is an improvement of the TPG design proposed by the author in one of previous studies. The TPG circuit is meant to generate test sequences that guarantee detection of all crosstalk faults with the capacitance nature that may occur between individual lines within an interconnecting bus. The study comprises a synthesizable and parameterized model developed for the presented TPG in the VLSI Hardware Description Language (VHDL) with further investigation of properties and features of the offered module. The significant advantages of the proposed TPG structure include less area occupied on a chip and higher operation frequency as compared to other solutions. In addition, the design demonstrates good scalability in terms of both the hardware overhead and the length of the generated test sequence

    Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

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    Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

    A fault-tolerant multiprocessor architecture for aircraft, volume 1

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    A fault-tolerant multiprocessor architecture is reported. This architecture, together with a comprehensive information system architecture, has important potential for future aircraft applications. A preliminary definition and assessment of a suitable multiprocessor architecture for such applications is developed

    Avionics architecture studies for the entry research vehicle

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    This report is the culmination of a year-long investigation of the avionics architecture for NASA's Entry Research Vehicle (ERV). The Entry Research Vehicle is conceived to be an unmanned, autonomous spacecraft to be deployed from the Shuttle. It will perform various aerodynamic and propulsive maneuvers in orbit and land at Edwards AFB after a 5 to 10 hour mission. The design and analysis of the vehicle's avionics architecture are detailed here. The architecture consists of a central triply redundant ultra-reliable fault tolerant processor attached to three replicated and distributed MIL-STD-1553 buses for input and output. The reliability analysis is detailed here. The architecture was found to be sufficiently reliable for the ERV mission plan

    A Hardware Security Solution against Scan-Based Attacks

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    Scan based Design for Test (DfT) schemes have been widely used to achieve high fault coverage for integrated circuits. The scan technique provides full access to the internal nodes of the device-under-test to control them or observe their response to input test vectors. While such comprehensive access is highly desirable for testing, it is not acceptable for secure chips as it is subject to exploitation by various attacks. In this work, new methods are presented to protect the security of critical information against scan-based attacks. In the proposed methods, access to the circuit containing secret information via the scan chain has been severely limited in order to reduce the risk of a security breach. To ensure the testability of the circuit, a built-in self-test which utilizes an LFSR as the test pattern generator (TPG) is proposed. The proposed schemes can be used as a countermeasure against side channel attacks with a low area overhead as compared to the existing solutions in literature

    A Multi-layer Fpga Framework Supporting Autonomous Runtime Partial Reconfiguration

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    Partial reconfiguration is a unique capability provided by several Field Programmable Gate Array (FPGA) vendors recently, which involves altering part of the programmed design within an SRAM-based FPGA at run-time. In this dissertation, a Multilayer Runtime Reconfiguration Architecture (MRRA) is developed, evaluated, and refined for Autonomous Runtime Partial Reconfiguration of FPGA devices. Under the proposed MRRA paradigm, FPGA configurations can be manipulated at runtime using on-chip resources. Operations are partitioned into Logic, Translation, and Reconfiguration layers along with a standardized set of Application Programming Interfaces (APIs). At each level, resource details are encapsulated and managed for efficiency and portability during operation. An MRRA mapping theory is developed to link the general logic function and area allocation information to the device related physical configuration level data by using mathematical data structure and physical constraints. In certain scenarios, configuration bit stream data can be read and modified directly for fast operations, relying on the use of similar logic functions and common interconnection resources for communication. A corresponding logic control flow is also developed to make the entire process autonomous. Several prototype MRRA systems are developed on a Xilinx Virtex II Pro platform. The Virtex II Pro on-chip PowerPC core and block RAM are employed to manage control operations while multiple physical interfaces establish and supplement autonomous reconfiguration capabilities. Area, speed and power optimization techniques are developed based on the developed Xilinx prototype. Evaluations and analysis of these prototype and techniques are performed on a number of benchmark and hashing algorithm case studies. The results indicate that based on a variety of test benches, up to 70% reduction in the resource utilization, up to 50% improvement in power consumption, and up to 10 times increase in run-time performance are achieved using the developed architecture and approaches compared with Xilinx baseline reconfiguration flow. Finally, a Genetic Algorithm (GA) for a FPGA fault tolerance case study is evaluated as a ultimate high-level application running on this architecture. It demonstrated that this is a hardware and software infrastructure that enables an FPGA to dynamically reconfigure itself efficiently under the control of a soft microprocessor core that is instantiated within the FPGA fabric. Such a system contributes to the observed benefits of intelligent control, fast reconfiguration, and low overhead

    Toward Fault-Tolerant Applications on Reconfigurable Systems-on-Chip

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    L'abstract è presente nell'allegato / the abstract is in the attachmen

    Intermittent fault diagnosis and health monitoring for electronic interconnects

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    Literature survey and correspondence with industrial sector shows that No-Fault-Found (NFF) is a major concern in through life engineering services, especially for defence, aerospace, and other transport industry. There are various occurrences and root causes that result in NFF events but intermittent interconnections are the most frustrating. This is because it disappears while testing, and missed out by diagnostic equipment. This thesis describes the challenging and most important area of intermittent fault detection and health monitoring that focuses towards NFF situation in electronics interconnections. After introduction, this thesis starts with literature survey and describes financial impact on aerospace and other transport industry. It highlights NFF technologies and discuss different facts and their impact on NFF. Then It goes into experimental study that how repeatedly intermittent fault could be replicated. It describes a novel fault replicator that can generate repeatedly IFs for further experimental study on diagnosis techniques/algorithms. The novel IF replicator provide for single and multipoint intermittent connection. The experimental work focuses on mechanically induced intermittent conditions in connectors. This work illustrates a test regime that can be used to repeatedly reproduce intermittency in electronic connectors whilst subjected to vibration ... [cont.]

    Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

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    With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

    Design-for-delay-testability techniques for high-speed digital circuits

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    The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important
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