Worst-Case Analysis of Electrical and Electronic Equipment via Affine Arithmetic

In the design and fabrication process of electronic equipment, there are many unkown parameters which significantly affect the product performance. Some uncertainties are due to manufacturing process fluctuations, while others due to the environment such as operating temperature, voltage, and various ambient aging stressors. It is desirable to consider these uncertainties to ensure product performance, improve yield, and reduce design cost. Since direct electromagnetic compatibility measurements impact on both cost and time-to-market, there has been a growing demand for the availability of tools enabling the simulation of electrical and electronic equipment with the inclusion of the effects of system uncertainties. In this framework, the assessment of device response is no longer regarded as deterministic but as a random process. It is traditionally analyzed using the Monte Carlo or other sampling-based methods. The drawback of the above methods is large number of required samples to converge, which are time-consuming for practical applications. As an alternative, the inherent worst-case approaches such as interval analysis directly provide an estimation of the true bounds of the responses. However, such approaches might provide unnecessarily strict margins, which are very unlikely to occur. A recent technique, affine arithmetic, advances the interval based methods by means of handling correlated intervals. However, it still leads to over-conservatism due to the inability of considering probability information. The objective of this thesis is to improve the accuracy of the affine arithmetic and broaden its application in frequency-domain analysis. We first extend the existing literature results to the efficient time-domain analysis of lumped circuits considering the uncertainties. Then we provide an extension of the basic affine arithmetic to the frequency-domain simulation of circuits. Classical tools for circuit analysis are used within a modified affine framework accounting for complex algebra and uncertainty interval partitioning for the accurate and efficient computation of the worst case bounds of the responses of both lumped and distributed circuits. The performance of the proposed approach is investigated through extensive simulations in several case studies. The simulation results are compared with the Monte Carlo method in terms of both simulation time and accuracy

Design of complex integrated systems based on networks-on-chip: Trading off performance, power and reliability

The steady advancement of microelectronics is associated with an escalating number of challenges for design engineers due to both the tiny dimensions and the enormous complexity of integrated systems. Against this background, this work deals with Network-On-Chip (NOC) as the emerging design paradigm to cope with diverse issues of nanotechnology. The detailed investigations within the chapters focus on the communication-centric aspects of multi-core-systems, whereas performance, power consumption as well as reliability are considered likewise as the essential design criteria

Sub-10nm Transistors for Low Power Computing: Tunnel FETs and Negative Capacitance FETs

One of the major roadblocks in the continued scaling of standard CMOS technology is its alarmingly high leakage power consumption. Although circuit and system level methods can be employed to reduce power, the fundamental limit in the overall energy efficiency of a system is still rooted in the MOSFET operating principle: an injection of thermally distributed carriers, which does not allow subthreshold swing (SS) lower than 60mV/dec at room temperature. Recently, a new class of steep-slope devices like Tunnel FETs (TFETs) and Negative-Capacitance FETs (NCFETs) have garnered intense interest due to their ability to surpass the 60mV/dec limit on SS at room temperature. The focus of this research is on the simulation and design of TFETs and NCFETs for ultra-low power logic and memory applications. Using full band quantum mechanical model within the Non-Equilibrium Greens Function (NEGF) formalism, source-underlapping has been proposed as an effective technique to lower the SS in GaSb-InAs TFETs. Band-tail states, associated with heavy source doping, are shown to significantly degrade the SS in TFETs from their ideal value. To solve this problem, undoped source GaSb-InAs TFET in an i-i-n configuration is proposed. A detailed circuit-to-system level evaluation is performed to investigate the circuit level metrics of the proposed devices. To demonstrate their potential in a memory application, a 4T gain cell (GC) is proposed, which utilizes the low-leakage and enhanced drain capacitance of TFETs to realize a robust and long retention time GC embedded-DRAMs. The device/circuit/system level evaluation of proposed TFETs demonstrates their potential for low power digital applications. The second part of the thesis focuses on the design space exploration of hysteresis-free Negative Capacitance FETs (NCFETs). A cross-architecture analysis using HfZrOx ferroelectric (FE-HZO) integrated on bulk MOSFET, fully-depleted SOI-FETs, and sub-10nm FinFETs shows that FDSOI and FinFET configurations greatly benefit the NCFET performance due to their undoped body and improved gate-control which enables better capacitance matching with the ferroelectric. A low voltage NC-FinFET operating down to 0.25V is predicted using ultra-thin 3nm FE-HZO. Next, we propose one-transistor ferroelectric NOR type (Fe-NOR) non-volatile memory based on HfZrOx ferroelectric FETs (FeFETs). The enhanced drain-channel coupling in ultrashort channel FeFETs is utilized to dynamically modulate memory window of storage cells thereby resulting in simple erase-, program-and read-operations. The simulation analysis predicts sub-1V program/erase voltages in the proposed Fe-NOR memory array and therefore presents a significantly lower power alternative to conventional FeRAM and NOR flash memories