214 research outputs found
High-Speed Electronic Memories and Memory Subsystems
Memories have played a vital role in embedded system architectures over the years. A need for high-speed memory to be embedded with state-of-the-art embedded system to improve its performance is essential. This chapter focuses on the development of high-speed memories. The traditional static random access memory (SRAM) is first analyzed with its different variant in terms of static noise margin (SNM); these cells occupy a larger area as compared to dynamic random access memory (DRAM) cell, and hence, a comprehensive analysis of DRAM cell is then carried out in terms of power consumption, read and write access time, and retention time. A faster new design of P-3T1D DRAM cell is proposed which has about 50% faster reading time as compared to the traditional three-transistor DRAM cell. A complete layout of the structure is drawn along with its implementation in a practical 16-bit memory subsystem
Simulation of charge-trapping in nano-scale MOSFETs in the presence of random-dopants-induced variability
The growing variability of electrical characteristics is a major issue associated with continuous downscaling of contemporary bulk MOSFETs. In addition, the operating conditions brought about by these same scaling trends have pushed MOSFET degradation mechanisms such as Bias Temperature Instability (BTI) to the forefront as a critical reliability threat. This thesis investigates the impact of this ageing phenomena, in conjunction with device variability, on key MOSFET electrical parameters.
A three-dimensional drift-diffusion approximation is adopted as the simulation approach in this work, with random dopant fluctuations—the dominant source of statistical variability—included in the simulations. The testbed device is a realistic 35 nm physical gate length n-channel conventional bulk MOSFET. 1000 microscopically different implementations of the transistor are simulated and subjected to charge-trapping at the oxide interface. The statistical simulations reveal relatively rare but very large threshold voltage shifts, with magnitudes over 3 times than that predicted by the conventional theoretical approach. The physical origin of this effect is investigated in terms of the electrostatic influences of the random dopants and trapped charges on the channel electron concentration. Simulations with progressively increased trapped charge densities—emulating the characteristic condition of BTI degradation—result in further variability of the threshold voltage distribution. Weak correlations of the order of 10-2 are found between the pre-degradation threshold voltage and post-degradation threshold voltage shift distributions.
The importance of accounting for random dopant fluctuations in the simulations is emphasised in order to obtain qualitative agreement between simulation results and published experimental measurements. Finally, the information gained from these device-level physical simulations is integrated into statistical compact models, making the information available to circuit designers
Design of High Performance SRAM Based Memory Chip
The semiconductor memory SRAM uses bi-stable latch circuit to store the logic data 1 or 0. It differs from Dynamic RAM (DRAM) which needs periodic refreshment operation for the storage of logic data. Depending upon the frequency of operation SRAM power consumption varies i.e. it consumes very high power at higher frequencies like DRAM. The Cache memory present in the microprocessor needs high speed memory hence SRAM can be used for that purpose in microprocessors. The DRAM is normally used in the Main memory of processors, where importance is given to the density than its speed. The SRAM is also used in industrial subsystems, scientific and automotive electronics. In this thesis 16-Kb Memory is designed by using memory banking method in UMC 90nm technology ,which operates at a frequency of 1GHz.The post layout simulation for the complete design is performed and also obtained power analysis for the overall design. All peripherals like pre-charge, Row Decoder, Word line driver, Sense amplifier, Column Decoder/Mux and write driver are designed and layouts of all the above peripherals also drawn in an optimised manner such that their layout occupies minimum area. The 6T SRAM cell is designed with operating frequency of 8 GHz and stability analysis are also performed for single SRAM cell. The layout of Single SRAM cell is drawn in a symmetric manner, such that two adjacent cells can share same contact, which results reduction in the area of cell layout. The Static Noise Margin, Read noise margin and Write Noise Margin of single cell are found to be 240mV, 115mV and 425mV respectively for a supply voltage of 1V.The effect of pull-up ratio and cell ratio on the stability of SRAM cell is observed
Statistical circuit simulations - from ‘atomistic’ compact models to statistical standard cell characterisation
This thesis describes the development and application of statistical circuit simulation methodologies to analyse digital circuits subject to intrinsic parameter fluctuations. The specific nature of intrinsic parameter fluctuations are discussed, and we explain the crucial importance to the semiconductor industry of developing design tools which accurately account for their effects. Current work in the area is reviewed, and three important factors are made clear: any statistical circuit simulation methodology must be based on physically correct, predictive models of device variability; the statistical compact models describing device operation must be characterised for accurate transient analysis of circuits; analysis must be carried out on realistic circuit components. Improving on previous efforts in the field, we posit a statistical circuit simulation methodology which accounts for all three of these factors. The established 3-D Glasgow atomistic simulator is employed to predict electrical characteristics for devices aimed at digital circuit applications, with gate lengths from 35 nm to 13 nm. Using these electrical characteristics, extraction of BSIM4 compact models is carried out and their accuracy in performing transient analysis using SPICE is validated against well characterised mixed-mode TCAD simulation results for 35 nm devices. Static d.c. simulations are performed to test the methodology, and a useful analytic model to predict hard logic fault limitations on CMOS supply voltage scaling is derived as part of this work. Using our toolset, the effect of statistical variability introduced by random discrete dopants on the dynamic behaviour of inverters is studied in detail. As devices scaled, dynamic noise margin variation of an inverter is increased and higher output load or input slew rate improves the noise margins and its variation. Intrinsic delay variation based on CV/I delay metric is also compared using ION and IEFF definitions where the best estimate is obtained when considering ION and input transition time variations. Critical delay distribution of a path is also investigated where it is shown non-Gaussian. Finally, the impact of the cell input slew rate definition on the accuracy of the inverter cell timing characterisation in NLDM format is investigated
myCACTI: A new cache design tool for pipelined nanometer caches
TThe presence of caches in microprocessors has always been one of the most
important techniques in bridging the memory wall, or the speed gap between the
microprocessor and main memory. This importance is continuously increasing
especially as we enter the regime of nanometer process technologies (i.e. 90nm
and below), as industry has favored investing a larger and larger fraction of a
chip.s transistor budget to improving the on-chip cache. This is the case in
practice, as it has proven to be an efficient way to utilize the increasing
number of transistors available with each succeeding technology. Consequently,
it becomes even more important to have cache design tools that give accurate
representations of designs that exist in actual microprocessors.
The prevalent cache design tools that are the most widely used in academe are
CACTI [Wilton1996] and eCACTI [Mamidipaka2004], and these have proven to be very
useful tools not just for cache designers, but also for computer architects.
This dissertation will show that both CACTI and eCACTI still contain major
limitations and even flaws in their design, making them unsuitable for use in
very-deep submicron and nanometer caches, especially pipelined designs. These
limitations and flaws will be discussed in detail.
This dissertation then introduces a new tool, called myCACTI, that addresses all
these limitations and, in addition, introduces major enhancements to the
simulation framework.
This dissertation then demonstrates the use of myCACTI in the cache design
process. Detailed design space explorations are done on multiple cache
configurations to produce pareto optimal curves of the caches to show optimal
implementations. Detailed studies are also performed to characterize the delay
and power dissipation of different cache configurations and implementations.
Finally, future directions to the development of myCACTI are identified to show
possible ways that the tool can be improved in such a way as to allow even more
different kinds of studies to be performed
A Study of Nanometer Semiconductor Scaling Effects on Microelectronics Reliability
The desire to assess the reliability of emerging scaled microelectronics technologies through faster reliability trials and more accurate acceleration models is the precursor for further research and experimentation in this relevant field. The effect of semiconductor scaling on microelectronics product reliability is an important aspect to the high reliability application user. From the perspective of a customer or user, who in many cases must deal with very limited, if any, manufacturer's reliability data to assess the product for a highly-reliable application, product-level testing is critical in the characterization and reliability assessment of advanced nanometer semiconductor scaling effects on microelectronics reliability. This dissertation provides a methodology on how to accomplish this and provides techniques for deriving the expected product-level reliability on commercial memory products.
Competing mechanism theory and the multiple failure mechanism model are applied to two separate experiments; scaled SRAM and SDRAM products. Accelerated stress testing at multiple conditions is applied at the product level of several scaled memory products to assess the performance degradation and product reliability. Acceleration models are derived for each case. For several scaled SDRAM products, retention time degradation is studied and two distinct soft error populations are observed with each technology generation: early breakdown, characterized by randomly distributed weak bits with Weibull slope Beta=1, and a main population breakdown with an increasing failure rate. Retention time soft error rates are calculated and a multiple failure mechanism acceleration model with parameters is derived for each technology. Defect densities are calculated and reflect a decreasing trend in the percentage of random defective bits for each successive product generation.
A normalized soft error failure rate of the memory data retention time in FIT/Gb and FIT/cm2 for several scaled SDRAM generations is presented revealing a power relationship. General models describing the soft error rates across scaled product generations are presented. The analysis methodology may be applied to other scaled microelectronic products and key parameters
Robust Design of Variation-Sensitive Digital Circuits
The nano-age has already begun, where typical feature dimensions are smaller than 100nm. The operating frequency is expected to increase up to
12 GHz, and a single chip will contain over 12 billion transistors in 2020, as given by the International Technology Roadmap for Semiconductors
(ITRS) initiative. ITRS also predicts that the scaling of CMOS devices and process technology, as it is known today, will become much more
difficult as the industry advances towards the 16nm technology node and further. This aggressive scaling of CMOS technology has pushed the
devices to their physical limits. Design goals are governed by several factors other than power, performance and area such as process
variations, radiation induced soft errors, and aging degradation mechanisms. These new design challenges have a strong impact on the parametric
yield of nanometer digital circuits and also result in functional yield losses in variation-sensitive digital circuits such as Static Random
Access Memory (SRAM) and flip-flops. Moreover, sub-threshold SRAM and flip-flops circuits, which are aggravated by the strong demand for lower
power consumption, show larger sensitivity to these challenges which reduces their robustness and yield. Accordingly, it is not surprising that
the ITRS considers variability and reliability as the most challenging obstacles for nanometer digital circuits robust design.
Soft errors are considered one of the main reliability and robustness concerns in SRAM arrays in sub-100nm technologies due to low operating
voltage, small node capacitance, and high packing density. The SRAM arrays soft errors immunity is also affected by process variations. We
develop statistical design-oriented soft errors immunity variations models for super-threshold and sub-threshold SRAM cells accounting for
die-to-die variations and within-die variations. This work provides new design insights and highlights the important design knobs that can be
used to reduce the SRAM cells soft errors immunity variations. The developed models are scalable, bias dependent, and only require the
knowledge of easily measurable parameters. This makes them useful in early design exploration, circuit optimization as well as technology
prediction. The derived models are verified using Monte Carlo SPICE simulations, referring to an industrial hardware-calibrated 65nm CMOS
technology.
The demand for higher performance leads to very deep pipelining which means that hundreds of thousands of flip-flops are required to control
the data flow under strict timing constraints. A violation of the timing constraints at a flip-flop can result in latching incorrect data
causing the overall system to malfunction. In addition, the flip-flops power dissipation represents a considerable fraction of the total power
dissipation. Sub-threshold flip-flops are considered the most energy efficient solution for low power applications in which, performance is of
secondary importance. Accordingly, statistical gate sizing is conducted to different flip-flops topologies for timing yield improvement of
super-threshold flip-flops and power yield improvement of sub-threshold flip-flops. Following that, a comparative analysis between these
flip-flops topologies considering the required overhead for yield improvement is performed. This comparative analysis provides useful
recommendations that help flip-flops designers on selecting the best flip-flops topology that satisfies their system specifications while
taking the process variations impact and robustness requirements into account.
Adaptive Body Bias (ABB) allows the tuning of the transistor threshold voltage, Vt, by controlling the transistor body voltage. A forward
body bias reduces Vt, increasing the device speed at the expense of increased leakage power. Alternatively, a reverse body bias increases
Vt, reducing the leakage power but slowing the device. Therefore, the impact of process variations is mitigated by speeding up slow and
less leaky devices or slowing down devices that are fast and highly leaky. Practically, the implementation of the ABB is desirable to bias each
device in a design independently, to mitigate within-die variations. However, supplying so many separate voltages inside a die results in a
large area overhead. On the other hand, using the same body bias for all devices on the same die limits its capability to compensate for
within-die variations. Thus, the granularity level of the ABB scheme is a trade-off between the within-die variations compensation capability
and the associated area overhead. This work introduces new ABB circuits that exhibit lower area overhead by a factor of 143X than that of
previous ABB circuits. In addition, these ABB circuits are resolution free since no digital-to-analog converters or analog-to-digital
converters are required on their implementations. These ABB circuits are adopted to high performance critical paths, emulating a real
microprocessor architecture, for process variations compensation and also adopted to SRAM arrays, for Negative Bias Temperature Instability
(NBTI) aging and process variations compensation. The effectiveness of the new ABB circuits is verified by post layout simulation results and
test chip measurements using triple-well 65nm CMOS technology.
The highly capacitive nodes of wide fan-in dynamic circuits and SRAM bitlines limit the performance of these circuits. In addition, process
variations mitigation by statistical gate sizing increases this capacitance further and fails in achieving the target yield improvement. We
propose new negative capacitance circuits that reduce the overall parasitic capacitance of these highly capacitive nodes. These negative
capacitance circuits are adopted to wide fan-in dynamic circuits for timing yield improvement up to 99.87% and to SRAM arrays for read access
yield improvement up to 100%. The area and power overheads of these new negative capacitance circuits are amortized over the large die area of
the microprocessor and the SRAM array. The effectiveness of the new negative capacitance circuits is verified by post layout simulation results
and test chip measurements using 65nm CMOS technology
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IC design for reliability
textAs the feature size of integrated circuits goes down to the nanometer scale,
transient and permanent reliability issues are becoming a significant concern for circuit
designers. Traditionally, the reliability issues were mostly handled at the device level as a
device engineering problem. However, the increasing severity of reliability challenges
and higher error rates due to transient upsets favor higher-level design for reliability
(DFR). In this work, we develop several methods for DFR at the circuit level.
A major source of transient errors is the single event upset (SEU). SEUs are
caused by high-energy particles present in the cosmic rays or emitted by radioactive
contaminants in the chip packaging materials. When these particles hit a N+/P+ depletion
region of an MOS transistor, they may generate a temporary logic fault. Depending on
where the MOS transistor is located and what state the circuit is at, an SEU may result in
a circuit-level error. We analyze SEUs both in combinational logic and memories
(SRAM). For combinational logic circuit, we propose FASER, a Fast Analysis tool of
Soft ERror susceptibility for cell-based designs. The efficiency of FASER is achieved
through its static and vector-less nature. In order to evaluate the impact of SEU on SRAM, a theory for estimating dynamic noise margins is developed analytically. The
results allow predicting the transient error susceptibility of an SRAM cell using a closedform
expression.
Among the many permanent failure mechanisms that include time-dependent
oxide breakdown (TDDB), electro-migration (EM), hot carrier effect (HCE), and
negative bias temperature instability (NBTI), NBTI has recently become important.
Therefore, the main focus of our work is NBTI. NBTI occurs when the gate of PMOS is
negatively biased. The voltage stress across the gate generates interface traps, which
degrade the threshold voltage of PMOS. The degraded PMOS may eventually fail to meet
timing requirement and cause functional errors. NBTI becomes severe at elevated
temperatures. In this dissertation, we propose a NBTI degradation model that takes into
account the temperature variation on the chip and gives the accurate estimation of the
degraded threshold voltage.
In order to account for the degradation of devices, traditional design methods add
guard-bands to ensure that the circuit will function properly during its lifetime. However,
the worst-case based guard-bands lead to significant penalty in performance. In this
dissertation, we propose an effective macromodel-based reliability tracking and
management framework, based on a hybrid network of on-chip sensors, consisting of
temperature sensors and ring oscillators. The model is concerned specifically with NBTIinduced
transistor aging. The key feature of our work, in contrast to the traditional
tracking techniques that rely solely on direct measurement of the increase of threshold
voltage or circuit delay, is an explicit macromodel which maps operating temperature to
circuit degradation (the increase of circuit delay). The macromodel allows for costeffective
tracking of reliability using temperature sensors and is also essential for
enabling the control loop of the reliability management system. The developed methods improve the over-conservatism of the device-level, worstcase
reliability estimation techniques. As the severity of reliability challenges continue to
grow with technology scaling, it will become more important for circuit designers/CAD
tools to be equipped with the developed methods.Electrical and Computer Engineerin
An Optimization of 16×16 SRAM Array for Low Power Applications
SRAM being Robust and having less read and write operation time is intended to use as a cache memory which oblige low power utilization. Low power SRAM outline is critical because it takes a vast division of aggregate power and pass on region in superior processors. A SRAM cell must meet the prerequisites for the operation in submicron/nano ranges. The scaling of CMOS innovation has critical effects on SRAM cell – arbitrary variance of electrical qualities and significant leakage current. The paper introduces the configuration of 16×16 SRAM array design including row decoders/drivers, column circuitry, sense amplifiers, pre charge circuitry and transmission gates utilizing Cadence tools in a unique way and its functionality is analyzed properly
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