193 research outputs found

    A design for testability study on a high performance automatic gain control circuit.

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    A comprehensive testability study on a commercial automatic gain control circuit is presented which aims to identify design for testability (DfT) modifications to both reduce production test cost and improve test quality. A fault simulation strategy based on layout extracted faults has been used to support the study. The paper proposes a number of DfT modifications at the layout, schematic and system levels together with testability. Guidelines that may well have generic applicability. Proposals for using the modifications to achieve partial self test are made and estimates of achieved fault coverage and quality levels presente

    Testing a CMOS operational amplifier circuit using a combination of oscillation and IDDQ test methods

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    This work presents a case study, which attempts to improve the fault diagnosis and testability of the oscillation testing methodology applied to a typical two-stage CMOS operational amplifier. The proposed test method takes the advantage of good fault coverage through the use of a simple oscillation based test technique, which needs no test signal generation and combines it with quiescent supply current (IDDQ) testing to provide a fault confirmation. A built in current sensor (BICS), which introduces insignificant performance degradation of the circuit-under-test (CUT), has been utilized to monitor the power supply quiescent current changes in the CUT. The testability has also been enhanced in the testing procedure using a simple fault-injection technique. The approach is attractive for its simplicity, robustness and capability of built-in-self test (BIST) implementation. It can also be generalized to the oscillation based test structures of other CMOS analog and mixed-signal integrated circuits. The practical results and simulations confirm the functionality of the proposed test method

    Analog Configurability-Test Scheme for an Embedded Op-Amp Module in TI MSP430 Microcontrollers

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    This paper proposes the application of the analog configurability test (ACT) approach for an embedded analog configurable circuit, composed by operational amplifiers and interconnection resources that are embedded in the MSP430xG461x microcontrollers family, with the aim of verifying its mode programmability. This test strategy is particularly useful for applications involving in-field circuit reconfiguration, and require reliability and safe operation characteristics. The approach minimizes the cost in hardware overhead by employing only the hardware and software resources of the microcontroller. An embedded test routine sequentially programs selected module configurations, sets the test stimulus, acquires data from the internal ADC, and performs required calculations to determine the gain of the block. The test approach is experimentally evaluated using an embedded-system based real application board. Our experimental results show very good repeatability, with very low errors. These results show that the ACT proposed here is useful for testing the functionality of the EACC under test in a real application context by using a simple strategy at a very low cost.Sociedad Argentina de Informática e Investigación Operativ

    Analog Configurability-Test Scheme for an Embedded Op-Amp Module in TI MSP430 Microcontrollers

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    This paper proposes the application of the analog configurability test (ACT) approach for an embedded analog configurable circuit, composed by operational amplifiers and interconnection resources that are embedded in the MSP430xG461x microcontrollers family, with the aim of verifying its mode programmability. This test strategy is particularly useful for applications involving in-field circuit reconfiguration, and require reliability and safe operation characteristics. The approach minimizes the cost in hardware overhead by employing only the hardware and software resources of the microcontroller. An embedded test routine sequentially programs selected module configurations, sets the test stimulus, acquires data from the internal ADC, and performs required calculations to determine the gain of the block. The test approach is experimentally evaluated using an embedded-system based real application board. Our experimental results show very good repeatability, with very low errors. These results show that the ACT proposed here is useful for testing the functionality of the EACC under test in a real application context by using a simple strategy at a very low cost.Sociedad Argentina de Informática e Investigación Operativ

    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

    Quiescent current testing of CMOS data converters

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    Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed

    Design-for-Test of Mixed-Signal Integrated Circuits

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    A re-configurable pipeline ADC architecture with built-in self-test techniques

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    High-performance analog and mixed-signal integrated circuits are integral parts of today\u27s and future networking and communication systems. The main challenge facing the semiconductor industry is the ability to economically produce these analog ICs. This translates, in part, into the need to efficiently evaluate the performance of such ICs during manufacturing (production testing) and to come up with dynamic architectures that enable the performance of these ICs to be maximized during manufacturing and later when they\u27re operating in the field. On the performance evaluation side, this dissertation deals with the concept of Built-In-Self-Test (BIST) to allow the efficient and economical evaluation of certain classes of high-performance analog circuits. On the dynamic architecture side, this dissertation deals with pipeline ADCs and the use of BIST to dynamically, during production testing or in the field, re-configure them to produce better performing ICs.;In the BIST system proposed, the analog test signal is generated on-chip by sigma-delta modulation techniques. The performance of the ADC is measured on-chip by a digital narrow-band filter. When this system is used on the wafer level, significant testing time and thus testing cost can be saved.;A re-configurable pipeline ADC architecture to improve the dynamic performance is proposed. Based on dynamic performance measurements, the best performance configuration is chosen from a collection of possible pipeline configurations. This basic algorithm can be applied to many pipeline analog systems. The proposed grouping algorithm cuts down the number of evaluation permutation from thousands to 18 for a 9-bit ADC thus allowing the method to be used in real applications.;To validate the developments of this dissertation, a 40MS/s 9-bit re-configurable pipeline ADC was designed and implemented in TSMC\u27s 0.25mum single-poly CMOS digital process. This includes a fully differential folded-cascode gain-boosting operational amplifier with high gain and high unity-gain bandwidth. The experimental results strongly support the effectiveness of reconfiguration algorithm, which provides an average of 0.5bit ENOB improvement among the set of configurations. For many applications, this is a very significant performance improvement.;The BIST and re-configurability techniques proposed are not limited to pipeline ADCs only. The BIST methodology is applicable to many analog systems and the re-configurability is applicable to any analog pipeline system

    On-line Testing Field Programmable Analog Array Circuits

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    This work presents an efficient methodology to on-line test field programmable analog array (FPAA) circuits. It proposes to partition the FPAA circuit under test into sub circuits. Each sub circuit is tested by replicating the sub circuit with programmable resources on FPAAs, and comparing the outputs of the original partitioned sub circuit and its replication. The advantages of this approach includes: low implementation cost, enhanced testability, and flexible testing schedules. This work also presents circuit techniques to address stability problems which are often encountered in the proposed on-line testing approach. In addition, the impact of performing circuit partition on testability is investigated in this work. It shows that testability is generally improved in partitioned circuits. Finally, experimental results are presented to demonstrate the feasibility and effectiveness of the proposed techniques
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