Partitioning of large HDL ASIC designs into multiple FPGA devices for prototyping and verification

The ASIC (Application specific Integrated Circuit) designs grow continuously bigger and bigger. This causes dramatic increase in the simulation run time. It is very hard to simulate these designs because the simulation time has risen from hours to days and weeks. Hardware Embedded Simulation (HES) is a technology that facilitates incremental design verification of ASICs. The FPGAs (Field Programmable Gate Arrays) can play an important role in ASIC design cycle. But it is not possible to fit an entire ASIC design into a single FPGA device. This problem can be solved by partitioning the given design into multiple small size designs (modules) and fitting those modules into multiple FPGAs. The purpose of my thesis is to take a large RTL (Register Transfer Level) design of an ASIC into consideration, write and test the software ( C code) practically to synthesize each top level module and analyze the size of each module in terms of number of CLBs (Configurable Logic Blocks), I/Os, flip-flops, latches and apply the algorithm to partition it automatically into minimum number of FPGAs

Manticore: Hardware-Accelerated RTL Simulation with Static Bulk-Synchronous Parallelism

The demise of Moore's Law and Dennard Scaling has revived interest in specialized computer architectures and accelerators. Verification and testing of this hardware heavily uses cycle-accurate simulation of register-transfer-level (RTL) designs. The best software RTL simulators can simulate designs at 1--1000~kHz, i.e., more than three orders of magnitude slower than hardware. Faster simulation can increase productivity by speeding design iterations and permitting more exhaustive exploration. One possibility is to use parallelism as RTL exposes considerable fine-grain concurrency. However, state-of-the-art RTL simulators generally perform best when single-threaded since modern processors cannot effectively exploit fine-grain parallelism. This work presents Manticore: a parallel computer designed to accelerate RTL simulation. Manticore uses a static bulk-synchronous parallel (BSP) execution model to eliminate runtime synchronization barriers among many simple processors. Manticore relies entirely on its compiler to schedule resources and communication. Because RTL code is practically free of long divergent execution paths, static scheduling is feasible. Communication and synchronization no longer incur runtime overhead, enabling efficient fine-grain parallelism. Moreover, static scheduling dramatically simplifies the physical implementation, significantly increasing the potential parallelism on a chip. Our 225-core FPGA prototype running at 475 MHz outperforms a state-of-the-art RTL simulator on an Intel Xeon processor running at $\approx$ 3.3 GHz by up to 27.9$\times$ (geomean 5.3$\times$) in nine Verilog benchmarks

Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-induced carrier mobility variation, temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use through-silicon vias (TSVs) at placement stage. Four main works that support this goal are included. In the first work, wirelength of TSV-based 3D ICs is the main focus. In the second work, stress-induced carrier mobility variation in TSV-based 3D ICs is examined. In the third work, temperature inside TSV-based 3D ICs is investigated. In the final work, the quality trade-offs of TSV-based 3D-IC designs are explored. In the first work, a force-directed, 3D, and gate-level placement algorithm that efficiently handles TSVs is developed. The experiments based on synthesized benchmarks indicate that the developed algorithm helps generate GDSII layouts of 3D-IC designs that are optimized in terms of wirelength. In addition, the impact of TSVs on other physical aspects of 3D-IC designs is also studied by analyzing the GDSII layouts. In the second work, the model for carrier mobility variation caused by TSV and STI stresses is developed as well as the timing analysis flow considering the stresses. The impact of TSV and STI stresses on carrier mobility variation and performance of 3D ICs is studied. Furthermore, a TSV-stress-driven, force-directed, and 3D placement algorithm is developed. It exploits carrier mobility variation, caused by stress around TSVs after fabrication, to improve the timing and area objectives during placement. In addition, the impact of keep-out zone (KOZ) around TSVs on stress, carrier mobility variation, area, wirelength, and performance of 3D ICs is studied. In the third work, two temperature-aware global placement algorithms are developed. They exploit die-to-die thermal coupling in 3D ICs to improve temperature during placement. In addition, a framework used to evaluate the results from temperature-aware global placements is developed. The main component of the framework is a GDSII-level thermal analysis that considers all structures inside a TSV-based 3D IC while computing temperature. The developed placers are compared with several state-of-the-art placers published in recent literature. The experimental results indicate that the developed algorithms help improve the temperature of 3D ICs effectively. In the final work, three block-level design styles for TSV-based die-to-wafer bonded 3D ICs are discussed. Several 3D-IC layouts in the three styles are manually designed. The main difference among these layouts is the position of TSVs. Finally, the area, wirelength, timing, power, temperature, and mechanical stress of all layouts are compared to explore the trade-offs of layout quality.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Mukhopadhyay, Saibal; Committee Member: Swaminathan, Madhava

Digital signal processing: the impact of convergence on education, society and design flow

Design and development of real-time, memory and processor hungry digital signal processing systems has for decades been accomplished on general-purpose microprocessors. Increasing needs for high-performance DSP systems made these microprocessors unattractive for such implementations. Various attempts to improve the performance of these systems resulted in the use of dedicated digital signal processing devices like DSP processors and the former heavyweight champion of electronics design – Application Specific Integrated Circuits. The advent of RAM-based Field Programmable Gate Arrays has changed the DSP design flow. Software algorithmic designers can now take their DSP algorithms right from inception to hardware implementation, thanks to the increasing availability of software/hardware design flow or hardware/software co-design. This has led to a demand in the industry for graduates with good skills in both Electrical Engineering and Computer Science. This paper evaluates the impact of technology on DSP-based designs, hardware design languages, and how graduate/undergraduate courses have changed to suit this transition

RITSim: distributed systemC simulation

Parallel or distributed simulation is becoming more than a novel way to speedup design evaluation; it is becoming necessary for simulating modern processors in a reasonable timeframe. As architectural features become faster, smaller, and more complex, designers are interested in obtaining detailed and accurate performance and power estimations. Uniprocessor simulators may not be able to meet such demands. The RITSim project uses SystemC to model a processor microarchitecture and memory subsystem in great detail. SystemC is a C++ library built on a discrete-event simulation kernel. Many projects have successfully implemented parallel discrete-event simulation (PDES) frameworks to distribute simulation among several hosts. The field promises significant simulation speedup, possibly leading to faster turnaround time in design space exploration and commercial production. However, parallel implementation of such simulators is not an easy task. It requires modification of the simulation kernel for effective partitioning and synchronization. This thesis explores PDES techniques and presents a distributed version of the SystemC simulation environment. With minimal user interaction, SystemC models can executed on a cluster of workstations using a message-passing library such as the Message Passing Interface (MPI). The implementation is designed for transparency; distribution and synchronization happen with little intervention by the model author. Modification of SystemC is fashioned to promote maintainability with future releases. Furthermore, only freely available libraries are used for maximum flexibility and portability

Type-driven automated program transformations and cost modelling for optimising streaming programs on FPGAs

In this paper we present a novel approach to program optimisation based on compiler-based type-driven program transformations and a fast and accurate cost/performance model for the target architecture. We target streaming programs for the problem domain of scientific computing, such as numerical weather prediction. We present our theoretical framework for type-driven program transformation, our target high-level language and intermediate representation languages and the cost model and demonstrate the effectiveness of our approach by comparison with a commercial toolchain