A new power MEMS component with variable capacitance

Autonomous devices such as wireless sensors and sensor networks need a long battery lifetime in a small volume. Incorporating micro-power generators based on ambient energy increases the lifetime of these systems while reducing the volume. This paper describes a new approach to the conversion of mechanical energy, available in vibrations, to electrical energy. The conversion principle is based on charge transportation between two parallel capacitors. An electret is used to polarize the device. A large-signal model was developed, allowing simulations of the behavior of the generator. A small-signal model was then derived in order to quantify the output power as a function of the design parameters. These models show the possibility of generating up to 40 muW with a device of 10 mm 2. A layout was made based on a standard SOI-technology, available in an MPW. With this design a power of 1 muW at 1020 Hz is expected

Design, fabrication, and testing of silicon microgimbals for super-compact rigid disk drives

This paper documents results related to design optimization, fabrication process refinement, and micron-level static/dynamic testing of silicon micromachined microgimbals that have applications in super-compact computer disk drives as well as many other engineering applications of microstructures and microactuators requiring significant out-of-plane motions. The objective of the optimization effort is to increase the in-plane to out-of-plane stiffness ratio in order to maximize compliance and servo bandwidth and to increase the displacement to strain ratio to maximize the shock resistance of the microgimbals, while that of the process modification effort is to simplify in order to reduce manufacturing cost. The testing effort is to characterize both the static and dynamic performance using precision instrumentation in order to compare various prototype designs

Experiment and simulation validated analytical equivalent circuit model for piezoelectric micromachined ultrasonic transducers

An analytical Mason equivalent circuit is derived for a circular, clamped plate piezoelectric micromachined ultrasonic transducer (pMUT) design in 31 mode, considering an arbitrary electrode configuration at any axisymmetric vibration mode. The explicit definition of lumped parameters based entirely on geometry, material properties, and defined constants enables straightforward and wide-ranging model implementation for future pMUT design and optimization. Beyond pMUTs, the acoustic impedance model is developed for universal application to any clamped, circular plate system, and operating regimes including relevant simplifications are identified via the wave number-radius product ka. For the single-electrode fundamental vibration mode case, sol-gel Pb(Zr[subscript 0.52])Ti[subscript 0.48]O[subscript 3] (PZT) pMUT cells are microfabricated with varying electrode size to confirm the derived circuit model with electrical impedance measurements. For the first time, experimental and finite element simulation results are successfully applied to validate extensive electrical, mechanical, and acoustic analytical modeling of a pMUT cell for wide-ranging applications including medical ultrasound, nondestructive testing, and range finding.Masdar Institute of Science and Technology (Massachusetts Institute of Technology Cooperative Agreement Grant 6923443)National Science Foundation (U.S.). Graduate Research Fellowshi

Piezoelectric Micromachined Ultrasound Transducer (PMUT) Arrays for Integrated Sensing, Actuation and Imaging

Many applications of ultrasound for sensing, actuation and imaging require miniaturized and low power transducers and transducer arrays integrated with electronic systems. Piezoelectric micromachined ultrasound transducers (PMUTs), diaphragm-like thin film flexural transducers typically formed on silicon substrates, are a potential solution for integrated transducer arrays. This paper presents an overview of the current development status of PMUTs and a discussion of their suitability for miniaturized and integrated devices. The thin film piezoelectric materials required to functionalize these devices are discussed, followed by the microfabrication techniques used to create PMUT elements and the constraints the fabrication imposes on device design. Approaches for electrical interconnection and integration with on-chip electronics are discussed. Electrical and acoustic measurements from fabricated PMUT arrays with up to 320 diaphragm elements are presented. The PMUTs are shown to be broadband devices with an operating frequency which is tunable by tailoring the lateral dimensions of the flexural membrane or the thicknesses of the constituent layers. Finally, the outlook for future development of PMUT technology and the potential applications made feasible by integrated PMUT devices are discussed

Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

Many micro electromechanical systems (MEMS) require a vacuum or controlled atmosphere encapsulation in order to ensure either a good performance or an acceptable lifetime of operation. Two approaches for wafer-scale zero-level packaging exist. The most popular approach is based on wafer bonding. Alternatively, encapsulation can be done by the fabrication and sealing of perforated surface micromachined membranes. In this paper, a sealing method is proposed for zero-level packaging using a thin film reflow technique. This sealing method can be done at arbitrary ambient and pressure. Also, it is self-aligned and it can be used for sealing openings directly above the MEMS device. It thus allows for a smaller die area for the sealing ring reducing in this way the device dimensions and costs. The sealing method has been demonstrated with reflowed aluminium, germanium, and boron phosphorous silica glass. This allows for conducting as well as non-conducting sealing layers and for a variety of allowable thermal budgets. The proposed technique is therefore very versatile

Sealing of micromachined cavities using chemical vapor deposition methods: characterization and optimization

This paper presents results of a systematic investigation to characterize the sealing of micromachined cavities using chemical vapor deposition (CVD) methods. We have designed and fabricated a large number and variety of surface-micromachined test structures with different etch-channel dimensions. Each cavity is then subjected to a number of sequential CVD deposition steps with incremental thickness until the cavity is successfully sealed. At etch deposition interval, the sealing status of every test structure is experimentally obtained and the percentage of structures that are sealed is recorded. Four CVD sealing materials have been incorporated in our studies: LPCVD silicon nitride, LPCVD polycrystalline silicon (polysilicon), LPCVD phosphosilicate glass (PSG), and PECVD silicon nitride. The minimum CVD deposition thickness that is required to successfully seal a microstructure is obtained for the first time. For a typical Type-1 test structure that has eight etch channels-each 10 μm long, 4 μm wide, and 0.42 μm tall-the minimum required thickness (normalized with respect to the height of etch channels) is 0.67 for LPCVD silicon nitride, 0.62 for LPCVD polysilicon, 4.5 for LPCVD PSG, and 5.2 for PECVD nitride. LPCVD silicon nitride and polysilicon are the most efficient sealing materials. Sealing results with respect to etch-channel dimensions (length and width) are evaluated (within the range of current design). When LPCVD silicon nitride is used as the sealing material, test structures with the longest (38 μm) and widest (16 μm) etch channels exhibit the highest probability of sealing. Cavities with a reduced number of etch channels seal more easily. For LPCVD PSG sealing, on the other hand, the sealing performance improves with decreasing width but is not affected by length of etch channels