Approximate and timing-speculative hardware design for high-performance and energy-efficient video processing

Since the end of transistor scaling in 2-D appeared on the horizon, innovative circuit design paradigms have been on the rise to go beyond the well-established and ultraconservative exact computing. Many compute-intensive applications – such as video processing – exhibit an intrinsic error resilience and do not necessarily require perfect accuracy in their numerical operations. Approximate computing (AxC) is emerging as a design alternative to improve the performance and energy-efficiency requirements for many applications by trading its intrinsic error tolerance with algorithm and circuit efficiency. Exact computing also imposes a worst-case timing to the conventional design of hardware accelerators to ensure reliability, leading to an efficiency loss. Conversely, the timing-speculative (TS) hardware design paradigm allows increasing the frequency or decreasing the voltage beyond the limits determined by static timing analysis (STA), thereby narrowing pessimistic safety margins that conventional design methods implement to prevent hardware timing errors. Timing errors should be evaluated by an accurate gate-level simulation, but a significant gap remains: How these timing errors propagate from the underlying hardware all the way up to the entire algorithm behavior, where they just may degrade the performance and quality of service of the application at stake? This thesis tackles this issue by developing and demonstrating a cross-layer framework capable of performing investigations of both AxC (i.e., from approximate arithmetic operators, approximate synthesis, gate-level pruning) and TS hardware design (i.e., from voltage over-scaling, frequency over-clocking, temperature rising, and device aging). The cross-layer framework can simulate both timing errors and logic errors at the gate-level by crossing them dynamically, linking the hardware result with the algorithm-level, and vice versa during the evolution of the application’s runtime. Existing frameworks perform investigations of AxC and TS techniques at circuit-level (i.e., at the output of the accelerator) agnostic to the ultimate impact at the application level (i.e., where the impact is truly manifested), leading to less optimization. Unlike state of the art, the framework proposed offers a holistic approach to assessing the tradeoff of AxC and TS techniques at the application-level. This framework maximizes energy efficiency and performance by identifying the maximum approximation levels at the application level to fulfill the required good enough quality. This thesis evaluates the framework with an 8-way SAD (Sum of Absolute Differences) hardware accelerator operating into an HEVC encoder as a case study. Application-level results showed that the SAD based on the approximate adders achieve savings of up to 45% of energy/operation with an increase of only 1.9% in BD-BR. On the other hand, VOS (Voltage Over-Scaling) applied to the SAD generates savings of up to 16.5% in energy/operation with around 6% of increase in BD-BR. The framework also reveals that the boost of about 6.96% (at 50°) to 17.41% (at 75° with 10- Y aging) in the maximum clock frequency achieved with TS hardware design is totally lost by the processing overhead from 8.06% to 46.96% when choosing an unreliable algorithm to the blocking match algorithm (BMA). We also show that the overhead can be avoided by adopting a reliable BMA. This thesis also shows approximate DTT (Discrete Tchebichef Transform) hardware proposals by exploring a transform matrix approximation, truncation and pruning. The results show that the approximate DTT hardware proposal increases the maximum frequency up to 64%, minimizes the circuit area in up to 43.6%, and saves up to 65.4% in power dissipation. The DTT proposal mapped for FPGA shows an increase of up to 58.9% on the maximum frequency and savings of about 28.7% and 32.2% on slices and dynamic power, respectively compared with stat

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering

Skybridge-3D-CMOS: A Fine-Grained Vertical 3D-CMOS Technology Paving New Direction for 3D IC

2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is a fine-grained 3D IC fabric that uses vertically-stacked gates and 3D interconnections composed on vertical nanowires to yield orders of magnitude benefits over 2D ICs. This 3D fabric fully uses the vertical dimension instead of relying on a multi-layered 2D mindset. Its core fabric aspects including device, circuit-style, interconnect and heat-extraction components are co-architected considering the major challenges in 3D IC technology. In S3DC, the 3D interconnections provide greater routing capacity in both vertical and horizontal directions compared to conventional 3D ICs, which eliminates the routability issue in conventional 3D IC technology while enabling ultra-high density design and significant benefits over 2D. Also, the improved vertical routing capacity in S3DC is beneficial for achieving robust and high-density power delivery network (PDN) design while conventional 3D IC has design issues in PDN design due to limited routing resource in vertical direction. Additionally, the 3D gate-all-around transistor incorporating with 3D interconnect in S3DC enables significant SRAM design benefits and good tolerance of process variation compared to conventional 3D IC technology as well as 2D CMOS. The transistor-level (TR-L) monolithic 3D IC (M3D) is the state-of-the-art monolithic 3D technology which shows better benefits than other M3D approaches as well as the TSV-based 3D IC approach. The S3DC is evaluated in large-scale benchmark circuits with comparison to TR-L M3D as well as 2D CMOS. Skybridge yields up to 3x lower power against 2D with no routing congestion in benchmark circuits while TR-L M3D only has up-to 22% power saving with severe routing congestions in the design. The PDN design in S3DC show

Design methodology and productivity improvement in high speed VLSI circuits

2017 Spring.Includes bibliographical references.To view the abstract, please see the full text of the document

FLEXIBLE LOW-COST HW/SW ARCHITECTURES FOR TEST, CALIBRATION AND CONDITIONING OF MEMS SENSOR SYSTEMS

During the last years smart sensors based on Micro-Electro-Mechanical systems (MEMS) are widely spreading over various fields as automotive, biomedical, optical and consumer, and nowadays they represent the outstanding state of the art. The reasons of their diffusion is related to the capability to measure physical and chemical information using miniaturized components. The developing of this kind of architectures, due to the heterogeneities of their components, requires a very complex design flow, due to the utilization of both mechanical parts typical of the MEMS sensor and electronic components for the interfacing and the conditioning. In these kind of systems testing activities gain a considerable importance, and they concern various phases of the life-cycle of a MEMS based system. Indeed, since the design phase of the sensor, the validation of the design by the extraction of characteristic parameters is important, because they are necessary to design the sensor interface circuit. Moreover, this kind of architecture requires techniques for the calibration and the evaluation of the whole system in addition to the traditional methods for the testing of the control circuitry. The first part of this research work addresses the testing optimization by the developing of different hardware/software architecture for the different testing stages of the developing flow of a MEMS based system. A flexible and low-cost platform for the characterization and the prototyping of MEMS sensors has been developed in order to provide an environment that allows also to support the design of the sensor interface. To reduce the reengineering time requested during the verification testing a universal client-server architecture has been designed to provide a unique framework to test different kind of devices, using different development environment and programming languages. Because the use of ATE during the engineering phase of the calibration algorithm is expensive in terms of ATE’s occupation time, since it requires the interruption of the production process, a flexible and easily adaptable low-cost hardware/software architecture for the calibration and the evaluation of the performance has been developed in order to allow the developing of the calibration algorithm in a user-friendly environment that permits also to realize a small and medium volume production. The second part of the research work deals with a topic that is becoming ever more important in the field of applications for MEMS sensors, and concerns the capability to combine information extracted from different typologies of sensors (typically accelerometers, gyroscopes and magnetometers) to obtain more complex information. In this context two different algorithm for the sensor fusion has been analyzed and developed: the first one is a fully software algorithm that has been used as a means to estimate how much the errors in MEMS sensor data affect the estimation of the parameter computed using a sensor fusion algorithm; the second one, instead, is a sensor fusion algorithm based on a simplified Kalman filter. Starting from this algorithm, a bit-true model in Mathworks Simulink(TM) has been created as a system study for the implementation of the algorithm on chip

FPT: a Fixed-Point Accelerator for Torus Fully Homomorphic Encryption

Fully Homomorphic Encryption is a technique that allows computation on encrypted data. It has the potential to change privacy considerations in the cloud, but computational and memory overheads are preventing its adoption. TFHE is a promising Torus-based FHE scheme that relies on bootstrapping, the noise-removal tool invoked after each encrypted logical/arithmetical operation. We present FPT, a Fixed-Point FPGA accelerator for TFHE bootstrapping. FPT is the first hardware accelerator to exploit the inherent noise present in FHE calculations. Instead of double or single-precision floating-point arithmetic, it implements TFHE bootstrapping entirely with approximate fixed-point arithmetic. Using an in-depth analysis of noise propagation in bootstrapping FFT computations, FPT is able to use noise-trimmed fixed-point representations that are up to 50% smaller than prior implementations. FPT is built as a streaming processor inspired by traditional streaming DSPs: it instantiates directly cascaded high-throughput computational stages, with minimal control logic and routing networks. We explore throughput-balanced compositions of streaming kernels with a user-configurable streaming width in order to construct a full bootstrapping pipeline. Our approach allows 100% utilization of arithmetic units and requires only a small bootstrapping key cache, enabling an entirely compute-bound bootstrapping throughput of 1 BS / 35us. This is in stark contrast to the classical CPU approach to FHE bootstrapping acceleration, which is typically constrained by memory and bandwidth. FPT is implemented and evaluated as a bootstrapping FPGA kernel for an Alveo U280 datacenter accelerator card. FPT achieves two to three orders of magnitude higher bootstrapping throughput than existing CPU-based implementations, and 2.5x higher throughput compared to recent ASIC emulation experiments.Comment: ACM CCS 202

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering