Low-Power, Low-Voltage SRAM Circuits Design For Nanometric CMOS Technologies

Embedded SRAM memory is a vital component in modern SoCs. More than 80% of the System-on-Chip (SoC) die area is often occupied by SRAM arrays. As such, system reliability and yield is largely governed by the SRAM's performance and robustness. The aggressive scaling trend in CMOS device minimum feature size, coupled with the growing demand in high-capacity memory integration, has imposed the use of minimal size devices to realize a memory bitcell. The smallest 6T SRAM bitcell to date occupies a 0.1um2 in silicon area. SRAM bitcells continue to benefit from an aggressive scaling trend in CMOS technologies. Unfortunately, other system components, such as interconnects, experience a slower scaling trend. This has resulted in dramatic deterioration in a cell's ability to drive a heavily-loaded interconnects. Moreover, the growing fluctuation in device properties due to Process, Voltage, and Temperature (PVT) variations has added more uncertainty to SRAM operation. Thus ensuring the ability of a miniaturized cell to drive heavily-loaded bitlines and to generate adequate voltage swing is becoming challenging. A large percentage of state-of-the-art SoC system failures are attributed to the inability of SRAM cells to generate the targeted bitline voltage swing within a given access time. The use of read-assist mechanisms and current mode sense amplifiers are the two key strategies used to surmount bitline loading effects. On the other hand, new bitcell topologies and cell supply voltage management are used to overcome fluctuations in device properties. In this research we tackled conventional 6T SRAM bitcell limited drivability by introducing new integrated voltage sensing schemes and current-mode sense amplifiers. The proposed schemes feature a read-assist mechanism. The proposed schemes' functionality and superiority over existing schemes are verified using transient and statistical SPICE simulations. Post-layout extracted views of the devices are used for realistic simulation results. Low-voltage operated SRAM reliability and yield enhancement is investigated and a wordline boost technique is proposed as a means to manage the cell's WL operating voltage. The proposed wordline driver design shows a significant improvement in reliability and yield in a 400-mV 6T SRAM cell. The proposed wordline driver design exploit the cell's Dynamic Noise Margin (DNM), therefore boost peak level and boost decay rate programmability features are added. SPICE transient and statistical simulations are used to verify the proposed design's functionality. Finally, at a bitcell-level, we proposed a new five-transistor (5T) SRAM bitcell which shows competitive performance and reliability figures of merit compared to the conventional 6T bitcell. The functionality of the proposed cell is verified by post-layout SPICE simulations. The proposed bitcell topology is designed, implemented and fabricated in a standard ST CMOS 65nm technology process. A 1.2_ 1.2 mm2 multi-design project test chip consisting of four 32-Kbit (256-row x 128-column) SRAM macros with the required peripheral and timing control units is fabricated. Two of the designed SRAM macros are dedicated for this work, namely, a 32-Kbit 5T macro and a 32-Kbit 6T macro which is used as a comparison reference. Other macros belong to other projects and are not discussed in this document

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Master'sMASTER OF ENGINEERIN

Low-Power Design of Digital VLSI Circuits around the Point of First Failure

As an increase of intelligent and self-powered devices is forecasted for our future everyday life, the implementation of energy-autonomous devices that can wirelessly communicate data from sensors is crucial. Even though techniques such as voltage scaling proved to effectively reduce the energy consumption of digital circuits, additional energy savings are still required for a longer battery life. One of the main limitations of essentially any low-energy technique is the potential degradation of the quality of service (QoS). Thus, a thorough understanding of how circuits behave when operated around the point of first failure (PoFF) is key for the effective application of conventional energy-efficient methods as well as for the development of future low-energy techniques. In this thesis, a variety of circuits, techniques, and tools is described to reduce the energy consumption in digital systems when operated either in the safe and conservative exact region, close to the PoFF, or even inside the inexact region. A straightforward approach to reduce the power consumed by clock distribution while safely operating in the exact region is dual-edge-triggered (DET) clocking. However, the DET approach is rarely taken, primarily due to the perceived complexity of its integration. In this thesis, a fully automated design flow is introduced for applying DET clocking to a conventional single-edge-triggered (SET) design. In addition, the first static true-single-phase-clock DET flip-flop (DET-FF) that completely avoids clock-overlap hazards of DET registers is proposed. Even though the correct timing of synchronous circuits is ensured in worst-case conditions, the critical path might not always be excited. Thus, dynamic clock adjustment (DCA) has been proposed to trim any available dynamic timing margin by changing the operating clock frequency at runtime. This thesis describes a dynamically-adjustable clock generator (DCG) capable of modifying the period of the produced clock signal on a cycle-by-cycle basis that enables the DCA technique. In addition, a timing-monitoring sequential (TMS) that detects input transitions on either one of the clock phases to enable the selection of the best timing-monitoring strategy at runtime is proposed. Energy-quality scaling techniques aimat trading lower energy consumption for a small degradation on the QoS whenever approximations can be tolerated. In this thesis, a low-power methodology for the perturbation of baseline coefficients in reconfigurable finite impulse response (FIR) filters is proposed. The baseline coefficients are optimized to reduce the switching activity of the multipliers in the FIR filter, enabling the possibility of scaling the power consumption of the filter at runtime. The area as well as the leakage power of many system-on-chips is often dominated by embedded memories. Gain-cell embedded DRAM (GC-eDRAM) is a compact, low-power and CMOS-compatible alternative to the conventional static random-access memory (SRAM) when a higher memory density is desired. However, due to GC-eDRAMs relying on many interdependent variables, the adaptation of existing memories and the design of future GCeDRAMs prove to be highly complex tasks. Thus, the first modeling tool that estimates timing, memory availability, bandwidth, and area of GC-eDRAMs for a fast exploration of their design space is proposed in this thesis

Integrated Circuits/Microchips

With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

Addressing the RRAM Reliability and Radiation Soft-Errors in the Memory Systems

With the continuous and aggressive technology scaling, the design of memory systems becomes very challenging. The desire to have high-capacity, reliable, and energy efficient memory arrays is rising rapidly. However, from the technology side, the increasing leakage power and the restrictions resulting from the manufacturing limitations complicate the design of memory systems. In addition to this, with the new machine learning applications, which require tremendous amount of mathematical operations to be completed in a timely manner, the interest in neuromorphic systems has increased in recent years. Emerging Non- Volatile Memory (NVM) devices have been suggested to be incorporated in the design of memory arrays due to their small size and their ability to reduce leakage power since they can retain their data even in the absence of power supply. Compared to other novel NVM devices, the Resistive Random Access Memory (RRAM) device has many advantages including its low-programming requirements, the large ratio between its high and low resistive states, and its compatibility with the Complementary Metal Oxide Semiconductor (CMOS) fabrication process. RRAM device suffers from other disadvantages including the instability in its switching dynamics and its sensitivity to process variations. Yet, one of the popular issues hindering the deployment of RRAM arrays in products are the RRAM reliability and radiation soft-errors. The RRAM reliability soft-errors result from the diffusion of oxygen vacations out of the conductive channels within the oxide material of the device. On the other hand, the radiation soft-errors are caused by the highly energetic cosmic rays incident on the junction of the MOS device used as a selector for the RRAM cell. Both of those soft-errors cause the unintentional change of the resistive state of the RRAM device. While there is research work in literature to address some of the RRAM disadvantages such as the switching dynamic instability, there is no dedicated work discussing the impact of RRAM soft-errors on the various designs to which the RRAM device is integrated and how the soft-errors can be automatically detected and fixed. In this thesis, we bring the attention to the need of considering the RRAM soft-errors to avoid the degradation in design performance. In addition to this, using previously reported SPICE models, which were experimentally verified, and widely adapted system level simulators and test benches, various solutions are provided to automatically detect and fix the degradation in design performance due to the RRAM soft-errors. The main focus in this work is to propose methodologies which solve or improve the robustness of memory systems to the RRAM soft-errors. These memories are expected to be incorporated in the current and futuristic platforms running the advanced machine learning applications. In more details, the main contributions of this thesis can be summarized as: - Provide in depth analysis of the impact of RRAM soft-errors on the performance of RRAM-based designs. - Provide a new SRAM cell which uses the RRAM device to reduce the SRAM leakage power with minimal impact on its read and write operations. This new SRAM cell can be incorporated in the Graphical Processing Unit (GPU) design used currently in the implementation of the machine learning platforms. - Provide a circuit and system solutions to resolve the reliability and radiation soft-errors in the RRAM arrays. These solution can automatically detect and fix the soft-errors with minimum impact on the delay and energy consumption of the memory array. - A framework is developed to estimate the effect of RRAM soft-errors on the performance of RRAM-based neuromorphic systems. This actually provides, for the first time, a very generic methodology through which the device level RRAM soft-errors are mapped to the overall performance of the neuromorphic systems. Our analysis show that the accuracy of the RRAM-based neuromorphic system can degrade by more than 48% due to RRAM soft-errors. - Two algorithms are provided to automatically detect and restore the degradation in RRAM-based neuromorphic systems due to RRAM soft-errors. The system and circuit level techniques to implement these algorithms are also explained in this work. In conclusion, this work offers initial steps for enabling the usage of RRAM devices in products by tackling one of its most known challenges: RRAM reliability and radiation soft-errors. Despite using experimentally verified SPICE models and widely popular system simulators and test benches, the provided solutions in this thesis need to be verified in the future work through fabrication to study the impact of other RRAM technology shortcomings including: a) the instability in its switching dynamics due to the stochastic nature of oxygen vacancies movement, and b) its sensitivity to process variations