300 research outputs found

    Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

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    Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

    Analysis and application of improved feedthrough logic

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    Continuous technology scaling and increased frequency of operation of VLSI circuits leads to increase in power density which raises thermal management problem. Therefore design of low power VLSI circuit technique is a challenging task without sacrificing its performance. This thesis presents the design of a low power dynamic circuit using a new CMOS domino logic family called feedthrough (FTL) logic. Dynamic logic circuits are more significant because of its faster speed and lesser transistor requirement as compared to static CMOS logic circuits. The need for faster circuits compels designers to use FTL as compared static and domino CMOS logic and the requirement of output inverter for cascading of various logic blocks in domino logic are eliminated in the proposed design. The proposed circuit for low power (LP-FTL) improves dynamic power consumption as compared to the existing FTL and to further improve its speed we propose another circuit (HS-FTL). This logic family improves speed at the cost of dynamic power consumption and area. Proposed modified FTL circuit families provide better PDP as compared to the existing FTL. Simulation results of both the proposed circuit using 0.18 µm, 1.8 V CMOS process technology indicate that the LP-FTL structure reduces the dynamic power approximately by 42% and the HS-FTL structure achieves a speed up- 1.4 for 10-stage of inverters and 8-bit ripple carry adder in comparison to existing FTL logic. Furthermore, we present various circuit design techniques to improve noise tolerance of the proposed FTL logic families. Noise in deep submicron technology limits the reliability and performance of ICs. The ANTE (average noise threshold energy) metric is used for the analysis of noise tolerance of proposed FTL. A 2-input NAND and NOR gate is designed by the proposed technique. Simulation results for a 2-input NAND gate at 0.18-µm, 1.8 V CMOS process technology show that the proposed noise tolerant circuit achieves 1.79X ANTE improvement along with the reduction in leakage power. Continuous scaling of technology towards the nanometer range significantly increases leakage current level and the effect of noise. This research can be further extended for performance optimization in terms of power, speed, area and noise immunity

    Fast-Gated 16 x 16 SPAD Array With 16 on-Chip 6 ps Time-to-Digital Converters for Non-Line-of-Sight Imaging

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    We present the design and characterization of a fully-integrated array of 16 x 16 Single-Photon Avalanche Diodes (SPADs) with fast-gating capabilities and 16 on-chip 6 ps time-to-digital converters, which has been embedded in a compact imaging module. Such sensor has been developed for Non-Line-Of-Sight imaging applications, which require: i) a narrow instrument response function, for a centimeter-accurate single-shot precision; ii) fast-gated SPADs, for time-filtering of directly reflected photons; iii) high photon detection probability, for acquiring faint signals undergoing multiple scattering events. Thanks to a novel multiple differential SPAD-SPAD sensing approach, SPAD detectors can be swiftly activated in less than 500 ps and the full-width at half maximum of the instrument response function is always less than 75 ps (60 ps on average). Temporal responses are consistently uniform throughout the gate window, showing just few picoseconds of time dispersion when 30 ns gate pulses are applied, while the differential non-linearity is as low as 250 fs. With a photon detection probability peak of 70% at 490 nm, a fill-factor of 9.6% and up to 1.6 . 10(8) photon time-tagging measurements per second, such sensor fulfills the demand for fully-integrated imaging solutions optimized for non-line-of-sight imaging applications, enabling to cut exposure times while also optimizing size, weight, power and cost, thus paving the way for further scaled architectures

    Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

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    This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

    A novel deep submicron bulk planar sizing strategy for low energy subthreshold standard cell libraries

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    Engineering andPhysical Science ResearchCouncil (EPSRC) and Arm Ltd for providing funding in the form of grants and studentshipsThis work investigates bulk planar deep submicron semiconductor physics in an attempt to improve standard cell libraries aimed at operation in the subthreshold regime and in Ultra Wide Dynamic Voltage Scaling schemes. The current state of research in the field is examined, with particular emphasis on how subthreshold physical effects degrade robustness, variability and performance. How prevalent these physical effects are in a commercial 65nm library is then investigated by extensive modeling of a BSIM4.5 compact model. Three distinct sizing strategies emerge, cells of each strategy are laid out and post-layout parasitically extracted models simulated to determine the advantages/disadvantages of each. Full custom ring oscillators are designed and manufactured. Measured results reveal a close correlation with the simulated results, with frequency improvements of up to 2.75X/2.43X obs erved for RVT/LVT devices respectively. The experiment provides the first silicon evidence of the improvement capability of the Inverse Narrow Width Effect over a wide supply voltage range, as well as a mechanism of additional temperature stability in the subthreshold regime. A novel sizing strategy is proposed and pursued to determine whether it is able to produce a superior complex circuit design using a commercial digital synthesis flow. Two 128 bit AES cores are synthesized from the novel sizing strategy and compared against a third AES core synthesized from a state-of-the-art subthreshold standard cell library used by ARM. Results show improvements in energy-per-cycle of up to 27.3% and frequency improvements of up to 10.25X. The novel subthreshold sizing strategy proves superior over a temperature range of 0 °C to 85 °C with a nominal (20 °C) improvement in energy-per-cycle of 24% and frequency improvement of 8.65X. A comparison to prior art is then performed. Valid cases are presented where the proposed sizing strategy would be a candidate to produce superior subthreshold circuits

    Semiconductor-technology exploration : getting the most out of the MOST

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    Power supply noise in delay testing

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    As technology scales into the Deep Sub-Micron (DSM) regime, circuit designs have become more and more sensitive to power supply noise. Excessive noise can significantly affect the timing performance of DSM designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This will eventually result in delay test overkill. To reduce this overkill, we propose a low-cost pattern-dependent approach to analyze noise-induced delay variation for each delay test pattern applied to the design. Two noise models have been proposed to address array bond and wire bond power supply networks, and they are experimentally validated and compared. Delay model is then applied to calculate path delay under noise. This analysis approach can be integrated into static test compaction or test fill tools to control supply noise level of delay tests. We also propose an algorithm to predict transition count of a circuit, which can be applied to control switching activity during dynamic compaction. Experiments have been performed on ISCAS89 benchmark circuits. Results show that compacted delay test patterns generated by our compaction tool can meet a moderate noise or delay constraint with only a small increase in compacted test set size. Take the benchmark circuit s38417 for example: a 10% delay increase constraint only results in 1.6% increase in compacted test set size in our experiments. In addition, different test fill techniques have a significant impact on path delay. In our work, a test fill tool with supply noise analysis has been developed to compare several test fill techniques, and results show that the test fill strategy significant affect switching activity, power supply noise and delay. For instance, patterns with minimum transition fill produce less noise-induced delay than random fill. Silicon results also show that test patterns filled in different ways can cause as much as 14% delay variation on target paths. In conclusion, we must take noise into consideration when delay test patterns are generated

    Limits on Fundamental Limits to Computation

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    An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl
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