Clock Generator Circuits for Low-Power Heterogeneous Multiprocessor Systems-on-Chip

In this work concepts and circuits for local clock generation in low-power heterogeneous multiprocessor systems-on-chip (MPSoCs) are researched and developed. The targeted systems feature a globally asynchronous locally synchronous (GALS) clocking architecture and advanced power management functionality, as for example fine-grained ultra-fast dynamic voltage and frequency scaling (DVFS). To enable this functionality compact clock generators with low chip area, low power consumption, wide output frequency range and the capability for ultra-fast frequency changes are required. They are to be instantiated individually per core. For this purpose compact all digital phase-locked loop (ADPLL) frequency synthesizers are developed. The bang-bang ADPLL architecture is analyzed using a numerical system model and optimized for low jitter accumulation. A 65nm CMOS ADPLL is implemented, featuring a novel active current bias circuit which compensates the supply voltage and temperature sensitivity of the digitally controlled oscillator (DCO) for reduced digital tuning effort. Additionally, a 28nm ADPLL with a new ultra-fast lock-in scheme based on single-shot phase synchronization is proposed. The core clock is generated by an open-loop method using phase-switching between multi-phase DCO clocks at a fixed frequency. This allows instantaneous core frequency changes for ultra-fast DVFS without re-locking the closed loop ADPLL. The sensitivity of the open-loop clock generator with respect to phase mismatch is analyzed analytically and a compensation technique by cross-coupled inverter buffers is proposed. The clock generators show small area (0.0097mm2 (65nm), 0.00234mm2 (28nm)), low power consumption (2.7mW (65nm), 0.64mW (28nm)) and they provide core clock frequencies from 83MHz to 666MHz which can be changed instantaneously. The jitter performance is compliant to DDR2/DDR3 memory interface specifications. Additionally, high-speed clocks for novel serial on-chip data transceivers are generated. The ADPLL circuits have been verified successfully by 3 testchip implementations. They enable efficient realization of future low-power MPSoCs with advanced power management functionality in deep-submicron CMOS technologies.In dieser Arbeit werden Konzepte und Schaltungen zur lokalen Takterzeugung in heterogenen Multiprozessorsystemen (MPSoCs) mit geringer Verlustleistung erforscht und entwickelt. Diese Systeme besitzen eine global-asynchrone lokal-synchrone Architektur sowie Funktionalität zum Power Management, wie z.B. das feingranulare, schnelle Skalieren von Spannung und Taktfrequenz (DVFS). Um diese Funktionalität zu realisieren werden kompakte Taktgeneratoren benötigt, welche eine kleine Chipfläche einnehmen, wenig Verlustleitung aufnehmen, einen weiten Bereich an Ausgangsfrequenzen erzeugen und diese sehr schnell ändern können. Sie sollen individuell pro Prozessorkern integriert werden. Dazu werden kompakte volldigitale Phasenregelkreise (ADPLLs) entwickelt, wobei eine bang-bang ADPLL Architektur numerisch modelliert und für kleine Jitterakkumulation optimiert wird. Es wird eine 65nm CMOS ADPLL implementiert, welche eine neuartige Kompensationsschlatung für den digital gesteuerten Oszillator (DCO) zur Verringerung der Sensitivität bezüglich Versorgungsspannung und Temperatur beinhaltet. Zusätzlich wird eine 28nm CMOS ADPLL mit einer neuen Technik zum schnellen Einschwingen unter Nutzung eines Phasensynchronisierers realisiert. Der Prozessortakt wird durch ein neuartiges Phasenmultiplex- und Frequenzteilerverfahren erzeugt, welches es ermöglicht die Taktfrequenz sofort zu ändern um schnelles DVFS zu realisieren. Die Sensitivität dieses Frequenzgenerators bezüglich Phasen-Mismatch wird theoretisch analysiert und durch Verwendung von kreuzgekoppelten Taktverstärkern kompensiert. Die hier entwickelten Taktgeneratoren haben eine kleine Chipfläche (0.0097mm2 (65nm), 0.00234mm2 (28nm)) und Leistungsaufnahme (2.7mW (65nm), 0.64mW (28nm)). Sie stellen Frequenzen von 83MHz bis 666MHz bereit, welche sofort geändert werden können. Die Schaltungen erfüllen die Jitterspezifikationen von DDR2/DDR3 Speicherinterfaces. Zusätzliche können schnelle Takte für neuartige serielle on-Chip Verbindungen erzeugt werden. Die ADPLL Schaltungen wurden erfolgreich in 3 Testchips erprobt. Sie ermöglichen die effiziente Realisierung von zukünftigen MPSoCs mit Power Management in modernsten CMOS Technologien

DLWUC: Distance and Load Weight Updated Clustering-Based Clock Distribution for SOC Architecture

High-clock skew variations and degradation of driving ability of buffers lead to an additional power dissipation in Clock Distribution Network (CDN) that increases the dimensionality of buffers and coordination among flip-flops. The manual threshold level to predict the Region of Interest (ROI) is not applicable in clustering process due to the complexities of excessive wire length and critical delay. This paper proposes the Distance and Load Weight Updated Clustering (DLWUC) to determine the suitable position of logical components. Initially, the DLWUC utilizes the Hybrid Weighted Distance (HWD) to estimate the distance and construct the distance matrix. The weight value extracted from the sorted distance matrix facilitates the projection of buffers. The updated weight value serves as the base for clustering with labeled outputs. The placement of buffer at the suitable place from load weight updated clustering provides the necessary trade-off between clock provision and load balance. The DLWUC discussed in this paper reduces the size of buffers, skew, power and latency compared to the existing topologies

Design and Validation of Network-on-Chip Architectures for the Next Generation of Multi-synchronous, Reliable, and Reconfigurable Embedded Systems

NETWORK-ON-CHIP (NoC) design is today at a crossroad. On one hand, the design principles to efficiently implement interconnection networks in the resource-constrained on-chip setting have stabilized. On the other hand, the requirements on embedded system design are far from stabilizing. Embedded systems are composed by assembling together heterogeneous components featuring differentiated operating speeds and ad-hoc counter measures must be adopted to bridge frequency domains. Moreover, an unmistakable trend toward enhanced reconfigurability is clearly underway due to the increasing complexity of applications. At the same time, the technology effect is manyfold since it provides unprecedented levels of system integration but it also brings new severe constraints to the forefront: power budget restrictions, overheating concerns, circuit delay and power variability, permanent fault, increased probability of transient faults. Supporting different degrees of reconfigurability and flexibility in the parallel hardware platform cannot be however achieved with the incremental evolution of current design techniques, but requires a disruptive approach and a major increase in complexity. In addition, new reliability challenges cannot be solved by using traditional fault tolerance techniques alone but the reliability approach must be also part of the overall reconfiguration methodology. In this thesis we take on the challenge of engineering a NoC architectures for the next generation systems and we provide design methods able to overcome the conventional way of implementing multi-synchronous, reliable and reconfigurable NoC. Our analysis is not only limited to research novel approaches to the specific challenges of the NoC architecture but we also co-design the solutions in a single integrated framework. Interdependencies between different NoC features are detected ahead of time and we finally avoid the engineering of highly optimized solutions to specific problems that however coexist inefficiently together in the final NoC architecture. To conclude, a silicon implementation by means of a testchip tape-out and a prototype on a FPGA board validate the feasibility and effectivenes

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

A Survey on Low-Power Techniques with Emerging Technologies: From Devices to Systems

Nowadays, power consumption is one of the main limitations of electronic systems. In this context, novel and emerging devices provide us with new opportunities to keep the trend to low-power design. In this survey paper, we present a transversal survey on energy efficient techniques ranging from devices to architectures. The actual trends of device research, with fully-depleted planar devices, tri-gate geometries and gate-all-around structures, allows us to reach an increasingly higher level of performance while reducing the associated power. In addition, beyond the simple device properties enhancements, emerging devices also lead to innovations at circuit and architectural levels. In particular, devices whose properties can be tuned through additional terminals enable a fine and dynamic control of device threshold. They also enable designers to realize logic gates and to implement power-related techniques in a compact way unreachable to standard technologies. These innovations reduce the power consumption at the gate level and unlock new means of actuation in architectural solutions like adaptive voltage and frequency scaling

CROSS-LAYER DESIGN, OPTIMIZATION AND PROTOTYPING OF NoCs FOR THE NEXT GENERATION OF HOMOGENEOUS MANY-CORE SYSTEMS

This thesis provides a whole set of design methods to enable and manage the runtime heterogeneity of features-rich industry-ready Tile-Based Networkon- Chips at different abstraction layers (Architecture Design, Network Assembling, Testing of NoC, Runtime Operation). The key idea is to maintain the functionalities of the original layers, and to improve the performance of architectures by allowing, joint optimization and layer coordinations. In general purpose systems, we address the microarchitectural challenges by codesigning and co-optimizing feature-rich architectures. In application-specific NoCs, we emphasize the event notification, so that the platform is continuously under control. At the network assembly level, this thesis proposes a Hold Time Robustness technique, to tackle the hold time issue in synchronous NoCs. At the network architectural level, the choice of a suitable synchronization paradigm requires a boost of synthesis flow as well as the coexistence with the DVFS. On one hand this implies the coexistence of mesochronous synchronizers in the network with dual-clock FIFOs at network boundaries. On the other hand, dual-clock FIFOs may be placed across inter-switch links hence removing the need for mesochronous synchronizers. This thesis will study the implications of the above approaches both on the design flow and on the performance and power quality metrics of the network. Once the manycore system is composed together, the issue of testing it arises. This thesis takes on this challenge and engineers various testing infrastructures. At the upper abstraction layer, the thesis addresses the issue of managing the fully operational system and proposes a congestion management technique named HACS. Moreover, some of the ideas of this thesis will undergo an FPGA prototyping. Finally, we provide some features for emerging technology by characterizing the power consumption of Optical NoC Interfaces

Automated Hardware Prototyping for 3D Network on Chips

Vor mehr als 50 Jahren stellte Intel® Mitbegründer Gordon Moore eine Prognose zum Entwicklungsprozess der Transistortechnologie auf. Er prognostizierte, dass sich die Zahl der Transistoren in integrierten Schaltungen alle zwei Jahre verdoppeln wird. Seine Aussage ist immer noch gültig, aber ein Ende von Moores Gesetz ist in Sicht. Mit dem Ende von Moore’s Gesetz müssen neue Aspekte untersucht werden, um weiterhin die Leistung von integrierten Schaltungen zu steigern. Zwei mögliche Ansätze für "More than Moore” sind 3D-Integrationsverfahren und heterogene Systeme. Gleichzeitig entwickelt sich ein Trend hin zu Multi-Core Prozessoren, basierend auf Networks on chips (NoCs). Neben dem Ende des Mooreschen Gesetzes ergeben sich bei immer kleiner werdenden Technologiegrößen, vor allem jenseits der 60 nm, neue Herausforderungen. Eine Schwierigkeit ist die Wärmeableitung in großskalierten integrierten Schaltkreisen und die daraus resultierende Überhitzung des Chips. Um diesem Problem in modernen Multi-Core Architekturen zu begegnen, muss auch die Verlustleistung der Netzwerkressourcen stark reduziert werden. Diese Arbeit umfasst eine durch Hardware gesteuerte Kombination aus Frequenzskalierung und Power Gating für 3D On-Chip Netzwerke, einschließlich eines FPGA Prototypen. Dafür wurde ein Takt-synchrones 2D Netzwerk auf ein dreidimensionales asynchrones Netzwerk mit mehreren Frequenzbereichen erweitert. Zusätzlich wurde ein skalierbares Online-Power-Management System mit geringem Ressourcenaufwand entwickelt. Die Verifikation neuer Hardwarekomponenten ist einer der zeitaufwendigsten Schritte im Entwicklungsprozess hochintegrierter digitaler Schaltkreise. Um diese Aufgabe zu beschleunigen und um eine parallele Softwareentwicklung zu ermöglichen, wurde im Rahmen dieser Arbeit ein automatisiertes und benutzerfreundliches Tool für den Entwurf neuer Hardware Projekte entwickelt. Eine grafische Benutzeroberfläche zum Erstellen des gesamten Designablaufs, vom Erstellen der Architektur, Parameter Deklaration, Simulation, Synthese und Test ist Teil dieses Werkzeugs. Zudem stellt die Größe der Architektur für die Erstellung eines Prototypen eine besondere Herausforderung dar. Frühere Arbeiten haben es versäumt, eine schnelles und unkompliziertes Prototyping, insbesondere von Architekturen mit mehr als 50 Prozessorkernen, zu realisieren. Diese Arbeit umfasst eine Design Space Exploration und FPGA-basierte Prototypen von verschiedenen 3D-NoC Implementierungen mit mehr als 80 Prozessoren

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Fine-grained Energy and Thermal Management using Real-time Power Sensors

With extensive use of battery powered devices such as smartphones, laptops an