Design of ultraprecision machine tools with application to manufacturing of miniature and micro components

Currently the underlying necessities for predictability, producibility and productivity remain big issues in ultraprecision machining of miniature/microproducts. The demand on rapid and economic fabrication of miniature/microproducts with complex shapes has also made new challenges for ultraprecision machine tool design. In this paper the design for an ultraprecision machine tool is introduced by describing its key machine elements and machine tool design procedures. The focus is on the review and assessment of the state-of-the-art ultraprecision machining tools. It also illustrates the application promise of miniature/microproducts. The trends on machine tool development, tooling, workpiece material and machining processes are pointed out

Development of a Prototype Miniature Silicon Microgyroscope

A miniature vacuum-packaged silicon microgyroscope (SMG) with symmetrical and decoupled structure was designed to prevent unintended coupling between drive and sense modes. To ensure high resonant stability and strong disturbance resisting capacity, a self-oscillating closed-loop circuit including an automatic gain control (AGC) loop based on electrostatic force feedback is adopted in drive mode, while, dual-channel decomposition and reconstruction closed loops are applied in sense mode. Moreover, the temperature effect on its zero bias was characterized experimentally and a practical compensation method is given. The testing results demonstrate that the useful signal and quadrature signal will not interact with each other because their phases are decoupled. Under a scale factor condition of 9.6 mV/°/s, in full measurement range of ± 300 deg/s, the zero bias stability reaches 15°/h with worse-case nonlinearity of 400 ppm, and the temperature variation trend of the SMG bias is thus largely eliminated, so that the maximum bias value is reduced to one tenth of the original after compensation from -40 °C to 80 °C

Low power consumption mini rotary actuator with SMA wires

Shape memory alloys (SMAs) are smart materials widely used as actuators for their high power to weight ratio despite their well-known low energy efficiency and limited mechanical bandwidth. For robotic applications, SMAs exhibit limitations due to high power consumption and limited stroke, varying from 4% to 7% of the total length. Hysteresis, during the contraction and extension cycle, requires a complex control algorithm. On the positive side, the small size and low weight are eminently suited for the design of mini actuators for robotic platforms. This paper describes the design and construction of a light weight and low power consuming mini rotary actuator with on-board contact-less position and force sensors. The design is specifically intended to reduce (i) energy consumption, (ii) dimensions of the sensory system, and (iii) provide a simple control without any need for SMA characterisation. The torque produced is controlled by on-board force sensors. Experiments were performed to investigate the energy consumption and performance (step and sinusoidal angle profiles with a frequency varying from 0.5 to 10 Hz and maximal amplitude of 15?). We describe a transient capacitor effect related to the SMA wires during the sinusoidal profile when the active SMA wire is powered and the antagonist one switched-off, resulting in a transient current time varying from 300 to 400 ms

Opto-Mechanical Design of ShaneAO: the Adaptive Optics System for the 3-meter Shane Telescope

A Cassegrain mounted adaptive optics instrument presents unique challenges for opto-mechanical design. The flexure and temperature tolerances for stability are tighter than those of seeing limited instruments. This criteria requires particular attention to material properties and mounting techniques. This paper addresses the mechanical designs developed to meet the optical functional requirements. One of the key considerations was to have gravitational deformations, which vary with telescope orientation, stay within the optical error budget, or ensure that we can compensate with a steering mirror by maintaining predictable elastic behavior. Here we look at several cases where deformation is predicted with finite element analysis and Hertzian deformation analysis and also tested. Techniques used to address thermal deformation compensation without the use of low CTE materials will also be discussed.Comment: 14 pages, 14 figures, 4 tables. Presented at SPIE Astronomical Telescopes + Instrumentation conference, paper 9148-11

Effects of variable resistance on smart structures of cubic reconnaissance satellites in various thermal and frequency shocking conditions

Piezoelectric materials are widely used as smart structures in cubic reconnaissance satellites because of their sensing, actuating, and energy-harvesting abilities. In this study, an analytical model is developed in specific mechanical thermal shocking conditions. A special circuit and apparatus is designed for experimentation on the basis of the inverse piezoelectric effect. An equivalent circuit method is used to establish the relationship between the resistance and peak-to-peak voltage of lead zirconate titanate used as smart materials for cubic reconnaissance satellites. Various frequencies and resistance were applied in different mechanical thermal shocking conditions. Moreover, numerical simulations are conducted in various mechanical loading conditions to determine the accumulative effect. The model provides a novel mechanism to characterize the smart structures in cubic reconnaissance satellites. A rise in temperature increases peak-to-peak voltage; a rise in frequency decreases peak-to-peak voltage; and intensified resistance decreases peak-to-peak voltage. Based on experimentation and simulation, the optimum resistance is predicted for the various frequencies and temperatures. The various conditions may correspond to the different applications of smart structures for cubic reconnaissance satellites. The analytical calculations are in good agreement with experimental and numerical calculations. © 2017, The Korean Society of Mechanical Engineers and Springer-Verlag GmbH Germany

Mechanical-Thermal Noise in Drive-Mode of a Silicon Micro-Gyroscope

A new closed-loop drive scheme which decouples the phase and the gain of the closed-loop driving system was designed in a Silicon Micro-Gyroscope (SMG). We deduce the system model of closed-loop driving and use stochastic averaging to obtain an approximate “slow” system that clarifies the effect of thermal noise. The effects of mechanical-thermal noise on the driving performance of the SMG, including the noise spectral density of the driving amplitude and frequency, are derived. By calculating and comparing the noise amplitude due to thermal noise both in the opened-loop driving and in the closed-loop driving, we find that the closed-loop driving does not reduce the RMS noise amplitude. We observe that the RMS noise frequency can be reduced by increasing the quality factor and the drive amplitude in the closed-loop driving system. The experiment and simulation validate the feasibility of closed-loop driving and confirm the validity of the averaged equation and its stablility criterion. The experiment and simulation results indicate the electrical noise of closed-loop driving circuitry is bigger than the mechanical-thermal noise and as the driving mass decreases, the mechanical-thermal noise may get bigger than the electrical noise of the closed-loop driving circuitry

Design, fabrication, characterization and reliability study of CMOS-MEMS Lorentz-Force magnetometers

Tesi en modalitat de compendi de publicacionsToday, the most common form of mass-production semiconductor device fabrication is Complementary Metal-Oxide Semiconductor (CMOS) technology. The dedicated Integrated Circuit (IC) interfaces of commercial sensors are manufactured using this technology. The sensing elements are generally implemented using Micro-Electro-Mechanical-Systems (MEMS), which need to be manufactured using specialized micro-machining processes. Finally, the CMOS circuitry and the MEMS should ideally be combined in a single package. For some applications, integration of CMOS electronics and MEMS devices on a single chip (CMOS-MEMS) has the potential of reducing fabrication costs, size, parasitics and power consumption, compared to other integration approaches. Remarkably, a CMOS-MEMS device may be built with the back-end-of-line (BEOL) layers of the CMOS process. But, despite its advantages, this particular approach has proven to be very challenging given the current lack of commercial products in the market. The main objective of this Thesis is to prove that a high-performance MEMS, sealed and packaged in a standard package, may be accurately modeled and manufactured using the BEOL layers of a CMOS process in a reliable way. To attain this, the first highly reliable novel CMOS-MEMS Lorentz Force Magnetometer (LFM) was successfully designed, modeled, manufactured, characterized and subjected to several reliability tests, obtaining a comparable or superior performance to the typical solid-state magnetometers used in current smartphones. A novel technique to avoid magnetic offsets, the main drawback of LFMs, was presented and its performance confirmed experimentally. Initially, the issues encountered in the manufacturing process of MEMS using the BEOL layers of the CMOS process were discouraging. Vapor HF release of MEMS structures using the BEOL of CMOS wafers resulted in undesirable damaging effects that may lead to the conclusion that this manufacturing approach is not feasible. However, design techniques and workarounds for dealing with the observed issues were devised, tested and implemented in the design of the LFM presented in this Thesis, showing a clear path to successfully fabricate different MEMS devices using the BEOL.Hoy en día, la forma más común de producción en masa es una tecnología llamada Complementary Metal-Oxide Semiconductor (CMOS). La interfaz de los circuitos integrados (IC) de sensores comerciales se fabrica usando, precisamente, esta tecnología. Actualmente es común que los sensores se implementen usando Sistemas Micro-Electro-Mecánicos (MEMS), que necesitan ser fabricados usando procesos especiales de micro-mecanizado. En un último paso, la circuitería CMOS y el MEMS se combinan en un único elemento, llamado package. En algunas aplicaciones, la integración de la electrónica CMOS y los dispositivos MEMS en un único chip (CMOS-MEMS) alberga el potencial de reducir los costes de fabricación, el tamaño, los parásitos y el consumo, al compararla con otras formas de integración. Resulta notable que un dispositivo CMOS-MEMS pueda ser construido con las capas del back-end-of-line (BEOL) de un proceso CMOS. Pero, a pesar de sus ventajas, este enfoque ha demostrado ser un gran desafío como demuestra la falta de productos comerciales en el mercado. El objetivo principal de esta Tesis es probar que un MEMS de altas prestaciones, sellado y empaquetado en un encapsulado estándar, puede ser correctamente modelado y fabricado de una manera fiable usando las capas del BEOL de un proceso CMOS. Para probar esto mismo, el primer magnetómetro CMOS-MEMS de fuerza de Lorentz (LFM) fue exitosamente diseñado, modelado, fabricado, caracterizado y sometido a varias pruebas de fiabilidad, obteniendo un rendimiento comparable o superior al de los típicos magnetómetros de estado sólido, los cuales son usados en móviles actuales. Cabe destacar que en esta Tesis se presenta una novedosa técnica con la que se evitan offsets magnéticos, el mayor inconveniente de los magnetómetros de fuerza Lorentz. Su efectividad fue confirmada experimentalmente. En los inicios, los problemas asociados al proceso de fabricación de MEMS usando las capas BEOL de obleas CMOS resultaba desalentador. Liberar estructuras MEMS hechas con obleas CMOS con vapor de HF producía efectos no deseados que bien podrían llevar a la conclusión de que este enfoque de fabricación no es viable. Sin embargo, se idearon y probaron técnicas de diseño especiales y soluciones ad-hoc para contrarrestar estos efectos no deseados. Se implementaron en el diseño del magnetómetro de Lorentz presentado en esta Tesis, arrojando excelentes resultados, lo cual despeja el camino hacia la fabricación de diferentes dispositivos MEMS usando las capas BEOL.Postprint (published version

Methods of frequency tuning vibration based micro-generator

A vibration based micro-generator is an energy harvesting device that couples a certain transduction mechanism to the ambient vibration and converts mechanical energy to electrical energy. In order to maximize available power, micro-generators are typically inertial devices that operate at a single resonant frequency. The maximum output power is generated when the resonant frequency of the generator matches the ambient vibration frequency. The output power drops significantly if these two frequencies do not match due to the high Q-factor of the generator. This thesis addresses possible methods to overcome this limit of vibration based micro-generators, in particular, method of tuning the resonant frequency of the generator to match the ambient vibration frequency. This thesis highlights mechanical and electrical methods of resonant frequency tuning of a vibration based micro-generator. The mechanical frequency tuning is realized by applying an axial tensile force to strain the cantilever structure of the generator. A tunable micro-generator with a tuning range from 67.6 Hz to 98Hz and a maximum output power of 156.6?W at a constant low vibration acceleration level of 0.59m·s-2 was designed and tested. The tuning mechanism was found not to affect the damping of the generator. A closed loop frequency tuning system as well as the frequency searching algorithms has been developed to realize automatic frequency tuning using the proposed mechanical tuning method. The model of duty cycle of the system was established and it was proved theoretically that a reasonable duty cycle can be achieved if the generator and tuning system is designed properly.The electrical tuning method is realized by changing the load capacitance of the generator. Models of piezoelectric and electromagnetic generators using electrical tuning methods were derived. The model of the electromagnetic generator has also been experimentally verified. The electrically tunable generator tested has a maximum 3dB bandwidth of 4.2Hz. In conclusion, resonant frequency tuning using mechanical methods presented in the thesis have larger tuning range than that using electrical methods. However, frequency tuning using electrical tuning methods consumes less power than that using mechanical methods for the same amount of tuning range