Time-of-flight CMOS イメージセンサによる高精度・高速距離イメージングに関する研究

Tohoku University博士（工学）thesi

Understanding and ameliorating non-linear phase and amplitude responses in AMCW Lidar

Amplitude modulated continuous wave (AMCW) lidar systems commonly suffer from non-linear phase and amplitude responses due to a number of known factors such as aliasing and multipath inteference. In order to produce useful range and intensity information it is necessary to remove these perturbations from the measurements. We review the known causes of non-linearity, namely aliasing, temporal variation in correlation waveform shape and mixed pixels/multipath inteference. We also introduce other sources of non-linearity, including crosstalk, modulation waveform envelope decay and non-circularly symmetric noise statistics, that have been ignored in the literature. An experimental study is conducted to evaluate techniques for mitigation of non-linearity, and it is found that harmonic cancellation provides a significant improvement in phase and amplitude linearity

CMOS Sensors for Time-Resolved Active Imaging

In the past decades, time-resolved imaging such as fluorescence lifetime or time-of-flight depth imaging has been extensively explored in biomedical and industrial fields because of its non-invasive characterization of material properties and remote sensing capability. Many studies have shown its potential and effectiveness in applications such as cancer detection and tissue diagnoses from fluorescence lifetime imaging, and gesture/motion sensing and geometry sensing from time-of-flight imaging. Nonetheless, time-resolved imaging has not been widely adopted due to the high cost of the system and performance limits. The research presented in this thesis focuses on the implementation of low-cost real-time time-resolved imaging systems. Two image sensing schemes are proposed and implemented to address the major limitations. First, we propose a single-shot fluorescence lifetime image sensors for high speed and high accuracy imaging. To achieve high accuracy, previous approaches repeat the measurement for multiple sampling, resulting in long measurement time. On the other hand, the proposed method achieves both high speed and accuracy at the same time by employing a pixel-level processor that takes and compresses the multiple samples within a single measurement time. The pixels in the sensor take multiple samples from the fluorescent optical signal in sub-nanosecond resolution and compute the average photon arrival time of the optical signal. Thanks to the multiple sampling of the signal, the measurement is insensitive to the shape or the pulse-width of excitation, providing better accuracy and pixel uniformity than conventional rapid lifetime determination (RLD) methods. The proposed single-shot image sensor also improves the imaging speed by orders of magnitude compared to other conventional center-of-mass methods (CMM). Second, we propose a 3-D camera with a background light suppression scheme which is adaptable to various lighting conditions. Previous 3-D cameras are not operable in outdoor conditions because they suffer from measurement errors and saturation problems under high background light illumination. We propose a reconfigurable architecture with column-parallel discrete-time background light cancellation circuit. Implementing the processor at the column level allows an order of magnitude reduction in pixel size as compared to existing pixel-level processors. The column-level approach also provides reconfigurable operation modes for optimal performance in all lighting conditions. For example, the sensor can operate at the best frame-rate and resolution without the presence of background light. If the background light saturates the sensor or increases the shot noise, the sensor can adjust the resolution and frame-rate by pixel binning and superresolution techniques. This effectively enhances the well capacity of the pixel to compensate for the increase shot noise, and speeds up the frame processing to handle the excessive background light. A fabricated prototype sensor can suppress the background light more than 100-klx while achieving a very small pixel size of 5.9μm.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/136950/1/eecho_1.pd

Advanced photon counting techniques for long-range depth imaging

The Time-Correlated Single-Photon Counting (TCSPC) technique has emerged as a candidate approach for Light Detection and Ranging (LiDAR) and active depth imaging applications. The work of this Thesis concentrates on the development and investigation of functional TCSPC-based long-range scanning time-of-flight (TOF) depth imaging systems. Although these systems have several different configurations and functions, all can facilitate depth profiling of remote targets at low light levels and with good surface-to-surface depth resolution. Firstly, a Superconducting Nanowire Single-Photon Detector (SNSPD) and an InGaAs/InP Single-Photon Avalanche Diode (SPAD) module were employed for developing kilometre-range TOF depth imaging systems at wavelengths of ~1550 nm. Secondly, a TOF depth imaging system at a wavelength of 817 nm that incorporated a Complementary Metal-Oxide-Semiconductor (CMOS) 32×32 Si-SPAD detector array was developed. This system was used with structured illumination to examine the potential for covert, eye-safe and high-speed depth imaging. In order to improve the light coupling efficiency onto the detectors, the arrayed CMOS Si-SPAD detector chips were integrated with microlens arrays using flip-chip bonding technology. This approach led to the improvement in the fill factor by up to a factor of 15. Thirdly, a multispectral TCSPC-based full-waveform LiDAR system was developed using a tunable broadband pulsed supercontinuum laser source which can provide simultaneous multispectral illumination, at wavelengths of 531, 570, 670 and ~780 nm. The investigated multispectral reflectance data on a tree was used to provide the determination of physiological parameters as a function of the tree depth profile relating to biomass and foliage photosynthetic efficiency. Fourthly, depth images were estimated using spatial correlation techniques in order to reduce the aggregate number of photon required for depth reconstruction with low error. A depth imaging system was characterised and re-configured to reduce the effects of scintillation due to atmospheric turbulence. In addition, depth images were analysed in terms of spatial and depth resolution

CMOS SPAD-based image sensor for single photon counting and time of flight imaging

The facility to capture the arrival of a single photon, is the fundamental limit to the detection of quantised electromagnetic radiation. An image sensor capable of capturing a picture with this ultimate optical and temporal precision is the pinnacle of photo-sensing. The creation of high spatial resolution, single photon sensitive, and time-resolved image sensors in complementary metal oxide semiconductor (CMOS) technology offers numerous benefits in a wide field of applications. These CMOS devices will be suitable to replace high sensitivity charge-coupled device (CCD) technology (electron-multiplied or electron bombarded) with significantly lower cost and comparable performance in low light or high speed scenarios. For example, with temporal resolution in the order of nano and picoseconds, detailed three-dimensional (3D) pictures can be formed by measuring the time of flight (TOF) of a light pulse. High frame rate imaging of single photons can yield new capabilities in super-resolution microscopy. Also, the imaging of quantum effects such as the entanglement of photons may be realised. The goal of this research project is the development of such an image sensor by exploiting single photon avalanche diodes (SPAD) in advanced imaging-specific 130nm front side illuminated (FSI) CMOS technology. SPADs have three key combined advantages over other imaging technologies: single photon sensitivity, picosecond temporal resolution and the facility to be integrated in standard CMOS technology. Analogue techniques are employed to create an efficient and compact imager that is scalable to mega-pixel arrays. A SPAD-based image sensor is described with 320 by 240 pixels at a pitch of 8μm and an optical efficiency or fill-factor of 26.8%. Each pixel comprises a SPAD with a hybrid analogue counting and memory circuit that makes novel use of a low-power charge transfer amplifier. Global shutter single photon counting images are captured. These exhibit photon shot noise limited statistics with unprecedented low input-referred noise at an equivalent of 0.06 electrons. The CMOS image sensor (CIS) trends of shrinking pixels, increasing array sizes, decreasing read noise, fast readout and oversampled image formation are projected towards the formation of binary single photon imagers or quanta image sensors (QIS). In a binary digital image capture mode, the image sensor offers a look-ahead to the properties and performance of future QISs with 20,000 binary frames per second readout with a bit error rate of 1.7 x 10-3. The bit density, or cumulative binary intensity, against exposure performance of this image sensor is in the shape of the famous Hurter and Driffield densitometry curves of photographic film. Oversampled time-gated binary image capture is demonstrated, capturing 3D TOF images with 3.8cm precision in a 60cm range

Miniature high dynamic range time-resolved CMOS SPAD image sensors

Since their integration in complementary metal oxide (CMOS) semiconductor technology in 2003, single photon avalanche diodes (SPADs) have inspired a new era of low cost high integration quantum-level image sensors. Their unique feature of discerning single photon detections, their ability to retain temporal information on every collected photon and their amenability to high speed image sensor architectures makes them prime candidates for low light and time-resolved applications. From the biomedical field of fluorescence lifetime imaging microscopy (FLIM) to extreme physical phenomena such as quantum entanglement, all the way to time of flight (ToF) consumer applications such as gesture recognition and more recently automotive light detection and ranging (LIDAR), huge steps in detector and sensor architectures have been made to address the design challenges of pixel sensitivity and functionality trade-off, scalability and handling of large data rates. The goal of this research is to explore the hypothesis that given the state of the art CMOS nodes and fabrication technologies, it is possible to design miniature SPAD image sensors for time-resolved applications with a small pixel pitch while maintaining both sensitivity and built -in functionality. Three key approaches are pursued to that purpose: leveraging the innate area reduction of logic gates and finer design rules of advanced CMOS nodes to balance the pixel’s fill factor and processing capability, smarter pixel designs with configurable functionality and novel system architectures that lift the processing burden off the pixel array and mediate data flow. Two pathfinder SPAD image sensors were designed and fabricated: a 96 × 40 planar front side illuminated (FSI) sensor with 66% fill factor at 8.25μm pixel pitch in an industrialised 40nm process and a 128 × 120 3D-stacked backside illuminated (BSI) sensor with 45% fill factor at 7.83μm pixel pitch. Both designs rely on a digital, configurable, 12-bit ripple counter pixel allowing for time-gated shot noise limited photon counting. The FSI sensor was operated as a quanta image sensor (QIS) achieving an extended dynamic range in excess of 100dB, utilising triple exposure windows and in-pixel data compression which reduces data rates by a factor of 3.75×. The stacked sensor is the first demonstration of a wafer scale SPAD imaging array with a 1-to-1 hybrid bond connection. Characterisation results of the detector and sensor performance are presented. Two other time-resolved 3D-stacked BSI SPAD image sensor architectures are proposed. The first is a fully integrated 5-wire interface system on chip (SoC), with built-in power management and off-focal plane data processing and storage for high dynamic range as well as autonomous video rate operation. Preliminary images and bring-up results of the fabricated 2mm² sensor are shown. The second is a highly configurable design capable of simultaneous multi-bit oversampled imaging and programmable region of interest (ROI) time correlated single photon counting (TCSPC) with on-chip histogram generation. The 6.48μm pitch array has been submitted for fabrication. In-depth design details of both architectures are discussed

A Sub-Centimeter Ranging Precision LIDAR Sensor Prototype Based on ILO-TDC

This thesis introduces a high-resolution light detection and ranging (LIDAR) sensor system-on-a-chip (SoC) that performs sub-centimeter ranging precision and maximally 124-meter ranging distance. With off-chip connected avalanche photodiodes (APDs), the time-of-flight (ToF) are resolved through 31×1 time-correlated single photon counting (TCSPC) channels. Embedded time-to-digital converters (TDCs) support 52-ps time resolution and 14-bit dynamic range. A novel injection-locked oscillator (ILO) based TDC are proposed to minimize the power of fine TDC clock distribution, and improve time precision. The global PVT variation among ILO clock distribution is calibrated by an on-chip phase-looked-loop (PLL) that assures a reliable counting performance over wide operating range. The proposed LIDAR sensor is designed, fabricated, and tested in the 65nm CMOS technology. Whole SoC consumes 37mW and each TDC channel consumes 788μW at nominal operation. The proposed TDC design achieved single-shot precision of 38.5 ps, channel uniformity of 14 ps, and DNL/INL of 0.56/1.56 LSB, respectively. The performance of proposed ILO-TDC makes it an excellent candidate for global counting TCSPC in automotive LIDAR

Development of a Full-Field Time-of-Flight Range Imaging System

A full-field, time-of-flight, image ranging system or 3D camera has been developed from a proof-of-principle to a working prototype stage, capable of determining the intensity and range for every pixel in a scene. The system can be adapted to the requirements of various applications, producing high precision range measurements with sub-millimetre resolution, or high speed measurements at video frame rates. Parallel data acquisition at each pixel provides high spatial resolution independent of the operating speed. The range imaging system uses a heterodyne technique to indirectly measure time of flight. Laser diodes with highly diverging beams are intensity modulated at radio frequencies and used to illuminate the scene. Reflected light is focused on to an image intensifier used as a high speed optical shutter, which is modulated at a slightly different frequency to that of the laser source. The output from the shutter is a low frequency beat signal, which is sampled by a digital video camera. Optical propagation delay is encoded into the phase of the beat signal, hence from a captured time variant intensity sequence, the beat signal phase can be measured to determine range for every pixel in the scene. A direct digital synthesiser (DDS) is designed and constructed, capable of generating up to three outputs at frequencies beyond 100 MHz with the relative frequency stability in excess of nine orders of magnitude required to control the laser and shutter modulation. Driver circuits were also designed to modulate the image intensifier photocathode at 50 Vpp, and four laser diodes with a combined power output of 320 mW, both over a frequency range of 10-100 MHz. The DDS, laser, and image intensifier response are characterised. A unique method of measuring the image intensifier optical modulation response is developed, requiring the construction of a pico-second pulsed laser source. This characterisation revealed deficiencies in the measured responses, which were mitigated through hardware modifications where possible. The effects of remaining imperfections, such as modulation waveform harmonics and image intensifier irising, can be calibrated and removed from the range measurements during software processing using the characterisation data. Finally, a digital method of generating the high frequency modulation signals using a FPGA to replace the analogue DDS is developed, providing a highly integrated solution, reducing the complexity, and enhancing flexibility. In addition, a novel modulation coding technique is developed to remove the undesirable influence of waveform harmonics from the range measurement without extending the acquisition time. When combined with a proposed modification to the laser illumination source, the digital system can enhance range measurement precision and linearity. From this work, a flexible full-field image ranging system is successfully realised. The system is demonstrated operating in a high precision mode with sub-millimetre depth resolution, and also in a high speed mode operating at video update rates (25 fps), in both cases providing high (512 512) spatial resolution over distances of several metres

Optical Synchronization of Time-of-Flight Cameras

Time-of-Flight (ToF)-Kameras erzeugen Tiefenbilder (3D-Bilder), indem sie Infrarotlicht aussenden und die Zeit messen, bis die Reflexion des Lichtes wieder empfangen wird. Durch den Einsatz mehrerer ToF-Kameras können ihre vergleichsweise geringere Auflösungen überwunden, das Sichtfeld vergrößert und Verdeckungen reduziert werden. Der gleichzeitige Betrieb birgt jedoch die Möglichkeit von Störungen, die zu fehlerhaften Tiefenmessungen führen. Das Problem der gegenseitigen Störungen tritt nicht nur bei Mehrkamerasystemen auf, sondern auch wenn mehrere unabhängige ToF-Kameras eingesetzt werden. In dieser Arbeit wird eine neue optische Synchronisation vorgestellt, die keine zusätzliche Hardware oder Infrastruktur erfordert, um ein Zeitmultiplexverfahren (engl. Time-Division Multiple Access, TDMA) für die Anwendung mit ToF-Kameras zu nutzen, um so die Störungen zu vermeiden. Dies ermöglicht es einer Kamera, den Aufnahmeprozess anderer ToF-Kameras zu erkennen und ihre Aufnahmezeiten schnell zu synchronisieren, um störungsfrei zu arbeiten. Anstatt Kabel zur Synchronisation zu benötigen, wird nur die vorhandene Hardware genutzt, um eine optische Synchronisation zu erreichen. Dazu wird die Firmware der Kamera um das Synchronisationsverfahren erweitert. Die optische Synchronisation wurde konzipiert, implementiert und in einem Versuchsaufbau mit drei ToF-Kameras verifiziert. Die Messungen zeigen die Wirksamkeit der vorgeschlagenen optischen Synchronisation. Während der Experimente wurde die Bildrate durch das zusätzliche Synchronisationsverfahren lediglich um etwa 1 Prozent reduziert.Time-of-Flight (ToF) cameras produce depth images (three-dimensional images) by measuring the time between the emission of infrared light and the reception of its reflection. A setup of multiple ToF cameras may be used to overcome their comparatively low resolution, increase the field of view, and reduce occlusion. However, the simultaneous operation of multiple ToF cameras introduces the possibility of interference resulting in erroneous depth measurements. The problem of interference is not only related to a collaborative multicamera setup but also to multiple ToF cameras operating independently. In this work, a new optical synchronization for ToF cameras is presented, requiring no additional hardware or infrastructure to utilize a time-division multiple access (TDMA) scheme to mitigate interference. It effectively enables a camera to sense the acquisition process of other ToF cameras and rapidly synchronizes its acquisition times to operate without interference. Instead of requiring cables to synchronize, only the existing hardware is utilized to enable an optical synchronization. To achieve this, the camera’s firmware is extended with the synchronization procedure. The optical synchronization has been conceptualized, implemented, and verified with an experimental setup deploying three ToF cameras. The measurements show the efficacy of the proposed optical synchronization. During the experiments, the frame rate was reduced by only about 1% due to the synchronization procedure