Dual-Band Transmitter and Receiver with Bowtie-Antenna in 0.13 μm SiGe BiCMOS for Gas Spectroscopy at 222 - 270 GHz

This paper presents a transmitter (TX) and a receiver (RX) with bowtie-antenna and silicon lens for gas spectroscopy at 222-270 GHz, which are fabricated in IHP’s 0.13 μm SiGe BiCMOS technology. The TX and RX use two integrated local oscillators for 222 – 256 GHz and 250 – 270 GHz, which are switched for dual-band operation. Due to its directivity of about 27 dBi, the single integrated bowtie-antenna with silicon lens enables an EIRP of about 25 dBm for the TX, and therefore a considerably higher EIRP for the 2-band TX compared to previously reported systems. The double sideband noise temperature of the RX is 20,000 K (18.5 dB noise figure) as measured by the Y-factor method. Absorption spectroscopy of gaseous methanol is used as a measure for the performance of the gas spectroscopy system with TX- and RX-modules

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

This invited paper reviews the progress of silicon–germanium (SiGe) bipolar-complementary metal–oxide–semiconductor (BiCMOS) technology-based integrated circuits (ICs) during the last two decades. Focus is set on various transceiver (TRX) realizations in the millimeter-wave range from 60 GHz and at terahertz (THz) frequencies above 300 GHz. This article discusses the development of SiGe technologies and ICs with the latter focusing on the commercially most important applications of radar and beyond 5G wireless communications. A variety of examples ranging from 77-GHz automotive radar to THz sensing as well as the beginnings of 60-GHz wireless communication up to THz chipsets for 100-Gb/s data transmission are recapitulated. This article closes with an outlook on emerging fields of research for future advancement of SiGe TRX performance

Terahertz Sources, Detectors, and Transceivers in Silicon Technologies

With active devices lingering on the brink of activity and every passive device and interconnection on chip acting as potential radiator, a paradigm shift from “top-down” to “bottom-up” approach in silicon terahertz (THz) circuit design is clearly evident as we witness orders-of-magnitude improvements of silicon THz circuits in terms of output power, phase noise, and sensitivity since their inception around 2010. That is, the once clear boundary between devices, circuits, and function blocks is getting blurrier as we push the devices toward their limits. And when all else fails to meet the system requirements, which is often the case, a logical step forward is to scale these THz circuits to arrays. This makes a lot of sense in the terahertz region considering the relatively efficient on-chip THz antennas and the reduced size of arrays with half-wavelength pitch. This chapter begins with the derivation of conditions for maximizing power gain of active devices. Discussions of circuit topologies for THz sources, detectors, and transceivers with emphasis on their efficacy and scalability ensue, and this chapter concludes with a brief survey of interface options for channeling THz energy out of the chip

High performance antenna-on-chip inspired by SIW and metasurface technologies for THz band operation

In this paper, a high-performance antenna-on-chip (AoC) is implemented on gallium arsenide (GaAs) wafer based on the substrate integrated waveguide (SIW) and metasurface (MTS) technologies for terahertz band applications. The proposed antenna is constructed using five stacked layers comprising metal-GaAs-metal-GaAs-metal. The conductive electromagnetic radiators are implemented on the upper side of the top GaAs layer, which has a metallic ground-plane at its underside. The metallic feedline is implemented at the underside of the bottom GaAs layer. Dual wrench-shaped radiators are framed by metallic vias connected to the ground-plane to create SIW cavity. This technique mitigates the surface waves and the substrate losses, thereby improving the antenna’s radiation characteristics. The antenna is excited by a T-shaped feedline implemented on the underside of the bottom GaAs substrate layer. Electromagnetic (EM) energy from the feedline is coupled to the radiating elements through the circular and linear slots etched in the middle ground-plane layer. To mitigate the surface-wave interactions and the substrate losses in the bottom GaAs layer, the feedline is contained inside a SIW cavity. To enhance the antenna’s performance, the radiators are transformed into a metamaterial-inspired surface (i.e., metasurface), by engraving periodic arrangement of circular slots of sub-wavelength diameter and periodicity. Essentially, the slots act as resonant scatterers, which control the EM response of the surface. The antenna of dimensions of 400 × 400 × 8 μm3 is demonstrated to operate over a wide frequency range from 0.445 to 0.470 THz having a bandwidth of 25 GHz with an average return-loss of − 27 dB. The measured average gain and radiation efficiency are 4.6 dBi and 74%, respectively. These results make the proposed antenna suitable for AoC terahertz applications

High performance antenna‑on‑chip inspired by SIW and metasurface technologies for THz band operation

In this paper, a high-performance antenna-on-chip (AoC) is implemented on gallium arsenide (GaAs) wafer based on the substrate integrated waveguide (SIW) and metasurface (MTS) technologies for terahertz band applications. The proposed antenna is constructed using five stacked layers comprising metal-GaAs-metal-GaAs-metal. The conductive electromagnetic radiators are implemented on the upper side of the top GaAs layer, which has a metallic ground-plane at its underside. The metallic feedline is implemented at the underside of the bottom GaAs layer. Dual wrench-shaped radiators are framed by metallic vias connected to the ground-plane to create SIW cavity. This technique mitigates the surface waves and the substrate losses, thereby improving the antenna’s radiation characteristics. The antenna is excited by a T-shaped feedline implemented on the underside of the bottom GaAs substrate layer. Electromagnetic (EM) energy from the feedline is coupled to the radiating elements through the circular and linear slots etched in the middle ground-plane layer. To mitigate the surface wave interactions and the substrate losses in the bottom GaAs layer, the feedline is contained inside a SIW cavity. To enhance the antenna’s performance, the radiators are transformed into a metamaterial inspired surface (i.e., metasurface), by engraving periodic arrangement of circular slots of subwavelength diameter and periodicity. Essentially, the slots act as resonant scatterers, which control the EM response of the surface. The antenna of dimensions of 400 × 400 × 8 μm3 is demonstrated to operate over a wide frequency range from 0.445 to 0.470 THz having a bandwidth of 25 GHz with an average return-loss of − 27 dB. The measured average gain and radiation efficiency are 4.6 dBi and 74%, respectively. These results make the proposed antenna suitable for AoC terahertz applications

SILICON TERAHERTZ ELECTRONICS: CIRCUITS AND SYSTEMS FOR FUTURE APPLICATIONS

The terahertz frequency bands are gaining increasing attention these days for the potential applications in imaging, sensing, spectroscopy, and communication. These applications can be used in a wide range of fields, such as military, security, biomedical analysis, material science, astronomy, etc. Unfortunately, utilizing these frequency bands is very challenging due to the notorious ”terahertz gap”. Consequently, current terahertz systems are very bulky and expensive, sometimes even require cryogenic conditions. Silicon terahertz electronics now becomes very attractive, since it can achieve significantly lower cost and make portable consumer terahertz devices feasible. However, due to the limited device fmax and low breakdown voltage, signal generation and processing on silicon platform in this frequency range is challenging. This thesis aims to tackle these challenges and implement high-performance terahertz systems. First of all, the devices are investigated under the terahertz frequency range and optimum termination conditions for maximizing the efficacy of the devices is derived. Then, novel passive surrounding networks are designed to provide the devices with the optimal termination conditions to push the performances of the terahertz circuit blocks. Finally, the high-performance circuit blocks are used to build terahertz systems, and system-level innovations are also proposed to push the state of the art forward. In Chapter 2, using a device-centric bottom-up design method, a 210-GHz harmonic oscillator is designed. With the parasitic tuning mechanism, a wide frequency tuning range is achieved without using lossy varactors. A passive network based on the return-path gap coupler and self-feeding structure is also designed to provide optimal terminations for the active devices to maximize the harmonic power generation. Fabricated with a 0.13-um SiGe BiCMOS process, the oscillator is highly compact with a core size of only 290x95 um2. The output frequency can be tuned from 197.5 GHz to 219.7 GHz, which is around 10.6% compared to the center frequency. It also achieves a peak output power and dc-to-RF efficiency of 1.4 dBm and 2.4%, respectively. The measured output phase noise at 1 MHz offset is -87.5 dBc/Hz. The high power, wide tuning range, low phase noise, as well as compact size, make this oscillator very suitable for terahertz systems integration. In Chapter 3, the design of a 320-GHz fully-integrated terahertz imaging system is described. The system is composed of a phase-locked high-power transmitter and a coherent high-sensitivity subharmonic-mixing receiver, which are fabricated using a 0.13-um SiGe BiCMOS technology. To enhance the imaging sensitivity, a heterodyne coherent detection scheme is utilized. To obtain frequency coherency, fully-integrated phase-locked loops are implemented on both the transmitter and receiver chips. According to the measurement, consuming a total dc power of 605 mW, the transmitter chip achieves a peak radiated power of 2 mW and a peak EIRP of 21.1 dBm. The receiver chip achieves an equivalent incoherent responsivity of more than 7.26 MV/W and a sensitivity of 70.1 pW under an integration bandwidth of 1 kHz, with a total dc power consumption of 117 mW. The achieved sensitivity with this proposed coherent imaging transceiver is around ten times better compared with other state-of-the-art incoherent imagers. In Chapter 4, a spatial-orthogonal ASK transmitter architecture for high-speed terahertz wireless communication is presented. The self-sustaining oscillator-based transmitter architecture has an ultra-compact size and excellent power efficiency. With the proposed high-speed constant-load switch, significantly reduced modulation loss is achieved. Using polarization diversity and multi-level modulation, the throughput is largely enhanced. Array configuration is also adopted to enhance the link budget for higher signal quality and longer communication range. Fabricated in a 0.13-um SiGe BiCMOS technology, the 220-GHz transmitter prototype achieves an EIRP of 21 dBm and dc-to- THz-radiation efficiency of 0.7% in each spatial channel. A 24.4-Gb/s total data rate over a 10-cm communication range is demonstrated. With an external Teflon lens system, the demonstrated communication range is further extended to 52 cm. Compared with prior art, this prototype demonstrates much higher transmitter efficiency. In Chapter 5, an entirely-on-chip frequency-stabilization feedback mechanism is proposed, which avoids the use of both frequency dividers and off-chip references, achieving much lower system integration cost and power consumption. Using this mechanism, a 301.7-to-331.8-GHz source prototype is designed in a 0.13-um SiGe BiCMOS technology. According to the measurement, the source consumes a dc power of only 51.7 mW. The output phase noise is -71.1 and -75.2 dBc/Hz at 100 kHz and 1 MHz offset, respectively. A -13.9-dBm probed output power is also achieved. Overall, the prototype source demonstrates the largest output frequency range and lowest power consumption while achieving comparable phase noise and output power performances with respect to the state of the art. All the designs demonstrated in this thesis achieve good performances and push the state of the art forward, paving the way for implementation of more sophisticated terahertz circuits and systems for future applications

0.42 THz Transmitter with Dielectric Resonator Array Antenna

Off chip antennas do not occupy the expensive die area, as there is no limitation on their building material, and can be built in any size and shape to match the system requirements, which are all in contrast to on-chip antenna solutions. However, integration of off-chip antennas with Monolithic-Microwave-Integrated Chips (MMIC) and designing a low loss signal transmission from the signal source inside the MMIC to the antenna module is a major challenge and trade off. High resistivity silicon (HRS), is a low cost and extremely low loss material at sub-THz. It has become a prevailing material in fabrication of passive components for THz applications. This work makes use of HRS to build an off-chip Dielectric Resonator Antenna Array Module (DRAAM) to realize a highly efficient transmitter at 420 GHz. This work proposes novel techniques and solutions for design and integration of DRRAM with MMIC as the signal source. A proposed scalable 4×4 antenna structure aligns DRRAM on top of MMIC within 2 μm accuracy through an effortless assembly procedure. DRAAM shows 15.8 dB broadside gain and 0.85 efficiency. DRAs in the DRAAM are differentially excited through aperture coupling. Differential excitation not only inherently provides a mechanism to deliver more power to the antenna, it also removes the additional loss of extra balluns when outputs are differential inside MMIC. In addition, this work proposes a technique to double the radiation power from each DRA. Same radiating mode at 0.42 THz inside every DRA is excited through two separate differential sources. This approach provides an almost loss-less power combining mechanism inside DRA. Two 140_GHz oscillators followed by triplers drive each DRA in the demonstrated 4×4 antenna array. Each oscillator generates 7.2 dBm output power at 140 GHz with -83 dBc/Hz phase noise at 100 KHz and consumes 25 mW of power. An oscillator is followed by a tripler that generates -8 dBm output power at 420 GHz. Oscillator and tripler circuits use a smart layer stack up arrangement for their passive elements where the top metal layer of the die is grounded to comply with the planned integration arrangement. This work shows a novel circuit topology for exciting the antenna element which creates the feed element part of the tuned load for the tripler circuit, therefore eliminates the loss of the transition component, and maximizes the output power delivered to the antenna. The final structure is composed of 32 injection locked oscillators and drives a 4×4 DRAAM achieves 22.8 dBm EIRP

Silicon-Based Terahertz Circuits and Systems

The Terahertz frequency range, often referred to as the `Terahertz' gap, lies wedged between microwave at the lower end and infrared at the higher end of the spectrum, occupying frequencies between 0.3-3.0 THz. For a long time, applications in THz frequencies had been limited to astronomy and chemical sciences, but with advancement in THz technology in recent years, it has shown great promise in a wide range of applications ranging from disease diagnostics, non-invasive early skin cancer detection, label-free DNA sequencing to security screening for concealed weapons and contraband detection, global environmental monitoring, nondestructive quality control and ultra-fast wireless communication. Up until recently, the terahertz frequency range has been mostly addressed by high mobility compound III-V processes, expensive nonlinear optics, or cryogenically cooled quantum cascade lasers. A low cost, room temperature alternative can enable the development of such a wide array of applications, not currently accessible due to cost and size limitations. In this thesis, we will discuss our approach towards development of integrated terahertz technology in silicon-based processes. In the spirit of academic research, we will address frequencies close to 0.3 THz as 'Terahertz'. In this thesis, we address both fronts of integrated THz systems in silicon: THz power generation, radiation and transmitter systems, and THz signal detection and receiver systems. THz power generation in silicon-based integrated circuit technology is challenging due to lower carrier mobility, lower cut-o frequencies compared to compound III-V processes, lower breakdown voltages and lossy passives. Radiation from silicon chip is also challenging due to lossy substrates and high dielectric constant of silicon. In this work, we propose novel ways of combining circuit and electromagnetic techniques in a holistic design approach, which can overcome limitations of conventional block-by-block or partitioned design methodology, in order to generate high-frequency signals above the classical definition of cut-off frequencies (ƒt/ƒmax). We demonstrate this design philosophy in an active electromagnetic structure, which we call Distributed Active Radiator. It is inspired by an Inverse Maxwellian approach, where instead of using classical circuit and electromagnetic blocks to generate and radiate THz frequencies, we formulate surface (metal) currents in silicon chip for a desired THz field prole and develop active means of controlling different harmonic currents to perform signal generation, frequency multiplication, radiation and lossless filtering, simultaneously in a compact footprint. By removing the articial boundaries between circuits, electromagnetics and antenna, we open ourselves to a broader design space. This enabled us to demonstrate the rst 1 mW Eective-isotropic-radiated-power(EIRP) THz (0.29 THz) source in CMOS with total radiated power being three orders of magnitude more than previously demonstrated. We also proposed a near-field synchronization mechanism, which is a scalable method of realizing large arrays of synchronized autonomous radiating sources in silicon. We also demonstrate the first THz CMOS array with digitally controlled beam-scanning in 2D space with radiated output EIRP of nearly 10 mW at 0.28 THz. On the receiver side, we use a similar electronics and electromagnetics co-design approach to realize a 4x4 pixel integrated silicon Terahertz camera demonstrating to the best of our knowledge, the most sensitive silicon THz detector array without using post-processing, silicon lens or high-resistivity substrate options (NEP &lt; 10 pW &#8730; Hz at 0.26 THz). We put the 16 pixel silicon THz camera together with the CMOS DAR THz power generation arrays and demonstrated, for the first time, an all silicon THz imaging system with a CMOS source.</p