Optimal Power Delivery Strategy in Modern VLSI Design

Department of Electrical EngineeringIn a modern very-large-scale integration (VLSI) designs, heterogeneous architectural structures and various three-dimensional (3D) integration methods have been used in a hybrid manner. Recently, the industry has combined 3D VLSI technology with the heterogeneous technology of modern VLSI called chiplet. The 3D heterogeneous architectural structure is growing attention because it reduces costs and time-to-market by increasing manufacturing yield with high integration rate and modularization. However, a main design concern of heterogeneous 3D architectural structure is power management for lowering power consumption with maintaining the required power integrity from IR drop. Although the low-power design can be realized in front-end-of-line level by reduced power supply complementary metal???oxide???semiconductor technologies, the overall low-power system performance is available with a proper design of power delivery network (PDN) for chip-level modules and system-level architectural structure. Thus, there is a demand for both the coanalysis and optimization for both chip-level and system-level. We analyzed and optimized power delivery on-chip in various 3D integration environments, and we also have proposed a chip-package-PCB coanalysis methodology at the system level. For through-silicon-via (TSV)-based 3D integration circuit (IC), We have investigated and analyzed the voltage noise in a multi-layer 3D stacking with partial element equivalent circuit (PEEC)-based on-chip PDN and frequency-dependent TSV models. We also have proposed a wire-added multi-paired on-chip PDN structure to reduce voltage noise to reduce IR drop. The performance of TSV-based 3D ICs has also been improved by reducing wake-up time through our proposed adaptive power gating strategy with tapered TSVs. For die-to-wafer 3D IC, we have proposed a power delivery pathfinding methodology, which seeks to identify a nearly optimal PDN for a given design and PDN specification. Our pathfinding methodology exploits models for routability and worst IR drop, which helps reducing iterations between PDN design and circuit design in 3D IC implementation. We also have extended the observation to system-level, we have proposed a power integrity coanalysis methodology for multiple power domains in high-frequency memory systems. Our coanalysis methodology can analyze the tendencies in power integrity by using parametric methods with consideration of package-on-package integration. We have proved that our methodology can predict similar peak-to-peak ripple voltages that are comparable with the realistic simulations of high-speed low-power memory interfaces. Finally, we have proposed analysis and optimization methodologies that are generally applicable to various integration methods used in modern VLSI designs as computer-aided-design-based solutions.clos

Remote Attacks on FPGA Hardware

Immer mehr Computersysteme sind weltweit miteinander verbunden und über das Internet zugänglich, was auch die Sicherheitsanforderungen an diese erhöht. Eine neuere Technologie, die zunehmend als Rechenbeschleuniger sowohl für eingebettete Systeme als auch in der Cloud verwendet wird, sind Field-Programmable Gate Arrays (FPGAs). Sie sind sehr flexible Mikrochips, die per Software konfiguriert und programmiert werden können, um beliebige digitale Schaltungen zu implementieren. Wie auch andere integrierte Schaltkreise basieren FPGAs auf modernen Halbleitertechnologien, die von Fertigungstoleranzen und verschiedenen Laufzeitschwankungen betroffen sind. Es ist bereits bekannt, dass diese Variationen die Zuverlässigkeit eines Systems beeinflussen, aber ihre Auswirkungen auf die Sicherheit wurden nicht umfassend untersucht. Diese Doktorarbeit befasst sich mit einem Querschnitt dieser Themen: Sicherheitsprobleme die dadurch entstehen wenn FPGAs von mehreren Benutzern benutzt werden, oder über das Internet zugänglich sind, in Kombination mit physikalischen Schwankungen in modernen Halbleitertechnologien. Der erste Beitrag in dieser Arbeit identifiziert transiente Spannungsschwankungen als eine der stärksten Auswirkungen auf die FPGA-Leistung und analysiert experimentell wie sich verschiedene Arbeitslasten des FPGAs darauf auswirken. In der restlichen Arbeit werden dann die Auswirkungen dieser Spannungsschwankungen auf die Sicherheit untersucht. Die Arbeit zeigt, dass verschiedene Angriffe möglich sind, von denen früher angenommen wurde, dass sie physischen Zugriff auf den Chip und die Verwendung spezieller und teurer Test- und Messgeräte erfordern. Dies zeigt, dass bekannte Isolationsmaßnahmen innerhalb FPGAs von böswilligen Benutzern umgangen werden können, um andere Benutzer im selben FPGA oder sogar das gesamte System anzugreifen. Unter Verwendung von Schaltkreisen zur Beeinflussung der Spannung innerhalb eines FPGAs zeigt diese Arbeit aktive Angriffe, die Fehler (Faults) in anderen Teilen des Systems verursachen können. Auf diese Weise sind Denial-of-Service Angriffe möglich, als auch Fault-Angriffe um geheime Schlüsselinformationen aus dem System zu extrahieren. Darüber hinaus werden passive Angriffe gezeigt, die indirekt die Spannungsschwankungen auf dem Chip messen. Diese Messungen reichen aus, um geheime Schlüsselinformationen durch Power Analysis Seitenkanalangriffe zu extrahieren. In einer weiteren Eskalationsstufe können sich diese Angriffe auch auf andere Chips auswirken die an dasselbe Netzteil angeschlossen sind wie der FPGA. Um zu beweisen, dass vergleichbare Angriffe nicht nur innerhalb FPGAs möglich sind, wird gezeigt, dass auch kleine IoT-Geräte anfällig für Angriffe sind welche die gemeinsame Spannungsversorgung innerhalb eines Chips ausnutzen. Insgesamt zeigt diese Arbeit, dass grundlegende physikalische Variationen in integrierten Schaltkreisen die Sicherheit eines gesamten Systems untergraben können, selbst wenn der Angreifer keinen direkten Zugriff auf das Gerät hat. Für FPGAs in ihrer aktuellen Form müssen diese Probleme zuerst gelöst werden, bevor man sie mit mehreren Benutzern oder mit Zugriff von Drittanbietern sicher verwenden kann. In Veröffentlichungen die nicht Teil dieser Arbeit sind wurden bereits einige erste Gegenmaßnahmen untersucht

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Distributed IC Power Delivery: Stability-Constrained Design Optimization and Workload-Aware Power Management

ABSTRACT Power delivery presents key design challenges in today’s systems ranging from high performance micro-processors to mobile systems-on-a-chips (SoCs). A robust power delivery system is essential to ensure reliable operation of on-die devices. Nowadays it has become an important design trend to place multiple voltage regulators on-chip in a distributive manner to cope with power supply noise. However, stability concern arises because of the complex interactions be-tween multiple voltage regulators and bulky network of the surrounding passive parasitics. The recently developed hybrid stability theorem (HST) is promising to deal with the stability of such system by efficiently capturing the effects of all interactions, however, large overdesign and hence severe performance degradation are caused by the intrinsic conservativeness of the underlying HST framework. To address such challenge, this dissertation first extends the HST by proposing a frequency-dependent system partitioning technique to substantially reduce the pessimism in stability evaluation. By systematically exploring the theoretical foundation of the HST framework, we recognize all the critical constraints under which the partitioning technique can be performed rigorously to remove conservativeness while maintaining key theoretical properties of the partitioned subsystems. Based on that, we develop an efficient stability-ensuring automatic design flow for large power delivery systems with distributed on-chip regulation. In use of the proposed approach, we further discover new design insights for circuit designers such as how regulator topology, on-chip decoupling capacitance, and the number of integrated voltage regulators can be optimized for improved system tradeoffs between stability and performances. Besides stability, power efficiency must be improved in every possible way while maintaining high power quality. It can be argued that the ultimate power integrity and efficiency may be best achieved via a heterogeneous chain of voltage processing starting from on-board switching voltage regulators (VRs), to on-chip switching VRs, and finally to networks of distributed on-chip linear VRs. As such, we propose a heterogeneous voltage regulation (HVR) architecture encompassing regulators with complimentary characteristics in response time, size, and efficiency. By exploring the rich heterogeneity and tunability in HVR, we develop systematic workload-aware control policies to adapt heterogeneous VRs with respect to workload change at multiple temporal scales to significantly improve system power efficiency while providing a guarantee for power integrity. The proposed techniques are further supported by hardware-accelerated machine learning prediction of non-uniform spatial workload distributions for more accurate HVR adaptation at fine time granularity. Our evaluations based on the PARSEC benchmark suite show that the proposed adaptive 3-stage HVR reduces the total system energy dissipation by up to 23.9% and 15.7% on average compared with the conventional static two-stage voltage regulation using off- and on-chip switching VRs. Compared with the 3-stage static HVR, our runtime control reduces system energy by up to 17.9% and 12.2% on average. Furthermore, the proposed machine learning prediction offers up to 4.1% reduction of system energy

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Physical design methodologies for monolithic 3D ICs

The objective of this research is to develop physical design methodologies for monolithic 3D ICs and use them to evaluate the improvements in the power-performance envelope offered over 2D ICs. In addition, design-for-test (DfT) techniques essential for the adoption of shorter term through-silicon-via (TSV) based 3D ICs are explored. Testing of TSV-based 3D ICs is one of the last challenges facing their commercialization. First, a pre-bond testable 3D scan chain construction technique is developed. Next, a transition-delay-fault test architecture is presented, along with a study on how to mitigate IR-drop. Finally, to facilitate partitioning, a quick and accurate framework for test-TSV estimation is developed. Block-level monolithic 3D ICs will be the first to emerge, as significant IP can be reused. However, no physical design flows exist, and hence a monolithic 3D floorplanning framework is developed. Next, inter-tier performance differences that arise due to the not yet mature fabrication process are investigated and modeled. Finally, an inter-tier performance-difference aware floorplanner is presented, and it is demonstrated that high quality 3D floorplans are achievable even under these inter-tier differences. Monolithic 3D offers sufficient integration density to place individual gates in three dimensions and connect them together. However, no tools or techniques exist that can take advantage of the high integration density offered. Therefore, a gate-level framework that leverages existing 2D ICs tools is presented. This framework also provides congestion modeling and produces results that minimize routing congestion. Next, this framework is extended to commercial 2D IC tools, so that steps such as timing optimization and clock tree synthesis can be applied. Finally, a voltage-drop-aware partitioning technique is presented that can alleviate IR-drop issues, without any impact on the performance or maximum operating temperature of the chip.Ph.D

Study of Layout Techniques in Dynamic Logic Circuitry for Single Event Effect Mitigation

Dynamic logic circuits are highly suitable for high-speed applications, considering the fact that they have a smaller area and faster transition. However, their application in space or other radiation-rich environments has been significantly inhibited by their susceptibility to radiation effects. This work begins with the basic operations of dynamic logic circuits, elaborates upon the physics underlying their radiation vulnerability, and evaluates three techniques that harden dynamic logic from the layout: drain extension, pulse quenching, and a proposed method. The drain extension method adds an extra drain to the sensitive node in order to improve charge sharing, the pulse quenching scheme utilizes charge sharing by duplicating a component that offsets the transient pulse, and the proposed technique takes advantage of both. Domino buffers designed using these three techniques, along with a conventional design as reference, were modeled and simulated using a 3D TCAD tool. Simulation results confirm a significant reduction of soft error rate in the proposed technique and suggest a greater reduction with angled incidence. A 130 nm chip containing designed buffer and register chains was fabricated and tested with heavy ion irradiation. According to the experiment results, the proposed design achieved 30% soft error rate reduction, with 19%, 20%, and 10% overhead in speed, power, and area, respectively

Secure Physical Design

An integrated circuit is subject to a number of attacks including information leakage, side-channel attacks, fault-injection, malicious change, reverse engineering, and piracy. Majority of these attacks take advantage of physical placement and routing of cells and interconnects. Several measures have already been proposed to deal with security issues of the high level functional design and logic synthesis. However, to ensure end-to-end trustworthy IC design flow, it is necessary to have security sign-off during physical design flow. This paper presents a secure physical design roadmap to enable end-to-end trustworthy IC design flow. The paper also discusses utilization of AI/ML to establish security at the layout level. Major research challenges in obtaining a secure physical design are also discussed