Balancing reliability, cost, and performance tradeoffs with FreeFault

Abstract—Memory errors have been a major source of system failures and fault rates may rise even further as memory continues to scale. This increasing fault rate, especially when combined with advent of integrated on-package memories, may exceed the capabilities of traditional fault tolerance mecha-nisms or significantly increase their overhead. In this paper, we present FreeFault as a hardware-only, transparent, and nearly-free resilience mechanism that is implemented entirely within a processor and can tolerate the majority of DRAM faults. FreeFault repurposes portions of the last-level cache for storing retired memory regions and augments a hardware memory scrubber to monitor memory health and aid retirement decisions. Because it relies on existing structures (cache associativity) for retirement/remapping type repair, FreeFault has essentially no hardware overhead. Because it requires a very modest portion of the cache (as small as 8KB) to cover a large fraction of DRAM faults, FreeFault has almost no impact on performance. We explain how FreeFault adds an attractive layer in an overall resilience scheme of highly-reliable and highly-available systems by delaying, and even entirely avoiding, calling upon software to make tradeoff decisions between memory capacity, performance, and reliability. I

Feasibility study for a numerical aerodynamic simulation facility. Volume 1

A Numerical Aerodynamic Simulation Facility (NASF) was designed for the simulation of fluid flow around three-dimensional bodies, both in wind tunnel environments and in free space. The application of numerical simulation to this field of endeavor promised to yield economies in aerodynamic and aircraft body designs. A model for a NASF/FMP (Flow Model Processor) ensemble using a possible approach to meeting NASF goals is presented. The computer hardware and software are presented, along with the entire design and performance analysis and evaluation

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Techniques for the realization of ultrareliable spaceborne computers Interim scientific report

Error-free ultrareliable spaceborne computer

Autonomous Recovery Of Reconfigurable Logic Devices Using Priority Escalation Of Slack

Field Programmable Gate Array (FPGA) devices offer a suitable platform for survivable hardware architectures in mission-critical systems. In this dissertation, active dynamic redundancy-based fault-handling techniques are proposed which exploit the dynamic partial reconfiguration capability of SRAM-based FPGAs. Self-adaptation is realized by employing reconfiguration in detection, diagnosis, and recovery phases. To extend these concepts to semiconductor aging and process variation in the deep submicron era, resilient adaptable processing systems are sought to maintain quality and throughput requirements despite the vulnerabilities of the underlying computational devices. A new approach to autonomous fault-handling which addresses these goals is developed using only a uniplex hardware arrangement. It operates by observing a health metric to achieve Fault Demotion using Recon- figurable Slack (FaDReS). Here an autonomous fault isolation scheme is employed which neither requires test vectors nor suspends the computational throughput, but instead observes the value of a health metric based on runtime input. The deterministic flow of the fault isolation scheme guarantees success in a bounded number of reconfigurations of the FPGA fabric. FaDReS is then extended to the Priority Using Resource Escalation (PURE) online redundancy scheme which considers fault-isolation latency and throughput trade-offs under a dynamic spare arrangement. While deep-submicron designs introduce new challenges, use of adaptive techniques are seen to provide several promising avenues for improving resilience. The scheme developed is demonstrated by hardware design of various signal processing circuits and their implementation on a Xilinx Virtex-4 FPGA device. These include a Discrete Cosine Transform (DCT) core, Motion Estimation (ME) engine, Finite Impulse Response (FIR) Filter, Support Vector Machine (SVM), and Advanced Encryption Standard (AES) blocks in addition to MCNC benchmark circuits. A iii significant reduction in power consumption is achieved ranging from 83% for low motion-activity scenes to 12.5% for high motion activity video scenes in a novel ME engine configuration. For a typical benchmark video sequence, PURE is shown to maintain a PSNR baseline near 32dB. The diagnosability, reconfiguration latency, and resource overhead of each approach is analyzed. Compared to previous alternatives, PURE maintains a PSNR within a difference of 4.02dB to 6.67dB from the fault-free baseline by escalating healthy resources to higher-priority signal processing functions. The results indicate the benefits of priority-aware resiliency over conventional redundancy approaches in terms of fault-recovery, power consumption, and resource-area requirements. Together, these provide a broad range of strategies to achieve autonomous recovery of reconfigurable logic devices under a variety of constraints, operating conditions, and optimization criteria

The 1991 3rd NASA Symposium on VLSI Design

Papers from the symposium are presented from the following sessions: (1) featured presentations 1; (2) very large scale integration (VLSI) circuit design; (3) VLSI architecture 1; (4) featured presentations 2; (5) neural networks; (6) VLSI architectures 2; (7) featured presentations 3; (8) verification 1; (9) analog design; (10) verification 2; (11) design innovations 1; (12) asynchronous design; and (13) design innovations 2

Intelligent LED Display

The goal of this project is to increase the overall redundancy, and ease-of-use during installation and operation, of large-format LED video displays for the professional touring and outdoor display industry. Using design concepts found in large-scale redundant networks, the system dynamically scales video output to the LED display and provides adaptive real-time fault detection and failover behaviors to ensure reliability in rigorous outdoor environments. This ultimately simplifies installation of a system, eliminating the need for the individual addressing of panels and alignment of video content. The designed system is inherently redundant and the ability to sustain failure of its components increases with the size of the display making it ideal for live applications

A Holistic Solution for Reliability of 3D Parallel Systems

As device scaling slows down, emerging technologies such as 3D integration and carbon nanotube field-effect transistors are among the most promising solutions to increase device density and performance. These emerging technologies offer shorter interconnects, higher performance, and lower power. However, higher levels of operating temperatures and current densities project significantly higher failure rates. Moreover, due to the infancy of the manufacturing process, high variation, and defect densities, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Silicon-based transistors. The goal of this dissertation is to introduce new architectural and circuit techniques that can work around high-fault rates in the emerging 3D technologies, improving performance and reliability comparable to Silicon. We propose a new holistic approach to the reliability problem that addresses the necessary aspects of an effective solution such as detection, diagnosis, repair, and prevention synergically for a practical solution. By leveraging 3D fabric layouts, it proposes the underlying architecture to efficiently repair the system in the presence of faults. This thesis presents a fault detection scheme by re-executing instructions on idle identical units that distinguishes between transient and permanent faults while localizing it to the granularity of a pipeline stage. Furthermore, with the use of a dynamic and adaptive reconfiguration policy based on activity factors and temperature variation, we propose a framework that delivers a significant improvement in lifetime management to prevent faults due to aging. Finally, a design framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up Carbon Nano Tube-based technology is presented. The proposed framework is capable of efficiently supporting high-variation technologies by providing protection against manufacturing defects at different granularities: module and pipeline-stage levels.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168118/1/javadb_1.pd

Bio-inspired cellular machines:towards a new electronic paper architecture

Information technology has only been around for about fifty years. Although the beginnings of automatic calculation date from as early as the 17th century (W. Schickard built the first mechanical calculator in 1623), it took the invention of the transistor by W. Shockley, J. Bardeen and W. Brattain in 1947 to catapult calculators out of the laboratory and produce the omnipresence of information and communication systems in today's world. Computers not only boast very high performance, capable of carrying out billions of operations per second, they are taking over our world, working their way into every last corner of our environment. Microprocessors are in everything, from the quartz watch to the PC via the mobile phone, the television and the credit card. Their continuing spread is very probable, and they will even be able to get into our clothes and newspapers. The incessant search for increasingly powerful, robust and intelligent systems is not only based on the improvement of technologies for the manufacture of electronic chips, but also on finding new computer architectures. One important source of inspiration for the research of new architectures is the biological world. Nature is fascinating for an engineer: what could be more robust, intelligent and able to adapt and evolve than a living organism? Out of a simple cell, equipped with its own blueprint in the form of DNA, develops a complete multi-cellular organism. The characteristics of the natural world have often been studied and imitated in the design of adaptive, robust and fault-tolerant artificial systems. The POE model resumes the three major sources of bio-inspiration: the evolution of species (P: phylogeny), the development of a multi-cellular organism by division and differentiation (O: ontogeny) and learning by interaction with the environment (E: epigenesis). This thesis aims to contribute to the ontogenetic branch of the POE model, through the study of three completely original cellular machines for which the basic element respects the six following characteristics: it is (1) reconfigurable, (2) of minimal complexity, (3) present in large numbers, (4) interconnected locally with its neighboring elements, (5) equipped with a display capacity and (6) with sensor allowing minimal interaction. Our first realization, the BioWall, is made up of a surface of 4,000 basic elements or molecules, capable of creating all cellular systems with a maximum of 160 × 25 elements. The second realization, the BioCube, transposes the two-dimensional architecture of the BioWall into a two-dimensional space, limited to 4 × 4 × 4 = 64 basic elements or spheres. It prefigures a three-dimensional computer built using nanotechnologies. The third machine, named BioTissue, uses the same hypothesis as the BioWall while pushing its performance to the limits of current technical possibilities and offering the benefits of an autonomous system. The convergence of these three realizations, studied in the context of emerging technologies, has allowed us to propose and define the computer architecture of the future: the electronic paper

NASA Tech Briefs Index, 1978

Approximately 601 announcements of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electron systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences