Design of CMOS Digital Silicon Photomultipliers with ToF for Positron Emission Tomography

This thesis presents a contribution to the design of single-photon detectors for medical imaging. Specifically, the focus has been on the development of a pixel capable of single-photon counting in CMOS technology, and the associated sensor thereof. These sensors can work under low light conditions and provide timing information to determine the time-stamp of the incoming photons. For instance, this is particularly attractive for applications that rely either on time-of-flight measurements or on exponential decay determination of the light source, like positron emission tomography or fluorescence-lifetime imaging, respectively. This thesis proposes the study of the pixel architecture to optimize its performance in terms of sensitivity, linearity and signal to noise ratio. The design of the pixel has followed a bottom-up approach, taking care of the smallest building block and studying how the different architecture choices affect performance. Among the various building blocks needed, special emphasis has been placed on the following: • the Single-Photon Avalanche Diode (SPAD), a photodiode able to detect photons one by one; • the front-end circuitry of this diode, commonly called quenching and recharge circuit; • the Time-to-Digital Converter (TDC), which determines the timing performance of the pixel. The proposed architectural exploration provides a comprehensive insight into the design space of the pixel, allowing to determine the optimum design points in terms of sensor sensitivity, linearity or signal to noise ratio, thus helping designers to navigate through non-straightforward trade-offs. The proposed TDC is based on a voltage-controlled ring oscillator, since this architecture provides moderate time resolutions while keeping the footprint, the power, and conversion time relatively small. Two pseudo-differential delay stages have been studied, one with cross-coupled PMOS transistors and the other with cross-coupled inverters. Analytical studies and simulations have shown that cross-coupled inverters are the most appropriate to implement the TDC because they achieve better time resolution with smaller energy per conversion than cross-coupled PMOS transistor stages. A 1.3×1.3 mm2 pixel has been implemented in an 110 nm CMOS image sensor technology, to have the benefits of sub-micron technologies along with the cleanliness of CMOS image sensor technologies. The fabricated chips have been used to characterize the single-photon avalanche diodes. The results agree with expectations: a maximum photon detection probability of 46 % and a median dark count rate of 0.4 Hz/µm2 with an excess voltage of 3 V. Furthermore, the characterization of the TDC shows that the time resolution is below 100 ps, which agrees with post-layout simulations. The differential non-linearity is ±0.4LSB, and the integral non-linearity is ±6.1LSB. Photoemission occurs during characterization - an indication that the avalanches are not quenched properly. The cause of this has been identified to be in the design of the SPAD and the quenching circuit. SPADs are sensitive devices which maximum reverse current must be well defined and limited by the quenching circuit, otherwise unwanted effects like excessive cross-talk, noise, and power consumption may happen. Although this issue limits the operation of the implemented pixel, the information obtained during the characterization will help to avoid mistakes in future implementations

Automatic Tuning of Digital Circuits.

Variation in transistors is increasing as process technology transistor dimensions shrink. Compounded with lowering supply voltage, this increased variation presents new challenges for the circuit designer. However, this variation also brings many new opportunities for the circuit designer to leverage as well. We present a time-to-digital converter embedded inside a 64-bit processor core, for direct monitoring of on-chip critical paths. This path monitoring allows the processor to monitor process variation and run-time variations. By adjusting to both static and dynamic operating conditions the impact of variations can be reduced. The time-to-digital converter achieves high-resolution measurement in the picosecond range, due to self-calibration via a self-feedback mode. This system is implemented in 45nm silicon and measured silicon results are shown. We also examine techniques for enhanced variation-tolerance in subthreshold digital circuits, applying these to a high fan-in, self-timed transition detection circuit that, due to its self-timing, is able to fully compensate for the large variation in subthreshold. In addition to mitigating variations we also leverage them for random number generation. We demonstrate that the randomness inherent in the oxide breakdown process can be extracted and applied for the specific applications of on-chip ID generation and on-chip true random number generation. By using dynamic automated self-calibrating algorithms that tune and control the on-chip circuitry, we are able to achieve extremely high-quality results. The two systems are implemented in 65 nm silicon. Measured results for the on-chip ID system, called OxID, show a high-degree of randomness and read-stability in the generated IDs, both primary prerequisites of a high-quality on-chip ID system. Measured results for the true random number generator, called OxiGen, show an exceptionally high degree of randomness, passing all fifteen NIST 800-22 tests for randomness with statistical significance and without the aid of a post-processor.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/86390/1/rachliu_1.pd

Study of Radiation Effects on 28nm UTBB FDSOI Technology

With the evolution of modern Complementary Metal-Oxide-Semiconductor (CMOS) technology, transistor feature size has been scaled down to nanometers. The scaling has resulted in tremendous advantages to the integrated circuits (ICs), such as higher speed, smaller circuit size, and lower operating voltage. However, it also creates some reliability concerns. In particular, small device dimensions and low operating voltages have caused nanoscale ICs to become highly sensitive to operational disturbances, such as signal coupling, supply and substrate noise, and single event effects (SEEs) caused by ionizing particles, like cosmic neutrons and alpha particles. SEEs found in ICs can introduce transient pulses in circuit nodes or data upsets in storage cells. In well-designed ICs, SEEs appear to be the most troublesome in a space environment or at high altitudes in terrestrial environment. Techniques from the manufacturing process level up to the system design level have been developed to mitigate radiation effects. Among them, silicon-on-insulator (SOI) technologies have proven to be an effective approach to reduce single-event effects in ICs. So far, 28nm ultra-thin body and buried oxide (UTBB) Fully Depleted SOI (FDSOI) by STMicroelectronics is one of the most advanced SOI technologies in commercial applications. Its resilience to radiation effects has not been fully explored and it is of prevalent interest in the radiation effects community. Therefore, two test chips, namely ST1 and AR0, were designed and tested to study SEEs in logic circuits fabricated with this technology. The ST1 test chip was designed to evaluate SET pulse widths in logic gates. Three kinds of the on-chip pulse-width measurement detectors, namely the Vernier detector, the Pulse Capture detector and the Pulse Filter detector, were implemented in the ST1 chip. Moreover, a Circuit for Radiation Effects Self-Test (CREST) chain with combinational logic was designed to study both SET and SEU effects. The ST1 chip was tested using a heavy ion irradiation beam source in Radiation Effects Facility (RADEF), Finland. The experiment results showed that the cross-section of the 28nm UTBB-FDSOI technology is two orders lower than its bulk competitors. Laser tests were also applied to this chip to research the pulse distortion effects and the relationship between SET, SEU and the clock frequency. Total Ionizing Dose experiments were carried out at the University of Saskatchewan and European Space Agency with Co-60 gammacell radiation sources. The test results showed the devices implemented in the 28nm UTBB-FDSOI technology can maintain its functionality up to 1 Mrad(Si). In the AR0 chip, we designed five ARM Cortex-M0 cores with different logic protection levels to investigate the performance of approximate logic protecting methods. There are three custom-designed SRAM blocks in the test chip, which can also be used to measure the SEU rate. From the simulation result, we concluded that the approximate logic methodology can protect the digital logic efficiently. This research comprehensively evaluates the radiation effects in the 28nm UTBB-FDSOI technology, which provides the baseline for later radiation-hardened system designs in this technology

Radiation Tolerant Electronics, Volume II

Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects

Design of Digital FMCW Chirp Synthesizer PLLs Using Continuous-Time Delta-Sigma Time-to-Digital Converters

Radar applications for driver assistance systems and autonomous vehicles have spurred the development of frequency-modulated continuous-wave (FMCW) radar. Continuous signal transmission and high operation frequencies in the K- and W-bands enable radar systems with low power consumption and small form factors. The radar performance depends on high-quality signal sources for chirp generation to ensure accurate and reliable target detection, requiring chirp synthesizers that offer fast frequency settling and low phase noise. Fractional-N phase locked loops (PLLs) are an effective tool for synthesis of FMCW waveform profiles, and advances in CMOS technology have enabled high-performance single-chip CMOS synthesizers for FMCW radar. Design approaches for FMCW chirp synthesizer PLLs need to address the conflicting requirements of fast settling and low close-in phase noise. While integrated PLLs can be implemented as analog or digital PLLs, analog PLLs still dominate for high frequencies. Digital PLLs offer greater programmability and area efficiency than their analog counterparts, but rely on high-resolution time-to-digital converters (TDCs) for low close-in phase noise. Performance limitations of conventional TDCs remain a roadblock for achieving low phase noise with high-frequency digital PLLs. This shortcoming of digital PLLs becomes even more pronounced with wide loop bandwidths as required for FMCW radar. To address this problem, this work presents digital FMCW chirp synthesizer PLLs using continuous-time delta-sigma TDCs. After a discussion of the requirements for PLL-based FMCW chirp synthesizers, this dissertation focuses on digital fractional-N PLL designs based on noise-shaping TDCs that leverage state-of-the-art delta-sigma modulator techniques to achieve low close-in phase noise in wide-bandwidth digital PLLs. First, an analysis of the PLL bandwidth and chirp linearity studies the design requirements for chirp synthesizer PLLs. Based on a model of a complete radar system, the analysis examines the impact of the PLL bandwidth on the radar performance. The modeling approach allows for a straightforward study of the radar accuracy and reliability as functions of the chirp parameters and the PLL configuration. Next, an 18-to-22GHz chirp synthesizer PLL that produces a 25-segment chirp for a 240GHz FMCW radar application is described. This synthesizer design adapts an existing third-order noise-shaping TDC design. A 65nm CMOS prototype achieves a measured close-in phase noise of -88dBc/Hz at 100kHz offset for wide PLL bandwidths and consumes 39.6mW. The prototype drives a radar testbed to demonstrate the effectiveness of the synthesizer design in a complete radar system. Finally, a second-order noise-shaping TDC based on a fourth-order bandpass delta-sigma modulator is introduced. This bandpass delta-sigma TDC leverages the high resolution of a bandpass delta-sigma modulator by sampling a sinusoidal PLL reference and applies digital down-conversion to achieve low TDC noise in the frequency band of interest. Based on the bandpass delta-sigma TDC, a 38GHz digital FMCW chirp synthesizer PLL is designed. The feedback divider applies phase interpolation with a phase rotation scheme to ensure the effectiveness of the low TDC noise. A prototype PLL, fabricated in 40nm CMOS, achieves a measured close-in phase noise of -85dBc/Hz at 100kHz offset for wide loop bandwidths >1MHz and consumes 68mW. It effectively generates fast (500MHz/55us) and precise (824kHz rms frequency error) triangular chirps for FMCW radar. The bandpass delta-sigma TDC achieves a measured integrated rms noise of 325fs in a 1MHz bandwidth.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147732/1/dweyer_1.pdfDescription of dweyer_1.pdf : Restricted to UM users only

CMOS Integration of High Performance Quantum Dot Lasers For Silicon Photonics

Integration of III-V components on Si substrates is required for realizing the promise of Silicon Photonic systems. Specifically, the direct bandgap of many III-V materials is required for light sources, efficient modulators and photodetectors. Several different approaches have been taken to integrate III-V lasers into the silicon photonic platform, such as wafer bonding, direct growth, butt coupling, etc. Here, we have devised a novel laser design that overcomes the above limitations. In our approach, we use InAs quantum dot (QD) lasers monolithically integrated with silicon waveguides and other Si photonic passive components. Due to their unique structures, the QD lasers have been proven by several groups to have the combination of high temperature stability, large modulation bandwidth and low power consumption compared with their quantum well counterparts, which makes it an ideal candidate for Si photonic applications. The first section of this dissertation introduces the theory and novelty of QD lasers, the DC and RF characterization methods of QD lasers are also discussed. The second section is focused on the growth of QD gain chip which a broadband gain chip based on QD inhomogeneous broadening properties was demonstrated. In third section, the lasers devices are built on Si substrate by Pd wafer bonding technology. Firstly, a ridge waveguide QD laser is demonstrated in this section which have better heat dissipation and lower threshold current compared to the unbonded lasers. In section four, a on Si comb laser is also developed. Due to inhomogeneous broadening and ultrafast carrier dynamics, InAs quantum dots have key advantages that make them well suited for Mode-locked lasers (MLLs). In section five, a passively mode-locked InAs quantum dots laser on Si is achieved at a repetition rate of ~7.3 GHz under appropriate bias conditions. In section six, a butt-joint integration configuration based on QD lasers and silicon photonics ring resonator is tested by using to translation stage. In order to achieve the on chip butt-joint integration, an on chip laser facet was created in section seven. A novel facet etching method is developed by using Br-ion beam assist etching (Br-IBAE). In section eight, a Pd-GaAs butt-joint integration platform was proposed, a hybrid tunable QD laser which consist of a QD SOA gain chip butt joint coupled with a passive Si3N4 photonic integrated circuit is proof of concept by using an external booster SOA coupled with a Si3N4 ring reflector feedback circuit. The final section summarized the work discussed in this thesis and also discussed some future approaches by using QD lasers integrated with silicon photonics integrated circuits based on the Pd-GaAs wafer bonding butt-joint coupled platform