Design of Optical Interconnect Transceiver Circuits and Network-on-chip Architectures for Inter- and Intra-chip Communication

The rapid expansion in data communication due to the increased multimedia applications and cloud computing services necessitates improvements in optical transceiver circuitry power efficiency as these systems scale well past 10 Gb/s. In order to meet these requirements, a 26 GHz transimpedance amplifier (TIA) is presented in a 0.25-µm SiGe BiCMOS technology. It employs a transformer-based regulated cascode (RGC) input stage which provides passive negative-feedback gain that enhances the effective transconductance of the TIA’s input common-base transistor; reducing the input resistance and pro- viding considerable bandwidth extension without significant noise degradation or power consumption. The TIA achieves a 53 dBΩ single-ended transimpedance gain with a 26√ GHz bandwidth and 21.3 pA/H z average input-referred noise current spectral density. Total chip power including output buffering is 28.2 mW from a 2.5 V supply, with the core TIA consuming 8.2 mW, and the chip area including pads is 960 µm × 780 µm. With the advance of photonic devices, optical interconnects becomes a promising technology to replace the conventional electrical channels for the high-bandwidth and power efficient inter/intra-chip interconnect. Second, a silicon photonic transceiver is presented for a silicon ring resonator-based optical interconnect architecture in a 1V standard 65nm CMOS technology. The transmitter circuits incorporate high-swing drivers with non-linear pre-emphasis and automatic bias-based tuning for resonance wavelength stabilization. An optical forwarded-clock adaptive inverter-based transimpedance amplifier (TIA) receiver trades-off power for varying link budgets by employing an on-die eye monitor and scaling the TIA supply for the required sensitivity. At 5 GB/s operation, the ring modulator un- der 4Vpp driver achieves 12.7dB extinction ratio with 4.04mW power consumption, while a 0.28nm tuning range is obtained at 6.8µW/GHz efficiency with the bias-based tuning scheme implemented with the 2Vpp transmitter. When tested with a wire-bonded 150f- F p-i-n photodetector, the receiver achieves -12.7dBm sensitivity at a BER=10−15 and consumes 2.2mW at 8 GB/s. Third, a novel Nano-Photonic Network-on-Chip (NoC) architecture, called LumiNoC, is proposed for high performance and power-efficient interconnects for the chip-multi- processors (CMPs). A 64-node LumiNoC under synthetic traffic enjoys 50% less latency at low loads versus other reported photonic NoCs, and ∼25% less latency versus the electrical 2D mesh NoCs on realistic workloads. Under the same ideal throughput, LumiNoC achieves laser power reduction of 78%, and overall power reduction of 44% versus competing designs

Microwave Photonic Applications - From Chip Level to System Level

Die Vermischung von Mikrowellen- und optischen Technologien – Mikrowellenphotonik – ist ein neu aufkommendes Feld mit hohem Potential. Durch die Nutzung der Vorzüge beider Welten hat die Mikrowellenphotonik viele Anwendungsfälle und ist gerade erst am Beginn ihrer Erfolgsgeschichte. Der Weg für neue Konzepte, neue Komponenten und neue Anwendungen wird dadurch geebnet, dass ein höherer Grad an Integration sowie neue Technologien wie Silicon Photonics verfügbar sind. In diesem Werk werden zuerst die notwendigen grundlegenden Basiskomponenten – optische Quelle, elektro-optische Wandlung, Übertragungsmedium und opto-elektrische Wandlung – eingeführt. Mithilfe spezifischer Anwendungsbeispiele, die von Chipebene bis hin zur Systemebene reichen, wird der elektrooptische Codesign-Prozess veranschaulicht. Schließlich werden zukünftige Ausrichtungen wie die Unterstützung von elektrischen Trägern im Millimeterwellen- und THz-Bereich sowie Realisierungsoptionen in integrierter Optik und Nanophotonik diskutiert.The hybridization between microwave and optical technologies – microwave photonics – is an emerging field with high potential. Benefitting from the best of both worlds, microwave photonics has many use cases and is just at the beginning of its success story. The availability of a higher degree of integration and new technologies such as silicon photonics paves the way for new concepts, new components and new applications. In this work, first, the necessary basic building blocks – optical source, electro-optical conversion, transmission medium and opto-electrical conversion – are introduced. With the help of specific application examples ranging from chip level to system level, the electro-optical co-design process for microwave photonic systems is illustrated. Finally, future directions such as the support of electrical carriers in the millimeter wave and THz range and realization options in integrated optics and nanophotonics are discussed

A 40-mV-Swing Single-Ended Transceiver for TSV with a Switched-Diode RX Termination

A switched-diode termination (SDT) is proposed to implement a low-power transceiver circuit for on-chip single-ended signaling through a through-silicon via (TSV). The channel signal swing is limited to 40 mV by the SDT to reduce the transmitter (TX) power. An inverter-cascade amplifier is used to reduce the receiver (RX) power. The SDT consists of an nMOS diode and a pMOS diode, which are connected in a series between power rails through the RX input node. Only one of these two diodes is switched on depending on the RX output data, which eliminates the short-circuit current of the center-tap resistor termination. Inverter feedback is applied to the cascade amplifier of the RX to increase the bandwidth from 0.9 to 5.0 GHz. The transceiver in the 65-nm CMOS process combined with an emulated five-stack TSV on the same chip works at 8 Gb/s with 149 fJ/b/pF and a 1.2-V supply.X1132sciescopu

Topical Workshop on Electronics for Particle Physics

The purpose of the workshop was to present results and original concepts for electronics research and development relevant to particle physics experiments as well as accelerator and beam instrumentation at future facilities; to review the status of electronics for the LHC experiments; to identify and encourage common efforts for the development of electronics; and to promote information exchange and collaboration in the relevant engineering and physics communities

Low-Power High-Speed Transceivers with Channel-Swing of 40mV for TSV and PCB Channels

DoctorTwo transceiver circuits are proposed for low-power high-speed transmission by reducing the channel-signal-swing to 40mV; one is a single-ended transceiver circuit for an on-chip through-silicon via (TSV) channel and the other is a differential transceiver circuit for a 12” FR-4 channel. First, the single-ended transceiver circuit for on-chip TSV channel employs a switched-diode termination (SDT). The channel signal swing is limited to 40 mV by the SDT to reduce the transmitter (TX) power without short-circuit current loss of the center-tap resistor termination. An inverter-cascade amplifier is used to reduce the receiver (RX) power. Inverter feedback is applied to the cascade amplifier of the RX to increase the bandwidth from 0.9 to 5.0 GHz. The transceiver in the 65-nm CMOS process combined with an emulated five-stack TSV on the same chip works at 8 Gb/s with 149 fJ/b/pF and a 1.2-V supply. Second, the differential transceiver circuit has 40mVppd channel signal-swing, 9mVppd receiver (RX) input sensitivity, and 0.59pJ/b energy efficiency at 9Gb/s with a 12” FR-4 channel. A current-integrating TIA (CI-TIA) is used as a RX pre-amplifier to enhance the RX input sensitivity by increasing the voltage gain of the CI-TIA to around 18 at 9Gb/s. A voltage-mode pre-emphasis equalizer is combined with a current-mode logic (CML) driver at transmitter (TX) to save the low-frequency de-emphasis current of the conventional current-mode equalizer combined with a CML driver. The voltage-mode equalizer consists of a series connection of an inverter and a capacitor; the equalization coefficient is proportional to the supply voltage of the inverter. The transceiver chip in a 65nm CMOS process consumes 2.8mW at TX and 2.5mW at RX with a 1V supply and a 12” FR-4 channel at 9Gb/s

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

A Silent-Speech Interface using Electro-Optical Stomatography

Sprachtechnologie ist eine große und wachsende Industrie, die das Leben von technologieinteressierten Nutzern auf zahlreichen Wegen bereichert. Viele potenzielle Nutzer werden jedoch ausgeschlossen: Nämlich alle Sprecher, die nur schwer oder sogar gar nicht Sprache produzieren können. Silent-Speech Interfaces bieten einen Weg, mit Maschinen durch ein bequemes sprachgesteuertes Interface zu kommunizieren ohne dafür akustische Sprache zu benötigen. Sie können außerdem prinzipiell eine Ersatzstimme stellen, indem sie die intendierten Äußerungen, die der Nutzer nur still artikuliert, künstlich synthetisieren. Diese Dissertation stellt ein neues Silent-Speech Interface vor, das auf einem neu entwickelten Messsystem namens Elektro-Optischer Stomatografie und einem neuartigen parametrischen Vokaltraktmodell basiert, das die Echtzeitsynthese von Sprache basierend auf den gemessenen Daten ermöglicht. Mit der Hardware wurden Studien zur Einzelworterkennung durchgeführt, die den Stand der Technik in der intra- und inter-individuellen Genauigkeit erreichten und übertrafen. Darüber hinaus wurde eine Studie abgeschlossen, in der die Hardware zur Steuerung des Vokaltraktmodells in einer direkten Artikulation-zu-Sprache-Synthese verwendet wurde. Während die Verständlichkeit der Synthese von Vokalen sehr hoch eingeschätzt wurde, ist die Verständlichkeit von Konsonanten und kontinuierlicher Sprache sehr schlecht. Vielversprechende Möglichkeiten zur Verbesserung des Systems werden im Ausblick diskutiert.:Statement of authorship iii Abstract v List of Figures vii List of Tables xi Acronyms xiii 1. Introduction 1 1.1. The concept of a Silent-Speech Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2. Structure of this work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2. Fundamentals of phonetics 7 2.1. Components of the human speech production system . . . . . . . . . . . . . . . . . . . 7 2.2. Vowel sounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3. Consonantal sounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4. Acoustic properties of speech sounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5. Coarticulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.6. Phonotactics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.7. Summary and implications for the design of a Silent-Speech Interface (SSI) . . . . . . . 21 3. Articulatory data acquisition techniques in Silent-Speech Interfaces 25 3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.2. Scope of the literature review . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.3. Video Recordings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.4. Ultrasonography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.5. Electromyography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.6. Permanent-Magnetic Articulography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.7. Electromagnetic Articulography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.8. Radio waves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.9. Palatography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 3.10.Conclusion and Discussion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 4. Electro-Optical Stomatography 55 4.1. Contact sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 4.2. Optical distance sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 4.3. Lip sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 4.4. Sensor Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 4.5. Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 4.6. Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 5. Articulation-to-Text 99 5.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.2. Command word recognition pilot study . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.3. Command word recognition small-scale study . . . . . . . . . . . . . . . . . . . . . . . . 102 6. Articulation-to-Speech 109 6.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 6.2. Articulatory synthesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 6.3. The six point vocal tract model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 6.4. Objective evaluation of the vocal tract model . . . . . . . . . . . . . . . . . . . . . . . . 116 6.5. Perceptual evaluation of the vocal tract model . . . . . . . . . . . . . . . . . . . . . . . . 120 6.6. Direct synthesis using EOS to control the vocal tract model . . . . . . . . . . . . . . . . 125 6.7. Pitch and voicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 7. Summary and outlook 145 7.1. Summary of the contributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 7.2. Outlook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 A. Overview of the International Phonetic Alphabet 151 B. Mathematical proofs and derivations 153 B.1. Combinatoric calculations illustrating the reduction of possible syllables using phonotactics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 B.2. Signal Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 B.3. Effect of the contact sensor area on the conductance . . . . . . . . . . . . . . . . . . . . 155 B.4. Calculation of the forward current for the OP280V diode . . . . . . . . . . . . . . . . . . 155 C. Schematics and layouts 157 C.1. Schematics of the control unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 C.2. Layout of the control unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 C.3. Bill of materials of the control unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 C.4. Schematics of the sensor unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 C.5. Layout of the sensor unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 C.6. Bill of materials of the sensor unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 D. Sensor unit assembly 169 E. Firmware flow and data protocol 177 F. Palate file format 181 G. Supplemental material regarding the vocal tract model 183 H. Articulation-to-Speech: Optimal hyperparameters 189 Bibliography 191Speech technology is a major and growing industry that enriches the lives of technologically-minded people in a number of ways. Many potential users are, however, excluded: Namely, all speakers who cannot easily or even at all produce speech. Silent-Speech Interfaces offer a way to communicate with a machine by a convenient speech recognition interface without the need for acoustic speech. They also can potentially provide a full replacement voice by synthesizing the intended utterances that are only silently articulated by the user. To that end, the speech movements need to be captured and mapped to either text or acoustic speech. This dissertation proposes a new Silent-Speech Interface based on a newly developed measurement technology called Electro-Optical Stomatography and a novel parametric vocal tract model to facilitate real-time speech synthesis based on the measured data. The hardware was used to conduct command word recognition studies reaching state-of-the-art intra- and inter-individual performance. Furthermore, a study on using the hardware to control the vocal tract model in a direct articulation-to-speech synthesis loop was also completed. While the intelligibility of synthesized vowels was high, the intelligibility of consonants and connected speech was quite poor. Promising ways to improve the system are discussed in the outlook.:Statement of authorship iii Abstract v List of Figures vii List of Tables xi Acronyms xiii 1. Introduction 1 1.1. The concept of a Silent-Speech Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2. Structure of this work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2. Fundamentals of phonetics 7 2.1. Components of the human speech production system . . . . . . . . . . . . . . . . . . . 7 2.2. Vowel sounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3. Consonantal sounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4. Acoustic properties of speech sounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5. Coarticulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.6. Phonotactics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.7. Summary and implications for the design of a Silent-Speech Interface (SSI) . . . . . . . 21 3. Articulatory data acquisition techniques in Silent-Speech Interfaces 25 3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.2. Scope of the literature review . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.3. Video Recordings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.4. Ultrasonography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.5. Electromyography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.6. Permanent-Magnetic Articulography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.7. Electromagnetic Articulography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.8. Radio waves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.9. Palatography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 3.10.Conclusion and Discussion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 4. Electro-Optical Stomatography 55 4.1. Contact sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 4.2. Optical distance sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 4.3. Lip sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 4.4. Sensor Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 4.5. Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 4.6. Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 5. Articulation-to-Text 99 5.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.2. Command word recognition pilot study . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.3. Command word recognition small-scale study . . . . . . . . . . . . . . . . . . . . . . . . 102 6. Articulation-to-Speech 109 6.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 6.2. Articulatory synthesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 6.3. The six point vocal tract model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 6.4. Objective evaluation of the vocal tract model . . . . . . . . . . . . . . . . . . . . . . . . 116 6.5. Perceptual evaluation of the vocal tract model . . . . . . . . . . . . . . . . . . . . . . . . 120 6.6. Direct synthesis using EOS to control the vocal tract model . . . . . . . . . . . . . . . . 125 6.7. Pitch and voicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 7. Summary and outlook 145 7.1. Summary of the contributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 7.2. Outlook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 A. Overview of the International Phonetic Alphabet 151 B. Mathematical proofs and derivations 153 B.1. Combinatoric calculations illustrating the reduction of possible syllables using phonotactics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 B.2. Signal Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 B.3. Effect of the contact sensor area on the conductance . . . . . . . . . . . . . . . . . . . . 155 B.4. Calculation of the forward current for the OP280V diode . . . . . . . . . . . . . . . . . . 155 C. Schematics and layouts 157 C.1. Schematics of the control unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 C.2. Layout of the control unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 C.3. Bill of materials of the control unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 C.4. Schematics of the sensor unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 C.5. Layout of the sensor unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 C.6. Bill of materials of the sensor unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 D. Sensor unit assembly 169 E. Firmware flow and data protocol 177 F. Palate file format 181 G. Supplemental material regarding the vocal tract model 183 H. Articulation-to-Speech: Optimal hyperparameters 189 Bibliography 19