Broadband Receiver Electronic Circuits for Fiber-Optical Communication Systems

The exponential growth of internet traffic drives datacenters to constantly improve their capacity. As the copper based network infrastructure is being replaced by fiber-optical interconnects, new industrial standards for higher datarates are required. Several research and industrial organizations are aiming towards 400 Gb Ethernet and beyond, which brings new challenges to the field of high-speed broadband electronic circuit design. Replacing OOK with higher M-ary modulation formats and using higher datarates increases network capacity but at the cost of power. With datacenters rapidly becoming significant energy consumers on the global scale, the energy efficiency of the optical interconnect transceivers takes a primary role in the development of novel systems. There are several additional challenges unique in the design of a broadband shortreach fiber-optical receiver system. The sensitivity of the receiver depends on the noise performance of the PD and the electronics. The overall system noise must be optimized for the specific application, modulation scheme, PD and VCSEL characteristics. The topology of the transimpedance amplifier affects the noise and frequency response of the PD, so the system must be optimized as a whole. Most state-of-the-art receivers are built on high-end semiconductor SiGe and InP technologies. However, there are still several design decisions to be made in order to get low noise, high energy efficiency and adequate bandwidth. In order to overcome the frequency limitations of the optoelectronic components, bandwidth enhancement and channel equalization techniques are used. In this work several different blocks of a receiver system are designed and characterized. A broadband, 50 GHz bandwidth CB-based TIA and a tunable gain equalizer are designed in a 130 nm SiGe BiCMOS process. An ultra-broadband traveling wave amplifier is presented, based on a 250 nm InP DHBT technology demonstrating a 207 GHz bandwidth. Two TIA front-end topologies with 133 GHz bandwidth, a CB and a CE with shunt-shunt feedback, based on a 130 nm InP DHBT technology are designed and compared

Full Duplex CMOS Transceiver with On-Chip Self-Interference Cancelation

abstract: The demand for the higher data rate in the wireless telecommunication is increasing rapidly. Providing higher data rate in cellular telecommunication systems is limited because of the limited physical resources such as telecommunication frequency channels. Besides, interference with the other users and self-interference signal in the receiver are the other challenges in increasing the bandwidth of the wireless telecommunication system. Full duplex wireless communication transmits and receives at the same time and the same frequency which was assumed impossible in the conventional wireless communication systems. Full duplex wireless communication, compared to the conventional wireless communication, doubles the channel efficiency and bandwidth. In addition, full duplex wireless communication system simplifies the reusing of the radio resources in small cells to eliminate the backhaul problem and simplifies the management of the spectrum. Finally, the full duplex telecommunication system reduces the costs of future wireless communication systems. The main challenge in the full duplex wireless is the self-interference signal at the receiver which is very large compared to the receiver noise floor and it degrades the receiver performance significantly. In this dissertation, different techniques for the antenna interface and self-interference cancellation are proposed for the wireless full duplex transceiver. These techniques are designed and implemented on CMOS technology. The measurement results show that the full duplex wireless is possible for the short range and cellular wireless communication systems.Dissertation/ThesisDoctoral Dissertation Engineering 201

Wideband integrated circuits for optical communication systems

The exponential growth of internet traffic drives datacenters to constantly improvetheir capacity. Several research and industrial organizations are aiming towardsTbps Ethernet and beyond, which brings new challenges to the field of high-speedbroadband electronic circuit design. With datacenters rapidly becoming significantenergy consumers on the global scale, the energy efficiency of the optical interconnecttransceivers takes a primary role in the development of novel systems. Furthermore,wideband optical links are finding application inside very high throughput satellite(V/HTS) payloads used in the ever-expanding cloud of telecommunication satellites,enabled by the maturity of the existing fiber based optical links and the hightechnology readiness level of radiation hardened integrated circuit processes. Thereare several additional challenges unique in the design of a wideband optical system.The overall system noise must be optimized for the specific application, modulationscheme, PD and laser characteristics. Most state-of-the-art wideband circuits are builton high-end semiconductor SiGe and InP technologies. However, each technologydemands specific design decisions to be made in order to get low noise, high energyefficiency and adequate bandwidth. In order to overcome the frequency limitationsof the optoelectronic components, bandwidth enhancement and channel equalizationtechniques are used. In this work various blocks of optical communication systems aredesigned attempting to tackle some of the aforementioned challenges. Two TIA front-end topologies with 133 GHz bandwidth, a CB and a CE with shunt-shunt feedback,are designed and measured, utilizing a state-of-the-art 130 nm InP DHBT technology.A modular equalizer block built in 130 nm SiGe HBT technology is presented. Threeultra-wideband traveling wave amplifiers, a 4-cell, a single cell and a matrix single-stage, are designed in a 250 nm InP DHBT process to test the limits of distributedamplification. A differential VCSEL driver circuit is designed and integrated in a4x 28 Gbps transceiver system for intra-satellite optical communications based in arad-hard 130nm SiGe process

Low Power Analog Processing for Ultra-High-Speed Receivers with RF Correlation

Ultra-high-speed data communication receivers (Rxs) conventionally require analog digital converters (ADC)s with high sampling rates which have design challenges in terms of adequate resolution and power. This leads to ultra-high-speed Rxs utilising expensive and bulky high-speed oscilloscopes which are extremely inefficient for demodulation, in terms of power and size. Designing energy-efficient mixed-signal and baseband units for ultra-high-speed Rxs requires a paradigm approach detailed in this paper that circumvents the use of power-hungry ADCs by employing low-power analog processing. The low-power analog Rx employs direct-demodulation with RF correlation using low-power comparators. The Rx is able to support multiple modulations with highest modulation of 16-QAM reported so far for direct-demodulation with RF correlation. Simulations using Matlab, Simulink R2020a® indicate sufficient symbol-error rate (SER) performance at a symbol rate of 8 GS/s for the 71 GHz Urban Micro Cell and 140 GHz indoor channels. Power analysis undertaken with current analog, hybrid and digital beamforming approaches requiring ADCs indicates considerable power savings. This novel approach can be adopted for ultra-high-speed Rxs envisaged for beyond fifth generation (B5G)/sixth generation (6G)/ terahertz (THz) communication without the power-hungry ADCs, leading to low-power integrated design solutions

올 디지털 클럭 및 데이터 복원 회로를 적용한 고속 광 수신기 설계

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2016. 8. 정덕균.This thesis presents a 22- to 26.5-Gb/s optical receiver with an all-digital clock and data recovery (ADCDR) fabricated in a 65-nm CMOS process. The receiver consists of an optical front-end and a half-rate bang-bang clock and data recovery circuit. The optical front-end achieves low power consumption by using inverter-based amplifiers and realizes sufficient bandwidth by applying several bandwidth extension techniques. In addition, in order to minimize additional jitter at the front-end, not only magnitude and bandwidth but also phase delay responses are considered. The ADCDR employs an LC quadrature digitally-controlled oscillator (LC-QDCO) to achieve a high phase noise figure-of-merit at tens of gigahertz. The recovered clock jitter is 1.28 psrms and the measured jitter tolerance exceeds the tolerance mask specified in IEEE 802.3ba. The receiver sensitivity is 106 and 184 μApk-pk for a bit error rate of 10−12 at data rates of 25 and 26.5 Gb/s, respectively. The entire receiver chip occupies an active die area of 0.75 mm2 and consumes 254 mW at a data rate of 26.5 Gb/s. The energy efficiencies of the front-end and entire receiver at 26.5 Gb/s are 1.35 and 9.58 pJ/bit, respectively.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 5 CHAPTER 2 DESIGN OF OPTICAL FRONT-END 7 2.1 OVERVIEW 7 2.2 BACKGROUND ON OPTICAL FRONT-END 9 2.2.1 PHOTODIODE 9 2.2.2 TRANSIMPEDANCE AMPLIFIER 11 2.2.3 POST AMPLIFIER 17 2.2.4 SHUNT INDUCTIVE PEAKING 25 2.3 CIRCUIT IMPLEMENTATION 29 2.3.1 OVERALL ARCHITECTURE 29 2.3.2 TRANSIMPEDANCE AMPLIFIER 31 2.3.3 POST AMPLIFIER 34 2.4 NOISE ANALYSIS 43 2.4.1 PHOTODIODE 43 2.4.2 OPTICAL FRONT-END 44 2.4.3 SENSITIVITY 46 CHAPTER 3 DESIGN OF ADCDR FOR OPTICAL RECEIVER 48 3.1 OVERVIEW 48 3.2 BACKGROUND ON PLL-BASED ADCDR 51 3.2.1 PHASE DETECTOR 51 3.2.2 DIGITAL LOOP FILTER 54 3.2.3 DIGITALLY-CONTROLLED OSCILLATOR 56 3.2.4 ANALYSIS OF BANG-BANG ADCDR 67 3.3 CIRCUIT IMPLEMENTATION 70 3.3.1 OVERALL ARCHITECTURE 70 3.3.2 PHASE DETECTION LOGIC 75 3.3.3 DIGITAL LOOP FILTER 77 3.3.4 LC QUADRATURE DCO 78 CHAPTER 4 EXPERIMENTAL RESULTS 82 CHAPTER 5 CONCLUSION 90 BIBLIOGRAPHY 92 초록 101Docto

Advanced Trends in Wireless Communications

Physical limitations on wireless communication channels impose huge challenges to reliable communication. Bandwidth limitations, propagation loss, noise and interference make the wireless channel a narrow pipe that does not readily accommodate rapid flow of data. Thus, researches aim to design systems that are suitable to operate in such channels, in order to have high performance quality of service. Also, the mobility of the communication systems requires further investigations to reduce the complexity and the power consumption of the receiver. This book aims to provide highlights of the current research in the field of wireless communications. The subjects discussed are very valuable to communication researchers rather than researchers in the wireless related areas. The book chapters cover a wide range of wireless communication topics

Architectures and Integrated Circuits for Efficient, High-power "Digital'' Transmitters for Millimeter-wave Applications

This thesis presents architectures and integrated circuits for the implementation of energy-efficient, high-power "digital'' transmitters to realize high-speed long-haul links at millimeter-wave frequencies in nano-scale silicon-based processes

Design of High-Speed SerDes Transceiver for Chip-to-Chip Communications in CMOS Process

With the continuous increase of on-chip computation capacities and exponential growth of data-intensive applications, the high-speed data transmission through serial links has become the backbone for modern communication systems. To satisfy the massive data-exchanging requirement, the data rate of such serial links has been updated from several Gb/s to tens of Gb/s. Currently, the commercial standards such as Ethernet 400GbE, InfiniBand high data rate (HDR), and common electrical interface (CEI)-56G has been developing towards 40+ Gb/s. As the core component within these links, the transceiver chipset plays a fundamental role in balancing the operation speed, power consumption, area occupation, and operation range. Meanwhile, the CMOS process has become the dominant technology in modern transceiver chip fabrications due to its large-scale digital integration capability and aggressive pricing advantage. This research aims to explore advanced techniques that are capable of exploiting the maximum operation speed of the CMOS process, and hence provides potential solutions for 40+ Gb/s CMOS transceiver designs. The major contributions are summarized as follows. A low jitter ring-oscillator-based injection-locked clock multiplier (RILCM) with a hybrid frequency tracking loop that consists of a traditional phase-locked loop (PLL), a timing-adjusted loop, and a loop selection state-machine is implemented in 65-nm C-MOS process. In the ring voltage-controlled oscillator, a full-swing pseudo-differential delay cell is proposed to lower the device noise to phase noise conversion. To obtain high operation speed and high detection accuracy, a compact timing-adjusted phase detector tightly combined with a well-matched charge pump is designed. Meanwhile, a lock-loss detection and lock recovery is devised to endow the RILCM with a similar lock-acquisition ability as conventional PLL, thus excluding the initial frequency set- I up aid and preventing the potential lock-loss risk. The experimental results show that the figure-of-merit of the designed RILCM reaches -247.3 dB, which is better than previous RILCMs and even comparable to the large-area LC-ILCMs. The transmitter (TX) and receiver (RX) chips are separately designed and fab- ricated in 65-nm CMOS process. The transmitter chip employs a quarter-rate multi-multiplexer (MUX)-based 4-tap feed-forward equalizer (FFE) to pre-distort the output. To increase the maximum operating speed, a bandwidth-enhanced 4:1 MUX with the capability of eliminating charge-sharing effect is proposed. To produce the quarter-rate parallel data streams with appropriate delays, a compact latch array associated with an interleaved-retiming technique is designed. The receiver chip employs a two-stage continuous-time linear equalizer (CTLE) as the analog front-end and integrates an improved clock data recovery to extract the sampling clocks and retime the incoming data. To automatically balance the jitter tracking and jitter suppression, passive low-pass filters with adaptively-adjusted bandwidth are introduced into the data-sampling path. To optimize the linearity of the phase interpolation, a time-averaging-based compensating phase interpolator is proposed. For equalization, a combined TX-FFE and RX-CTLE is applied to compensate for the channel loss, where a low-cost edge-data correlation-based sign zero-forcing adaptation algorithm is proposed to automatically adjust the TX-FFE’s tap weights. Measurement results show that the fabricated transmitter/receiver chipset can deliver 40 Gb/s random data at a bit error rate of 16 dB loss at the half-baud frequency, while consuming a total power of 370 mW

A 3.5 Gsymbol/lane Receiver Design for MIPI C-PHY Layer v2.0

Department of Electrical EngineeringSemiconductor process technologies are the backbone of information driven era, where one can have an access to immense amount of data on a daily basis. As an amount of information continually increases, demand for advanced technology nodes follows the similar trend by evolving down to 3 nm process in 2022. Need for more information directly correlates with a need for higher speed of communication between data canters and clients. Higher operating speed brings up requirement for high power and surgical precision into a play. This power and speed trade-off can be the limiting factor in many systems, and designing high speed system while maintaining low or moderate power consumption requires engineers to invent more elaborate schemes that employ the above trade-off in the most efficient way. Other crucial aspects such as noise, communication efficiency, budget and area are also parameters in power and speed trade-off function that should be taken into careful consideration. Therefore, bridge systems are being developed in an effort to deliver vast of amount information between two or more communicating system, meanwhile aiming to optimize the aforementioned parameters._x000D_ Recently, a great deal of researches has been conducted to implement interfaces that provides high throughput and performance over bandlimited communication mediums. Due to manufacturing cost, designed systems architecture should be standardized to allow cross-compatibility over various devices. One of the such industry standard interface systems that found use in smartphones, smart watches, smart meters, video game devices, etc., is Mobile Industry Processor Interface Display/Camera Serial Interface (MIPI DSI/CSI). MIPI DSI/CSI enables high performance, low power solution while ensuring interoperability across different vendors. _x000D_ This thesis presents design of front end at 7.98 Gb/s for C-PHY (MIPI DSI/CSI physical layer) serial interface in TSMC-28 nm HPC CMOS technology. High-speed front end consists of termination resistor (RT), continuous time linear equalizer (CTLE), high-speed receiver (HSRX), clock and data recovery (CDR) circuit, decoder (DEC) and 7x21 de-serializer (DESER). RT block employs parallel trimming technique to ensure operation across PVT corners. Active CTLE improves signal integrity and accommodates trimming option to allow operation with different channel lengths. In order to recover the clock embedded into signal according to the C-PHY specification, CDR block is designed. DEC decodes output signals from HSRX in a fashion consistent with C-PHY specifications. As a result, analog frond end achieves less than 0.2 pJ/but efficiency with 0.9 V supply voltage._x000D_ope