縦型ボディチャネルMOS Field-Effect Transistorを用いたマイクロプロセッサ向け高効率・高集積DC-DCコンバータとそのパワーマネジメントに関する研究

Tohoku University遠藤哲郎課

High Speed Fully Monolihic Self-Triggered Dc-Dc Buck Converter

The integration of DC-DC converter in standard CMOS process faces challenges from the low transistor breakdown voltages, poor quality factor and large size on-chip capacitors and inductors. The standard solution to deal with the problem of MOS transistor’s low breakdown voltage is using cascode configuration in the output stage. High-side PMOS and low-side NMOS power transistors in on-chip buck converter are switched ON and OFF with non-overlapping driving signals whose duty- cycle regulate the output voltage of converter. The non-overlapping driving signals are required to avoid short-circuit losses through power transistors. By using the cascode configuration, driving signals for high-side PMOS and low-side NMOS power switching transistors operate in different voltage domains. To overcome this problem, the voltage level shifters are needed to transfer driving signals between two voltage domains. However, associated power losses and additional timing delays in conventional level shifters may deteriorate the overall efficiency of converter. In order to avoid the losses and timing delays associated with the level shifters, a self-triggered buck converter is proposed in this work. The high-side driving signal is generated from the converter output via inductive feedback. The inductive feedback eliminates the required level shifters needed for transferring the driving signal to highside power transistor. The inductive feedback has fast response and provides adaptive dead-time that avoids short circuit losses with no additional hardware. Output voltage regulation is realized by controlling the duty-cycle of the signal switching the low-side NMOS transistor. Simulations are done on Cadence 45nm CMOS General Process Design Kit(GPDK) and show that the efficiency of self-triggered converter (64.25%) is better than the efficiency of a hard-switching buck converter(63.21%), even when the level shifter losses and delays are not taken into account. The converter generate output voltage ~1.5V ± 20mV and average load current 100mA ± 3mA from 3V-3.6V input at a switching frequency of 360MHz. In order to closely match real circuit behavior, layout is made and final simulations are carried out with extracted layout and PCB Parasitics. The converter is fully integrated with 1.73×1.62[mm×mm] area on silicon including power stage, transformer, decoupling capacitors and pad

Low Power High Efficiency Integrated Class-D Amplifier Circuits for Mobile Devices

The consumer’s demand for state-of-the-art multimedia devices such as smart phones and tablet computers has forced manufacturers to provide more system features to compete for a larger portion of the market share. The added features increase the power consumption and heat dissipation of integrated circuits, depleting the battery charge faster. Therefore, low-power high-efficiency circuits, such as the class-D audio amplifier, are needed to reduce heat dissipation and extend battery life in mobile devices. This dissertation focuses on new design techniques to create high performance class-D audio amplifiers that have low power consumption and occupy less space. The first part of this dissertation introduces the research motivation and fundamentals of audio amplification. The loudspeaker’s operation and main audio performance metrics are examined to explain the limitations in the amplification process. Moreover, the operating principle and design procedure of the main class-D amplifier architectures are reviewed to provide the performance tradeoffs involved. The second part of this dissertation presents two new circuit designs to improve the audio performance, power consumption, and efficiency of standard class-D audio amplifiers. The first work proposes a feed-forward power-supply noise cancellation technique for single-ended class-D amplifier architectures to improve the power-supply rejection ratio across the entire audio frequency range. The design methodology, implementation, and tradeoffs of the proposed technique are clearly delineated to demonstrate its simplicity and effectiveness. The second work introduces a new class-D output stage design for piezoelectric speakers. The proposed design uses stacked-cascode thick-oxide CMOS transistors at the output stage that makes possible to handle high voltages in a low voltage standard CMOS technology. The design tradeoffs in efficiency, linearity, and electromagnetic interference are discussed. Finally, the open problems in audio amplification for mobile devices are discussed to delineate the possible future work to improve the performance of class-D amplifiers. For all the presented works, proof-of-concept prototypes are fabricated, and the measured results are used to verify the correct operation of the proposed solutions

Vidutinių dažnių 5G belaidžių tinklų galios stiprintuvų tyrimas

This dissertation addresses the problems of ensuring efficient radio fre-quency transmission for 5G wireless networks. Taking into account, that the next generation 5G wireless network structure will be heterogeneous, the device density and their mobility will increase and massive MIMO connectivity capability will be widespread, the main investigated problem is formulated – increasing the efficiency of portable mid-band 5G wireless network CMOS power amplifier with impedance matching networks. The dissertation consists of four parts including the introduction, 3 chapters, conclusions, references and 3 annexes. The investigated problem, importance and purpose of the thesis, the ob-ject of the research methodology, as well as the scientific novelty are de-fined in the introduction. Practical significance of the obtained results, defended state-ments and the structure of the dissertation are also included. The first chapter presents an extensive literature analysis. Latest ad-vances in the structure of the modern wireless network and the importance of the power amplifier in the radio frequency transmission chain are de-scribed in detail. The latter is followed by different power amplifier archi-tectures, parameters and their improvement techniques. Reported imped-ance matching network design methods are also discussed. Chapter 1 is concluded distinguishing the possible research vectors and defining the problems raised in this dissertation. The second chapter is focused around improving the accuracy of de-signing lumped impedance matching network. The proposed methodology of estimating lumped inductor and capacitor parasitic parameters is dis-cussed in detail provi-ding complete mathematical expressions, including a summary and conclusions. The third chapter presents simulation results for the designed radio fre-quency power amplifiers. Two variations of Doherty power amplifier archi-tectures are presented in the second part, covering the full step-by-step de-sign and simulation process. The latter chapter is concluded by comparing simulation and measurement results for all designed radio frequency power amplifiers. General conclusions are followed by an extensive list of references and a list of 5 publications by the author on the topic of the dissertation. 5 papers, focusing on the subject of the discussed dissertation, have been published: three papers are included in the Clarivate Analytics Web of Sci-ence database with a citation index, one paper is included in Clarivate Ana-lytics Web of Science database Conference Proceedings, and one paper has been published in unreferred international conference preceedings. The au-thor has also made 9 presentations at 9 scientific conferences at a national and international level.Dissertatio

Study and design of topologies and components for high power density DC-DC converters

Size reduction of low power electronic DC–DC converters is a topic of major interest for power electronics which requires the study and design of circuits and components working under redefined requirements. For this purpose, novel circuital topologies provide advantages in terms of power density increment, especially where a single chip design is feasible. These concepts have been applied to design and implement an integrated high step-down multiphase buck converter and to study the miniaturization of a stackable fiflyback architecture. Particular attention has been dedicated to power inductors, focusing on the modeling and measurement of magnetic materials’ hysteresis and core losses

Reconfigurable Gate Driver Toward High-Power Efficiency and High-Power Density Converters

Les systèmes de gestion de l'énergie exigent des convertisseurs de puissance pour fournir une conversion de puissance adaptée à diverses utilisations. Il existe différents types de convertisseurs de puissance, tel que les amplificateurs de puissance de classe D, les demi-ponts, les ponts complets, les amplificateurs de puissance de classe E, les convertisseurs buck et dernièrement les convertisseurs boost. Prenons par exemple les dispositifs implantables, lorsque l'énergie est prélevée de la source principale, des convertisseurs de puissance buck ou boost sont nécessaires pour traiter l'énergie de l'entrée et fournir une énergie propre et adaptée aux différentes parties du système. D'autre part, dans les stations de charge des voitures électriques, les nouveaux téléphones portables, les stimulateurs neuronaux, etc., l'énergie sans fil a été utilisée pour assurer une alimentation à distance, et des amplificateurs de puissance de classe E sont développés pour accomplir cette tâche. Les amplificateurs de puissance de classe D sont un excellent choix pour les casques d'écoute ou les haut-parleurs en raison de leur grande efficacité. Dans le cas des interfaces de capteurs, les demi-ponts et les ponts complets sont les interfaces appropriées entre les systèmes à faible et à forte puissance. Dans les applications automobiles, l'interface du capteur reçoit le signal du côté puissance réduite et le transmet à un réseau du côté puissance élevée. En outre, l'interface du capteur doit recevoir un signal du côté haute puissance et le convertir vers la côté basse puissance. Tous les systèmes mentionnés ci-dessus nécessitent l'inclusion d'un pilote de porte spécifique dans les circuits, selon les applications. Les commandes de porte comprennent généralement un décalage du niveau de commande niveau supérieur, le levier de changement de niveau inférieur, une chaîne de tampon, un circuit de verrouillage sous tension, un circuit de temps mort, des portes logiques, un inverseur de Schmitt et un mécanisme de démarrage. Ces circuits sont nécessaires pour assurer le bon fonctionnement des systèmes de conversion de puissance. Un circuit d'attaque de porte reconfigurable prendrait en charge une vaste gamme de convertisseurs de puissance ayant une tension d'entrée V[indice IN] et un courant de sortie I[indice Load] variables. L'objectif de ce projet est d'étudier intensivement les causes de différentes pertes dans les convertisseurs de puissance et de proposer ensuite de nouveaux circuits et méthodologies dans les différents circuits des conducteurs de porte pour atteindre une conversion de puissance avec une haute efficacité et densité de puissance. Nous proposons dans cette thèse de nouveaux circuits de gestion des temps mort, un Shapeshifter de niveau plus élevé et un Shapeshifter de niveau inférieur avec de nouvelles topologies qui ont été pleinement caractérisées expérimentalement. De plus, l'équation mathématique du temps mort optimal pour les faces haute et basse d'un convertisseur buck est dérivée et expérimentalement prouvée. Les circuits intégrés personnalisés et les méthodologies proposées sont validés avec différents convertisseurs de puissance, tels que les convertisseurs semi-pont et en boucle ouverte, en utilisant des composants standard pour démontrer leur supériorité sur les solutions traditionnelles. Les principales contributions de cette recherche ont été présentées à sept conférences prestigieuses, trois articles évalués par des pairs, qui ont été publiés ou présentés, et une divulgation d'invention. Une contribution importante de ce travail recherche est la proposition d'un nouveau générateur actif CMOS intégré dédié de signaux sans chevauchement. Ce générateur a été fabriqué à l'aide de la technologie AMS de 0.35µm et consomme 16.8mW à partir d'une tension d'alimentation de 3.3V pour commander de manière appropriée les côtés bas et haut d'un demi-pont afin d'éliminer la propagation. La puce fabriquée est validée de façon expérimentale avec un demi-pont, qui a été mis en œuvre avec des composants disponibles sur le marché et qui contrôle une charge R-L. Les résultats des mesures montrent une réduction de 40% de la perte totale d'un demi-pont de 45V d'entrée à 1MHz par rapport au fonctionnement du demi-pont sans notre circuit intégré dédié. Le circuit principal du circuit d'attaque de grille côté haut est le décaleur de niveau, qui fournit un signal de grande amplitude pour le commutateur de puissance côté haut. Une nouvelle structure de décalage de niveau avec un délai de propagation minimal doit être présentée. Nous proposons une nouvelle topologie de décalage de niveau pour le côté haut des drivers de porte afin de produire des convertisseurs de puissance efficaces. Le SL présente des délais de propagation mesurés de 7.6ns. Les résultats mesurés montrent le fonctionnement du circuit présenté sur la plage de fréquence de 1MHz à 130MHz. Le circuit fabriqué consomme 31.5pW de puissance statique et 3.4pJ d'énergie par transition à 1kHz, V[indice DDL] = 0.8V , V[indice DDH] = 3.0V, et une charge capacitive C[indice L] = 0.1pF. La consommation énergétique totale mesurée par rapport à la charge capacitive de 0.1 à 100nF est indiquée. Un autre nouveau décalage vers le bas est proposé pour être utilisé sur le côté bas des pilotes de portes. Ce circuit est également nécessaire dans la partie Rₓ du réseau de bus de données pour recevoir le signal haute tension du réseau et délivrer un signal de faible amplitude à la partie basse tension. L'une des principales contributions de ces travaux est la proposition d'un modèle de référence pour l'abaissement de niveau à puissance unique reconfigurable. Le circuit proposé pilote avec succès une gamme de charges capacitives allant de 10fF à 350pF. Le circuit présenté consomme des puissances statiques et dynamiques de 62.37pW et 108.9µW, respectivement, à partir d'une alimentation de 3.3V lorsqu'il fonctionne à 1MHz et pilote une charge capacitive de 10pF. Les résultats de la simulation post-layout montrent que les délais de propagation de chute et de montée dans les trois configurations sont respectivement de l'ordre de 0.54 à 26.5ns et de 11.2 à 117.2ns. La puce occupe une surface de 80µm × 100µm. En effet, les temps morts des côtés hauts et bas varient en raison de la différence de fonctionnement des commutateurs de puissance côté haut et côté bas, qui sont respectivement en commutation dure et douce. Par conséquent, un générateur de temps mort reconfigurable asymétrique doit être ajouté aux pilotes de portes traditionnelles pour obtenir une conversion efficace. Notamment, le temps mort asymétrique optimal pour les côtés hauts et bas des convertisseurs de puissance à base de Gan doit être fourni par un circuit de commande de grille reconfigurable pour obtenir une conception efficace. Le temps mort optimal pour les convertisseurs de puissance dépend de la topologie. Une autre contribution importante de ce travail est la dérivation d'une équation précise du temps mort optimal pour un convertisseur buck. Le générateur de temps mort asymétrique reconfigurable fabriqué sur mesure est connecté à un convertisseur buck pour valider le fonctionnement du circuit proposé et l'équation dérivée. De plus le rendement d'un convertisseur buck typique avec T[indice DLH] minimum et T[indice DHL] optimal (basé sur l'équation dérivée) à I[indice Load] = 25mA est amélioré de 12% par rapport à un convertisseur avec un temps mort fixe de T[indice DLH] = T[indice DHL] = 12ns.Power management systems require power converters to provide appropriate power conversion for various purposes. Class D power amplifiers, half and full bridges, class E power amplifiers, buck converters, and boost converters are different types of power converters. Power efficiency and density are two prominent specifications for designing a power converter. For example, in implantable devices, when power is harvested from the main source, buck or boost power converters are required to receive the power from the input and deliver clean power to different parts of the system. In charge stations of electric cars, new cell phones, neural stimulators, and so on, power is transmitted wirelessly, and Class E power amplifiers are developed to accomplish this task. In headphone or speaker driver applications, Class D power amplifiers are an excellent choice due to their great efficiency. In sensor interfaces, half and full bridges are the appropriate interfaces between the low- and high-power sides of systems. In automotive applications, the sensor interface receives the signal from the low-power side and transmits it to a network on the high-power side. In addition, the sensor interface must receive a signal from the high-power side and convert it down to the low-power side. All the above-summarized systems require a particular gate driver to be included in the circuits depending on the applications. The gate drivers generally consist of the level-up shifter, the level-down shifter, a buffer chain, an under-voltage lock-out circuit, a deadtime circuit, logic gates, the Schmitt trigger, and a bootstrap mechanism. These circuits are necessary to achieve the proper functionality of the power converter systems. A reconfigurable gate driver would support a wide range of power converters with variable input voltage V[subscript IN] and output current I[subscript Load]. The goal of this project is to intensively investigate the causes of different losses in power converters and then propose novel circuits and methodologies in the different circuits of gate drivers to achieve power conversion with high-power efficiency and density. We propose novel deadtime circuits, level-up shifter, and level-down shifter with new topologies that were fully characterized experimentally. Furthermore, the mathematical equation for optimum deadtimes for the high and low sides of a buck converter is derived and proven experimentally. The proposed custom integrated circuits and methodologies are validated with different power converters, such as half bridge and open loop buck converters, using off-the-shelf components to demonstrate their superiority over traditional solutions. The main contributions of this research have been presented in seven high prestigious conferences, three peer-reviewed articles, which have been published or submitted, and one invention disclosure. An important contribution of this research work is the proposal of a novel custom integrated CMOS active non-overlapping signal generator, which was fabricated using the 0.35−µm AMS technology and consumes 16.8mW from a 3.3−V supply voltage to appropriately drive the low and high sides of the half bridge to remove the shoot-through. The fabricated chip is validated experimentally with a half bridge, which was implemented with off-the-shelf components and driving a R-L load. Measurement results show a 40% reduction in the total loss of a 45 − V input 1 − MHz half bridge compared with the half bridge operation without our custom integrated circuit. The main circuit of high-side gate driver is the level-up shifter, which provides a signal with a large amplitude for the high-side power switch. A new level shifter structure with minimal propagation delay must be presented. We propose a novel level shifter topology for the high side of gate drivers to produce efficient power converters. The LS shows measured propagation delays of 7.6ns. The measured results demonstrate the operation of the presented circuit over the frequency range of 1MHz to 130MHz. The fabricated circuit consumes 31.5pW of static power and 3.4pJ of energy per transition at 1kHz, V[subscript DDL] = 0.8V , V[subscript DDH] = 3.0V , and capacitive load C[subscript L] = 0.1pF. The measured total power consumption versus the capacitive load from 0.1pF to 100nF is reported. Another new level-down shifter is proposed to be used on the low side of gate drivers. Another new level-down shifter is proposed to be used on the low side of gate drivers. This circuit is also required in the Rₓ part of the data bus network to receive the high-voltage signal from the network and deliver a signal with a low amplitude to the low-voltage part. An essential contribution of this work is the proposal of a single supply reconfigurable level-down shifter. The proposed circuit successfully drives a range of capacitive load from 10fF to 350pF. The presented circuit consumes static and dynamic powers of 62.37pW and 108.9µW, respectively, from a 3.3 − V supply when working at 1MHz and drives a 10pF capacitive load. The post-layout simulation results show that the fall and rise propagation delays in the three configurations are in the range of 0.54 − 26.5ns and 11.2 − 117.2ns, respectively. Its core occupies an area of 80µm × 100µm. Indeed, the deadtimes for the high and low sides vary due to the difference in the operation of the high- and low-side power switches, which are under hard and soft switching, respectively. Therefore, an asymmetric reconfigurable deadtime generator must be added to the traditional gate drivers to achieve efficient conversion. Notably, the optimal asymmetric deadtime for the high and low sides of GaN-based power converters must be provided by a reconfigurable gate driver to achieve efficient design. The optimum deadtime for power converters depends on the topology. Another important contribution of this work is the derivation of an accurate equation of optimum deadtime for a buck converter. The custom fabricated reconfigurable asymmetric deadtime generator is connected to a buck converter to validate the operation of the proposed circuit and the derived equation. The efficiency of a typical buck converter with minimum T[subscript DLH] and optimal T[subscript DHL] (based on the derived equation) at I[subscript Load] = 25mA is improved by 12% compared to a converter with a fixed deadtime of T[subscript DLH] = T[subscript DHL] = 12ns

Development of a Sensor Readout Integrated Circuit Towards a Contact Lens for Wireless Intraocular Pressure Monitoring

This design covers the design of an integrated circuit (IC) in support of the active contact lens project at Cal Poly. The project aims to monitor intraocular eye pressure (IOP) to help diagnose and treat glaucoma, which is expected affect 6.3 million Americans by 2050. The IC is designed using IBM’s 130 nm 8RF process, is powered by an on-lens thin film 3.8 V rechargeable battery, and will be fabricated at no cost through MOSIS. The IC features a low-power linear regulator that powers a current-starved voltage-controlled oscillator (CSVCO) used for establishing a backscatter communication link. Additional circuitry is included to regulate power to and from the battery. An undervoltage lockout circuit protects the battery from deep discharge damage. When recharging, a rectifier and a voltage regulator provides overvoltage protection. These circuit blocks are biased primarily using a 696 mV subthreshold voltage reference that consumes 110.5 nA

High frequency point-of-load (POL) DC-DC converters employing CMOS or GaN HEMT switches

This thesis compares 2-level and 3-level buck converters, for use in very high frequency Point-of-Load (POL) DC-DC conversion. The nominal conversion is from 5 V to 1.8 V, at a 1 A output current, as is appropriate for use in a battery powered device. Today’s typical commercial POL solution for this challenge employs a monolithic CMOS power switcher operating at 2-3 MHz and uses a discrete surface mountable (SMT) ferrite chip inductor. This work investigates the performance achievable over the 20-40 MHz range with the use of a new specially designed and fabricated Tyndall thin-film magnetics-on-silicon (tf-MoS) inductor component. Two different power switching bridge types, CMOS and GaN, are investigated by both analytic loss modelling and by SPICE simulation. The CMOS bridge assumes a PMOS and NMOS combination using device models from a 180 nm CMOS process and the GaN bridge is based on commercially available discrete enhancement mode GaN HEMT switches. A behavioural model for a state-of-the-art commercial driver is developed. Measurements are initially made on a prototype 2-level GaN bridge circuit with opencircuit switch-node to allow for determination of load independent silicon losses. These measurements are used to validate both the switch with driver models and the circuit loss analyses. Inductor loss is one of the key practical limitations towards achieving very high frequency switching. Both modelling and measurement techniques are used to investigate the performance of the custom thin-film inductor. An ultimate reference case, low-loss air-core inductor was wound and used to measure the lowest achievable complete converter loss over the 20-40 MHz range. Two SMT ferrite chip inductor options were selected based on datasheets review and fitted in the prototype to achieve the best performance with currently available commercial components. These three inductors and a new custom Tyndall thin film inductor are all simulated and tested in combination with the 2-level GaN switching bridge. The measured overall efficiencies with loss breakdowns are presented for the various combinations of switch components and inductor technologies in 2-level converter. These measurements validate the models and simulations so that simulations for an extension to the 3-level converter and its performance comparison versus the 2-level converter may be made