Reconfigurable Receiver Front-Ends for Advanced Telecommunication Technologies

The exponential growth of converging technologies, including augmented reality, autonomous vehicles, machine-to-machine and machine-to-human interactions, biomedical and environmental sensory systems, and artificial intelligence, is driving the need for robust infrastructural systems capable of handling vast data volumes between end users and service providers. This demand has prompted a significant evolution in wireless communication, with 5G and subsequent generations requiring exponentially improved spectral and energy efficiency compared to their predecessors. Achieving this entails intricate strategies such as advanced digital modulations, broader channel bandwidths, complex spectrum sharing, and carrier aggregation scenarios. A particularly challenging aspect arises in the form of non-contiguous aggregation of up to six carrier components across the frequency range 1 (FR1). This necessitates receiver front-ends to effectively reject out-of-band (OOB) interferences while maintaining high-performance in-band (IB) operation. Reconfigurability becomes pivotal in such dynamic environments, where frequency resource allocation, signal strength, and interference levels continuously change. Software-defined radios (SDRs) and cognitive radios (CRs) emerge as solutions, with direct RF-sampling receivers offering a suitable architecture in which the frequency translation is entirely performed in digital domain to avoid analog mixing issues. Moreover, direct RF- sampling receivers facilitate spectrum observation, which is crucial to identify free zones, and detect interferences. Acoustic and distributed filters offer impressive dynamic range and sharp roll off characteristics, but their bulkiness and lack of electronic adjustment capabilities limit their practicality. Active filters, on the other hand, present opportunities for integration in advanced CMOS technology, addressing size constraints and providing versatile programmability. However, concerns about power consumption, noise generation, and linearity in active filters require careful consideration.This thesis primarily focuses on the design and implementation of a low-voltage, low-power RFFE tailored for direct sampling receivers in 5G FR1 applications. The RFFE consists of a balun low-noise amplifier (LNA), a Q-enhanced filter, and a programmable gain amplifier (PGA). The balun-LNA employs noise cancellation, current reuse, and gm boosting for wideband gain and input impedance matching. Leveraging FD-SOI technology allows for programmable gain and linearity via body biasing. The LNA's operational state ranges between high-performance and high-tolerance modes, which are apt for sensitivityand blocking tests, respectively. The Q-enhanced filter adopts noise-cancelling, current-reuse, and programmable Gm-cells to realize a fourth-order response using two resonators. The fourth-order filter response is achieved by subtracting the individual response of these resonators. Compared to cascaded and magnetically coupled fourth-order filters, this technique maintains the large dynamic range of second-order resonators. Fabricated in 22-nm FD-SOI technology, the RFFE achieves 1%-40% fractional bandwidth (FBW) adjustability from 1.7 GHz to 6.4 GHz, 4.6 dB noise figure (NF) and an OOB third-order intermodulation intercept point (IIP3) of 22 dBm. Furthermore, concerning the implementation uncertainties and potential variations of temperature and supply voltage, design margins have been considered and a hybrid calibration scheme is introduced. A combination of on-chip and off-chip calibration based on noise response is employed to effectively adjust the quality factors, Gm-cells, and resonance frequencies, ensuring desired bandpass response. To optimize and accelerate the calibration process, a reinforcement learning (RL) agent is used.Anticipating future trends, the concept of the Q-enhanced filter extends to a multiple-mode filter for 6G upper mid-band applications. Covering the frequency range from 8 to 20 GHz, this RFFE can be configured as a fourth-order dual-band filter, two bandpass filters (BPFs) with an OOB notch, or a BPF with an IB notch. In cognitive radios, the filter’s transmission zeros can be positioned with respect to the carrier frequencies of interfering signals to yield over 50 dB blocker rejection

Survey on individual components for a 5 GHz receiver system using 130 nm CMOS technology

La intención de esta tesis es recopilar información desde un punto de vista general sobre los diferentes tipos de componentes utilizados en un receptor de señales a 5 GHz utilizando tecnología CMOS. Se ha realizado una descripción y análisis de cada uno de los componentes que forman el sistema, destacando diferentes tipos de configuraciones, figuras de mérito y otros parámetros. Se muestra una tabla resumen al final de cada sección, comparando algunos diseños que se han ido presentando a lo largo de los años en conferencias internacionales de la IEEE.The intention of this thesis is to gather information from an overview point about the different types of components used in a 5 GHz receiver using CMOS technology. A review of each of the components that form the system has been made, highlighting different types of configurations, figure of merits and parameters. A summary table is shown at the end of each section, comparing many designs that have been presented over the years at international conferences of the IEEE.Departamento de Ingeniería Energética y FluidomecánicaGrado en Ingeniería en Electrónica Industrial y Automátic

Saw-Less radio receivers in CMOS

Smartphones play an essential role in our daily life. Connected to the internet, we can easily keep in touch with family and friends, even if far away, while ever more apps serve us in numerous ways. To support all of this, higher data rates are needed for ever more wireless users, leading to a very crowded radio frequency spectrum. To achieve high spectrum efficiency while reducing unwanted interference, high-quality band-pass filters are needed. Piezo-electrical Surface Acoustic Wave (SAW) filters are conventionally used for this purpose, but such filters need a dedicated design for each new band, are relatively bulky and also costly compared to integrated circuit chips. Instead, we would like to integrate the filters as part of the entire wireless transceiver with digital smartphone hardware on CMOS chips. The research described in this thesis targets this goal. It has recently been shown that N-path filters based on passive switched-RC circuits can realize high-quality band-select filters on CMOS chips, where the center frequency of the filter is widely tunable by the switching-frequency. As CMOS downscaling following Moore’s law brings us lower clock-switching power, lower switch on-resistance and more compact metal-to-metal capacitors, N-path filters look promising. This thesis targets SAW-less wireless receiver design, exploiting N-path filters. As SAW-filters are extremely linear and selective, it is very challenging to approximate this performance with CMOS N-path filters. The research in this thesis proposes and explores several techniques for extending the linearity and enhancing the selectivity of N-path switched-RC filters and mixers, and explores their application in CMOS receiver chip designs. First the state-of-the-art in N-path filters and mixer-first receivers is reviewed. The requirements on the main receiver path are examined in case SAW-filters are removed or replaced by wideband circulators. The feasibility of a SAW-less Frequency Division Duplex (FDD) radio receiver is explored, targeting extreme linearity and compression Irequirements. A bottom-plate mixing technique with switch sharing is proposed. It improves linearity by keeping both the gate-source and gate-drain voltage swing of the MOSFET-switches rather constant, while halving the switch resistance to reduce voltage swings. A new N-path switch-RC filter stage with floating capacitors and bottom-plate mixer-switches is proposed to achieve very high linearity and a second-order voltage-domain RF-bandpass filter around the LO frequency. Extra out-of-band (OOB) rejection is implemented combined with V-I conversion and zero-IF frequency down-conversion in a second cross-coupled switch-RC N-path stage. It offers a low-ohmic high-linearity current path for out-of-band interferers. A prototype chip fabricated in a 28 nm CMOS technology achieves an in-band IIP3 of +10 dBm , IIP2 of +42 dBm, out-of-band IIP3 of +44 dBm, IIP2 of +90 dBm and blocker 1-dB gain-compression point of +13 dBm for a blocker frequency offset of 80 MHz. At this offset frequency, the measured desensitization is only 0.6 dB for a 0-dBm blocker, and 3.5 dB for a 10-dBm blocker at 0.7 GHz operating frequency (i.e. 6 and 9 dB blocker noise figure). The chip consumes 38-96 mW for operating frequencies of 0.1-2 GHz and occupies an active area of 0.49 mm2. Next, targeting to cover all frequency bands up to 6 GHz and achieving a noise figure lower than 3 dB, a mixer-first receiver with enhanced selectivity and high dynamic range is proposed. Capacitive negative feedback across the baseband amplifier serves as a blocker bypassing path, while an extra capacitive positive feedback path offers further blocker rejection. This combination of feedback paths synthesizes a complex pole pair at the input of the baseband amplifier, which is up-converted to the RF port to obtain steeper RF-bandpass filter roll-off than the conventional up-converted real pole and reduced distortion. This thesis explains the circuit principle and analyzes receiver performance. A prototype chip fabricated in 45 nm Partially Depleted Silicon on Insulator (PDSOI) technology achieves high linearity (in-band IIP3 of +3 dBm, IIP2 of +56 dBm, out-of-band IIP3 = +39 dBm, IIP2 = +88 dB) combined with sub-3 dB noise figure. Desensitization due to a 0-dBm blocker is only 2.2 dB at 1.4 GHz operating frequency. IIFinally, to demonstrate the performance of the implemented blocker-tolerant receiver chip designs, a test setup with a real mobile phone is built to verify the sensitivity of the receiver chip for different practical blocking scenarios

17-21 GHz Low-Noise Amplifier with Embedded Interference Rejection

The ever-growing demand for high performance wireless connectivity has led to the development of fifth-generation (5G) wireless communication standards as well as satellite communication (Satcom). Both 5G wireless communications and Satcom use higher carrier frequencies than traditional standards such as 4G and WiFi. While the higher carrier frequencies allow for larger bandwidths and faster data rates, they come with the cost of high free-space path loss. This high loss necessitates the use of active phased array antennas, which can require hundreds of integrated circuits (ICs) designed in Complimentary Metal-Oxide Semiconductor (CMOS) processes. Furthermore, in a future world with ubiquitous 5G wireless base stations and Satcom users, it is conceivable that Satcom receivers can be jammed by high-power Satcom transmitters and 5G signals. Therefore, Satcom phased arrays must be designed for resilience against these sources of interference while supporting high data rates. One of the key components in a Satcom receiver is the low-noise amplifier (LNA). It is responsible for amplifying the weak, noisy signal received from the satellite into a signal with sufficiently high signal-to-noise ratio for demodulation. One possible solution for making the phased array resilient to sources of interference is to embed filtering in the LNA. This thesis presents two LNA designs that employ embedded filtering for resiliency to interference from 5G wireless signals and Satcom transmitters. First, the circuit-level specifications of a 17.7 - 21.2 GHz (K-band) LNA for satellite communication phased array beamformers are derived from the system requirements. Next, the LNA designs are presented. The first LNA is designed to have out-of-band filtering at 24-30 GHz, which corresponds to the bands containing both 5G and Satcom transmitter interferers. The second LNA is designed to have out-of-band filtering at 27-30 GHz, which addresses a different scenario where the Satcom transmitter is the sole source of interference. Both LNAs are implemented in the Global Foundries 130nm 8XP Silicon-Germanium Bipolar CMOS (SiGe BiCMOS) process. A novel transformer feedback notch is introduced that enhances the filtering capabilities of the amplifier. The full electromagnetic simulation of the first LNA shows a peak gain of 28.8 dB, a minimum noise figure of 1.85 dB, and and input 1 dB compression point (IP1dB) greater than -17 dBm between 24 and 30 GHz. The second LNA shows a peak gain of 27.9 dB, a minimum noise figure of 1.78 dB, and an IP1dB greater than -15 dBm between 27 and 30 GHz. Both LNAs meet specifications sufficient for a Satcom receiver at the same time as having resiliency to out-of-band interference sources

Highly Linear Filtering TIA for 5G wireless standard and beyond

The demand for high data rates in emerging wireless standards is a result of the growing number of wireless device subscribers. This demand is met by increasing the channel bandwidth in accordance with historical trends. As MIMO technology advances, more bands and antennas are expected to be used. The most recent 5G standard makes use of mm-wave bands above 24GHz to expand the channel bandwidth. Channel bandwidth can exceed 2GHz when carrier aggregation is used. From the receiver’s point of view, this makes the baseband filter’s design, which is often a TIA, more difficult. This is due to the fact that as the bandwidth approaches the GHz range, the TIA’s UGBW should be more than 5GHz and it should have a high loop gain up to high frequencies. A closed-loop TIA with configurable bandwidth up to 1.5GHz is described in this scenario. Operational Transconductance Amplifier (OTA) closed in shunt-feedback is the foundation of the TIA. The proposed OTA is based on FeedForward topology (FF) together with inductive peaking technique to ensure stability rather than using the traditional Miller compensation technique. The TIA is able to produce GLoop unity gain bandwidth of 7.5GHz and high loop gain (i.e. 27dB @ 1GHz) using this method. The mixer and LNA’s linearity will benefit from this. Utilizing TSMC 28nm CMOS technology, a prototype has been created using this methodology. The output integrated noise from 20MHz to 1.5GHz is lower than 300μVrms with a power consumption of 17mW, and the TIA achieves In-band OIP3 of 33dBm. Additionally, a direct-conversion receiver for 5G applications is described. The 7GHz RF signal is down-converted to baseband by the receiver. Two cascaded LNTAs based on a common-gate transformer-based design make up the frontend. With an RF gain of 80mS and a gain variability of 31dB, it provides wideband matching from 6GHz to 8GHz. A double-balanced passive mixer is driven by the LNTA. The channel bandwidth from 50MHz to 2GHz is covered by two baseband paths. The first path, called as the low frequency path (LF), covers the channel bandwidth ranging from 50MHz to 400 MHz. In contrast, the second path, called as the high frequency path (HF), covers the channel bandwidth between 800MHz and 2GHz. Two baseband provide gain variability of 14dB, making the overall receiver able to have a gain configurability from 45dB to 0dB. Out-of-band (OOB) selectivity at 4 times the band-edge is greater than 33dB for each configurability. When the gain is at its maximum, the noise figure is less than 5.8dB, and the slope of the noise rise as the gain falls is less than 0.7dB/dB. The receiver guarantee an IB-OIP3 larger than 21dBm for any gain configuration. The receiver has been implemented in TSMC 28nm CMOS technology, consuming 51mW for LF path and 68mW for HF path. The measurement results are in perfect accordance with the requirements of the design

Microwave and Millimeter-wave Concurrent Multiband Low-Noise Amplifiers and Receiver Front-end in SiGe BiCMOS Technology

A fully integrated SiGe BiCMOS concurrent multiband receiver front-end and its building blocks including multiband low-noise amplifiers (LNAs), single-to-differential amplifiers and mixer are presented for various Ku-/K-/Ka-band applications. The proposed concurrent multiband receiver building blocks and receiver front-end achieve the best stopband rejection performances as compared to the existing multiband LNAs and receivers. First, a novel feedback tri-band load composed of two inductor feedback notch filters is proposed to overcome the low Q-factor of integrated passive inductors, and hence it provides superior stopband rejection ratio (SRR). A new 13.5/24/35-GHz concurrent tri-band LNA implementing the feedback tri-band load is presented. The developed tri-band LNA is the first concurrent tri-band LNA operating up to millimeter-wave region. By expanding the operating principle of the feedback tri-band load, a 21.5/36.5-GHz concurrent dual-band LNA with an inductor feedback dual-band load and another 23/36-GHz concurrent dual-band LNA with a new transformer feedback dual-band load are also presented. The latter provides more degrees of freedom for the creation of the stopband and passbands as compared to the former. A 22/36-GHz concurrent dual-band single-to-differential LNA employing a novel single-to-differential transformer feedback dual-band load is presented. The developed LNA is the first true concurrent dual-band single-to-differential amplifier. A novel 24.5/36.5 GHz concurrent dual-band merged single-to-differential LNA and mixer implementing the proposed single-to-differential transformer feedback dual-band load is also presented. With a 21-GHz LO signal, the down-converted dual IF bands are located at 3.5/15.5 GHz for two passband signals at 24.5/36.5 GHz, respectively. The proposed merged LNA and mixer is the first fully integrated concurrent dual-band mixer operating up to millimeter-wave frequencies without using any switching mechanism. Finally, a 24.5/36.5-GHz concurrent dual-band receiver front-end is proposed. It consists of the developed concurrent dual-band LNA using the single-to-single transformer feedback dual-band load and the developed concurrent dual-band merged LNA and mixer employing the single-to-differential transformer feedback dual-band load. The developed concurrent dual-band receiver front-end achieves the highest gain and the best NF performances with the largest SRRs, while operating at highest frequencies up to millimeter-wave region, among the concurrent dual-band receivers reported to date

Microwave and Millimeter-wave Concurrent Multiband Low-Noise Amplifiers and Receiver Front-end in SiGe BiCMOS Technology

A fully integrated SiGe BiCMOS concurrent multiband receiver front-end and its building blocks including multiband low-noise amplifiers (LNAs), single-to-differential amplifiers and mixer are presented for various Ku-/K-/Ka-band applications. The proposed concurrent multiband receiver building blocks and receiver front-end achieve the best stopband rejection performances as compared to the existing multiband LNAs and receivers. First, a novel feedback tri-band load composed of two inductor feedback notch filters is proposed to overcome the low Q-factor of integrated passive inductors, and hence it provides superior stopband rejection ratio (SRR). A new 13.5/24/35-GHz concurrent tri-band LNA implementing the feedback tri-band load is presented. The developed tri-band LNA is the first concurrent tri-band LNA operating up to millimeter-wave region. By expanding the operating principle of the feedback tri-band load, a 21.5/36.5-GHz concurrent dual-band LNA with an inductor feedback dual-band load and another 23/36-GHz concurrent dual-band LNA with a new transformer feedback dual-band load are also presented. The latter provides more degrees of freedom for the creation of the stopband and passbands as compared to the former. A 22/36-GHz concurrent dual-band single-to-differential LNA employing a novel single-to-differential transformer feedback dual-band load is presented. The developed LNA is the first true concurrent dual-band single-to-differential amplifier. A novel 24.5/36.5 GHz concurrent dual-band merged single-to-differential LNA and mixer implementing the proposed single-to-differential transformer feedback dual-band load is also presented. With a 21-GHz LO signal, the down-converted dual IF bands are located at 3.5/15.5 GHz for two passband signals at 24.5/36.5 GHz, respectively. The proposed merged LNA and mixer is the first fully integrated concurrent dual-band mixer operating up to millimeter-wave frequencies without using any switching mechanism. Finally, a 24.5/36.5-GHz concurrent dual-band receiver front-end is proposed. It consists of the developed concurrent dual-band LNA using the single-to-single transformer feedback dual-band load and the developed concurrent dual-band merged LNA and mixer employing the single-to-differential transformer feedback dual-band load. The developed concurrent dual-band receiver front-end achieves the highest gain and the best NF performances with the largest SRRs, while operating at highest frequencies up to millimeter-wave region, among the concurrent dual-band receivers reported to date

Efficient and Linear CMOS Power Amplifier and Front-end Design for Broadband Fully-Integrated 28-GHz 5G Phased Arrays

Demand for data traffic on mobile networks is growing exponentially with time and on a global scale. The emerging fifth-generation (5G) wireless standard is being developed with millimeter-wave (mm-Wave) links as a key technological enabler to address this growth by a 2020 time frame. The wireless industry is currently racing to deploy mm-Wave mobile services, especially in the 28-GHz band. Previous widely-held perceptions of fundamental propagation limitations were overcome using phased arrays. Equally important for success of 5G is the development of low-power, broadband user equipment (UE) radios in commercial-grade technologies. This dissertation demonstrates design methodologies and circuit techniques to tackle the critical challenge of key phased array front-end circuits in low-cost complementary metal oxide semiconductor (CMOS) technology. Two power amplifier (PA) proof-of-concept prototypes are implemented in deeply scaled 28- nm and 40-nm CMOS processes, demonstrating state-of-the-art linearity and efficiency for extremely broadband communication signals. Subsequently, the 40 nm PA design is successfully embedded into a low-power fully-integrated transmit-receive front-end module. The 28 nm PA prototype in this dissertation is the first reported linear, bulk CMOS PA targeting low-power 5G mobile UE integrated phased array transceivers. An optimization methodology is presented to maximizing power added efficiency (PAE) in the PA output stage at a desired error vector magnitude (EVM) and range to address challenging 5G uplink requirements. Then, a source degeneration inductor in the optimized output stage is shown to further enable its embedding into a two-stage transformer-coupled PA. The inductor helps by broadening inter-stage impedance matching bandwidth, and helping to reduce distortion. Designed and fabricated in 1P7M 28 nm bulk CMOS and using a 1 V supply, the PA achieves +4.2 dBm/9% measured Pout/PAE at −25 dBc EVM for a 250 MHz-wide, 64-QAM orthogonal frequency division multiplexing (OFDM) signal with 9.6 dB peak-to-average power ratio (PAPR). The PA also achieves 35.5%/10% PAE for continuous wave signals at saturation/9.6dB back-off from saturation. To the best of the author’s knowledge, these are the highest measured PAE values among published K- and K a-band CMOS PAs to date. To drastically extend the communication bandwidth in 28 GHz-band UE devices, and to explore the potential of CMOS technology for more demanding access point (AP) devices, the second PA is demonstrated in a 40 nm process. This design supports a signal radio frequency bandwidth (RFBW) >3× the state-of-the-art without degrading output power (i.e. range), PAE (i.e. battery life), or EVM (i.e. amplifier fidelity). The three-stage PA uses higher-order, dual-resonance transformer matching networks with bandwidths optimized for wideband linearity. Digital gain control of 9 dB range is integrated for phased array operation. The gain control is a needed functionality, but it is largely absent from reported high-performance mm-Wave PAs in the literature. The PA is fabricated in a 1P6M 40 nm CMOS LP technology with 1.1 V supply, and achieves Pout/PAE of +6.7 dBm/11% for an 8×100 MHz carrier aggregation 64-QAM OFDM signal with 9.7 dB PAPR. This PA therefore is the first to demonstrate the viability of CMOS technology to address even the very challenging 5G AP/downlink signal bandwidth requirement. Finally, leveraging the developed PA design methodologies and circuits, a low power transmit-receive phased array front-end module is fully integrated in 40 nm technology. In transmit-mode, the front-end maintains the excellent performance of the 40 nm PA: achieving +5.5 dBm/9% for the same 8×100 MHz carrier aggregation signal above. In receive-mode, a 5.5 dB noise figure (NF) and a minimum third-order input intercept point (IIP₃) of −13 dBm are achieved. The performance of the implemented CMOS frontend is comparable to state-of-the-art publications and commercial products that were very recently developed in silicon germanium (SiGe) technologies for 5G communication

BiCMOS Millimetre-wave low-noise amplifier

Abstract: Please refer to full text to view abstract.D.Phil. (Electrical and Electronic Engineering

Optoelectronic oscillator for 5G wireless networks and beyond

With the development of 5G wireless network and beyond, the wireless carrier frequency will definitely reach millimeter-wave (mm-wave) and even terahertz (THz). As one of the key elements in wireless networks, the local oscillator (LO) needs to operate at mm-wave and THz band with lower phase noise, which becomes a major challenge for commercial LOs. In this article, we investigate the recent developments of the electronic integrated circuit (EIC) oscillator and the optoelectronic oscillator (OEO), and especially investigate the prospect of OEO serving as a qualified LO in the 5G wireless network and beyond. Both the EIC oscillators and OEOs are investigated, including their basic theories of operation, representative techniques and some milestones in applications. Then, we compare the performances between the EIC oscillators and the OEOs in terms of frequency accuracy, phase noise, power consumption and cost. After describing the specific requirements of LO based on the standard of 5G and 6G wireless communication systems, we introduce an injection-locked OEO architecture which can be implemented to distribute and synchronize LOs. The OEO has better phase noise performance at high frequency, which is greatly desired for LO in 5G wireless network and beyond. Besides, the OEO provides an easy and low-loss method to distribute and synchronize mm-wave and THz LOs. Thanks to photonic integrated circuit development, the power consumption and cost of OEO reduce gradually. It is foreseeable that the integrated OEO with lower cost may have a promising prospect in the 5G wireless network and beyond