Dynamic range optimisation of CMOS image sensors dedicated to space applications

Nowadays, CMOS image sensors are widely considered for space applications. Their performances have been significantly enhanced with the use of CIS (CMOS Image Sensor) processes in term of dark current, quantum efficiency and conversion gain. Dynamic Range (DR) remains an important parameter for a lot of applications. Most of the dynamic range limitation of CMOS image sensors comes from the pixel. During work performed in collaboration with EADS Astrium, SUPAERO/CIMI laboratory has studied different ways to improve dynamic range and test structures have been developed to perform analysis and characterisation. A first way to improve dynamic range will be described, consisting in improving the voltage swing at the pixel output. Test vehicles and process modifications made to improve voltage swing will be depicted. We have demonstrated a voltage swing improvement more than 30%. A second way to improve dynamic range is to reduce readout noise A new readout architecture has been developed to perform a correlated double sampling readout. Strong readout noise reduction will be demonstrated by measurements performed on our test vehicle. A third way to improve dynamic range is to control conversion gain value. Indeed, in 3 TMOS pixel structure, dynamic range is related to conversion gain through reset noise which is dependant of photodiode capacitance. Decrease and increase of conversion gain have been performed with different design techniques. A good control of the conversion gain will be demonstrated with variation in the range of 0.05 to 3 of initial conversion gain

CMOS detectors for space applications: from R&D to operational program with large volume foundry

Nowadays, CMOS image sensors are widely considered for space applications. The use of CIS (CMOS Image sensor) processes has significantly enhanced their performances such as dark current, quantum efficiency and conversion gain. However, in order to fulfil specific space mission requirements, dedicated research and development work has to be performed to address specific detector performance issues. This is especially the case for dynamic range improvement through output voltage swing optimisation, control of conversion gain and noise reduction. These issues have been addressed in a 0.35μm CIS process, based on a large volume CMOS foundry, by several joint ISAE- EADS Astrium R&D programs. These results have been applied to the development of the visible and near-infrared multi-linear imager for the SENTINEL 2 mission (LEO Earth observation mission for the Global Measurement Environment and Security program). For this high performance multi-linear device, output voltage swing improvement is achieved by process optimisation done in collaboration with foundry. Conversion gain control is also achieved for each spectral band by managing photodiode capacitance. A low noise level at sensor output is reached by the use of an architecture allowing Correlated Double Sampling readout in order to eliminate reset noise (KTC noise). KTC noise elimination reveals noisy pixels due to RTS noise. Optimisation of transistors’s dimensions, taking into account conversion gain constraints, is done to minimise these noisy pixels. Additional features have been also designed: 1) Due to different integration times between spectral bands required by mission, a specific readout mode was developed in order to avoid electrical perturbations during the integration time and readout. This readout mode leads to specific power supply architecture. 2)Post processing steps can be achieved by alignment marks design allowing a very good accuracy. These alignment marks can be used for a black coating deposition between spectral bands (pixel line) in order to minimise straight lighteffects. In conclusion a review of design improvements and performances of the final component is performed

CMOS-3D smart imager architectures for feature detection

This paper reports a multi-layered smart image sensor architecture for feature extraction based on detection of interest points. The architecture is conceived for 3-D integrated circuit technologies consisting of two layers (tiers) plus memory. The top tier includes sensing and processing circuitry aimed to perform Gaussian filtering and generate Gaussian pyramids in fully concurrent way. The circuitry in this tier operates in mixed-signal domain. It embeds in-pixel correlated double sampling, a switched-capacitor network for Gaussian pyramid generation, analog memories and a comparator for in-pixel analog-to-digital conversion. This tier can be further split into two for improved resolution; one containing the sensors and another containing a capacitor per sensor plus the mixed-signal processing circuitry. Regarding the bottom tier, it embeds digital circuitry entitled for the calculation of Harris, Hessian, and difference-of-Gaussian detectors. The overall system can hence be configured by the user to detect interest points by using the algorithm out of these three better suited to practical applications. The paper describes the different kind of algorithms featured and the circuitry employed at top and bottom tiers. The Gaussian pyramid is implemented with a switched-capacitor network in less than 50 μs, outperforming more conventional solutions.Xunta de Galicia 10PXIB206037PRMinisterio de Ciencia e Innovación TEC2009-12686, IPT-2011-1625-430000Office of Naval Research N00014111031

Ultra-low noise, high-frame rate readout design for a 3D-stacked CMOS image sensor

Due to the switch from CCD to CMOS technology, CMOS based image sensors have become smaller, cheaper, faster, and have recently outclassed CCDs in terms of image quality. Apart from the extensive set of applications requiring image sensors, the next technological breakthrough in imaging would be to consolidate and completely shift the conventional CMOS image sensor technology to the 3D-stacked technology. Stacking is recent and an innovative technology in the imaging field, allowing multiple silicon tiers with different functions to be stacked on top of each other. The technology allows for an extreme parallelism of the pixel readout circuitry. Furthermore, the readout is placed underneath the pixel array on a 3D-stacked image sensor, and the parallelism of the readout can remain constant at any spatial resolution of the sensors, allowing extreme low noise and a high-frame rate (design) at virtually any sensor array resolution. The objective of this work is the design of ultra-low noise readout circuits meant for 3D-stacked image sensors, structured with parallel readout circuitries. The readout circuit’s key requirements are low noise, speed, low-area (for higher parallelism), and low power. A CMOS imaging review is presented through a short historical background, followed by the description of the motivation, the research goals, and the work contributions. The fundamentals of CMOS image sensors are addressed, as a part of highlighting the typical image sensor features, the essential building blocks, types of operation, as well as their physical characteristics and their evaluation metrics. Following up on this, the document pays attention to the readout circuit’s noise theory and the column converters theory, to identify possible pitfalls to obtain sub-electron noise imagers. Lastly, the fabricated test CIS device performances are reported along with conjectures and conclusions, ending this thesis with the 3D-stacked subject issues and the future work. A part of the developed research work is located in the Appendices.Devido à mudança da tecnologia CCD para CMOS, os sensores de imagem em CMOS tornam se mais pequenos, mais baratos, mais rápidos, e mais recentemente, ultrapassaram os sensores CCD no que respeita à qualidade de imagem. Para além do vasto conjunto de aplicações que requerem sensores de imagem, o próximo salto tecnológico no ramo dos sensores de imagem é o de mudar completamente da tecnologia de sensores de imagem CMOS convencional para a tecnologia “3D-stacked”. O empilhamento de chips é relativamente recente e é uma tecnologia inovadora no campo dos sensores de imagem, permitindo vários planos de silício com diferentes funções poderem ser empilhados uns sobre os outros. Esta tecnologia permite portanto, um paralelismo extremo na leitura dos sinais vindos da matriz de píxeis. Além disso, num sensor de imagem de planos de silício empilhados, os circuitos de leitura estão posicionados debaixo da matriz de píxeis, sendo que dessa forma, o paralelismo pode manter-se constante para qualquer resolução espacial, permitindo assim atingir um extremo baixo ruído e um alto debito de imagens, virtualmente para qualquer resolução desejada. O objetivo deste trabalho é o de desenhar circuitos de leitura de coluna de muito baixo ruído, planeados para serem empregues em sensores de imagem “3D-stacked” com estruturas altamente paralelizadas. Os requisitos chave para os circuitos de leitura são de baixo ruído, rapidez e pouca área utilizada, de forma a obter-se o melhor rácio. Uma breve revisão histórica dos sensores de imagem CMOS é apresentada, seguida da motivação, dos objetivos e das contribuições feitas. Os fundamentos dos sensores de imagem CMOS são também abordados para expor as suas características, os blocos essenciais, os tipos de operação, assim como as suas características físicas e suas métricas de avaliação. No seguimento disto, especial atenção é dada à teoria subjacente ao ruído inerente dos circuitos de leitura e dos conversores de coluna, servindo para identificar os possíveis aspetos que dificultem atingir a tão desejada performance de muito baixo ruído. Por fim, os resultados experimentais do sensor desenvolvido são apresentados junto com possíveis conjeturas e respetivas conclusões, terminando o documento com o assunto de empilhamento vertical de camadas de silício, junto com o possível trabalho futuro

Programmable active pixel sensor to investigate neural interactions within the retina

Detection of the visual scene by the eye and the resultant neural interactions of the retina-brain system give us our perception of sight. We have developed an Active Pixel Sensor (APS) to be used as a tool for both furthering understanding of these interactions via experimentation with the retina and to make developments towards a realisable retinal prosthesis. The sensor consists of 469 pixels in a hexagonal array. The pixels are interconnected by a programmable neural network to mimic lateral interactions between retinal cells. Outputs from the sensor are in the form of biphasic current pulse trains suitable to stimulate retinal cells via a biocompatible array. The APS will be described with initial characterisation and test results

Monolithic Perimeter Gated Single Photon Avalanche Diode Based Optical Detector in Standard CMOS

Since the 1930\u27s photomultiplier tubes (PMTs) have been used in single photon detection. Single photon avalanche diodes (SPADs) are p-n junctions operated in the Geiger mode. Unlike PMTs, CMOS based SPADs are smaller in size, insensitive to magnetic fields, less expensive, less temperature dependent, and have lower bias voltages. Using appropriate readout circuitry, they measure properties of single photons, such as energy, arrival time, and spatial path making them excellent candidates for single photon detection. CMOS SPADs suffer from premature breakdown due to the non-uniform distribution of the electric field. This prevents full volumetric breakdown of the device and reduces the detection effciency by increasing the noise. A novel device known as the perimeter gated SPAD (PGSPAD) is adopted in this dissertation for mitigating the premature perimeter breakdown without compromising the fill-factor of the device. The novel contributions of this work are as follows. A novel simulation model, including SPICE characteristics and the stochastic behavior, has been developed for the perimeter gated SPAD. This model has the ability to simulate the static current-voltage and dynamic response characteristics. It also simulates the noise and spectral response. A perimeter gated silicon photomultiplier, with improved signal to noise ratio, is reported for the first time. The gate voltage reduces the dark current of the silicon photomultiplier by preventing the premature breakdown. A digital SPAD with the tunable dynamic range and sensitivity is demonstrated for the first time. This pixel can be used for weak optical signal application when relatively higher sensitivity and lower input dynamic range is required. By making the sensitivity-dynamic range trade-off the same detector can be used for applications with relatively higher optical power. Finally, an array has been developed using the digital silicon photomultiplier in which the dead time of the pixels have been reduced. This digital photomultiplier features noise variation compensation between the pixels

Performance and Transient Behavior of Vertically Integrated Thin-film Silicon Sensors

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