A Triple-Mode Performance-Optimized Reconfigurable Incremental ADC for Smart Sensor Applications

This paper proposes a triple-mode discrete-time incremental analog-to-digital converter (IADC) employing successive approximation register (SAR)-based zooming and extended counting (EC) schemes to achieve programmable trade-off capability of resolution and power consumption in various smart sensor applications. It mainly consists of an incremental delta???sigma modulator and the proposed SAR-EC sub-ADC for alternate operation of the coarse SAR conversion and EC. They can be reconfigured to operate separately depending on the application requirements. The SAR-based zooming structure allows the IADC to have better linearity and resolution, and additional activation of the EC function gives the further resolution. During this reconfigurable conversion process, pipelined reusing operation of sub-blocks reduces the silicon area and the number of cycles for target resolutions. A prototype ADC is fabricated in a 180-nm CMOS process, and its triple-mode operation of high-resolution, medium-resolution, and low-power is experimentally verified to achieve 116.1-, 109.4-, and 73.3-dB dynamic ranges, consuming 1.60, 1.26, and 0.39 mW, respectively

A 90.5dB DR 1MHz BW Hybrid Two Step ADC with CT Incremental and SAR ADCs

The sensors in real time data processing IoT devices require high resolution and sub-MHz data converters, usually implemented as Incremental ADCs due to the advantages of oversampling technique and low latency. In discrete time incremental (IDT) ADCs, the sampling switch non-linearity, charge injection degrade the resolution, and power hungry OPAMPs are demanded to provide fast and accurate settling for the switch-capacitor circuits. While the continuous time incremental (ICT) ADCs overcome these issues by removing the sampling switches and it also relax the OPAMPs settling accuracy to save power. A hybrid architecture of ICT ADC and SAR two step ADC is proposed to achieve high resolution at low oversampling ratio (OSR). The first ICT ADCs enable higher resolution, faster conversion speed with lower power consumption. The residual error of the ICT ADC is extracted at the last integrator output and transfers to the 2nd SAR for further conversion. In this architecture, only the mismatch between the cascade of integrators (CoIs) and decimation filter transfer functions causes 1st stage quantization noise leakage which can be solved by increasing opamp parameters instead of increasing the digital decimation filter complexity. In addition, the overall SQNR is independent of the first ICT ADC’s NTF, which gives more freedom to trade-off between the loop stability and DAC errors. A 4bits DRZ DAC with data weighted averaging (DWA) technique is adopted to reduce the clock jitter of DAC, mitigate ISI error and static mismatch errors. Based on this architecture, a 16b resolution, 1MHz signal bandwidth hybrid two step ADC is designed and measurement results are demonstrated. Important sub circuits are introduced and analyzed in detail to get the target resolution. The ADC is fabricated in AKM 180nm CMOS process with 1.8V supply voltage, it achieves a DR of 90.5dB, and SNR/SFDR/SNDR of 82.5dB/85dB/80.5dB over 1MHz BW sampled at 64MHz

Switched Capacitor Circuit Techniques for High Performance CMOS Analog Circuits

Switched capacitor (SC) circuits are the main building blocks in many structures such as filters, data converters, sampling circuits and sampled-data amplifiers. The key challenge is to design such circuits which are the prime components of any IoT system with low power consumption without compromising on the performance. In this dissertation, power efficient novel switched capacitor techniques have been explored to suppress noise and mitigate the slewing in switched capacitor-based analog to digital converters (ADCs). First, a two-step incremental ADC(IADC) with pseudo-pseudo differential (PPD) structure is presented. PPD integrators are implemented with added correlated level shifting (CLS) technique to relax the output swing and gain requirements of the operational transconductance amplifier (OTA). The two-step IADC is implemented with the first step configured as a single-bit first-order IADC and the second step, using a two-capacitor SAR-assisted extended counting to further enhances the accuracy. The design is demonstrated by implementing the prototype in 65nm CMOS technology. Second, new passive charge compensation techniques are described. The proposed techniques mitigate the slewing in the OTA by providing a controlled amount of charge to the output of the OTA. The effectiveness of the proposed charge compensation technique in a switched-capacitor integrator is demonstrated in a second-order DSM. Circuit-level simulations including the effects of process, voltage and temperature variations are also presented. The extracted simulation results show a 12 dB improvement in SNDR using the proposed technique compared to conventional DSM without charge compensation

Linearization of Time-encoded ADCs Architectures for Smart MEMS Sensors in Low Power CMOS Technology

Mención Internacional en el título de doctorIn the last few years, the development of mobile technologies and machine learning applications has increased the demand of MEMS-based digital microphones. Mobile devices have several microphones enabling noise canceling, acoustic beamforming and speech recognition. With the development of machine learning applications the interest to integrate sensors with neural networks has increased. This has driven the interest to develop digital microphones in nanometer CMOS nodes where the microphone analog-front end and digital processing, potentially including neural networks, is integrated on the same chip. Traditionally, analog-to-digital converters (ADCs) in digital microphones have been implemented using high order Sigma-Delta modulators. The most common technique to implement these high order Sigma-Selta modulators is switchedcapacitor CMOS circuits. Recently, to reduce power consumption and make them more suitable for tasks that require always-on operation, such as keyword recognition, switched-capacitor circuits have been improved using inverter-based operational amplifier integrators. Alternatively, switched-capacitor based Sigma- Delta modulators have been replaced by continuous time Sigma-Delta converters. Nevertheless, in both implementations the input signal is voltage encoded across the modulator, making the integration in smaller CMOS nodes more challenging due to the reduced voltage supply. An alternative technique consists on encoding the input signal on time (or frequency) instead of voltage. This is what time-encoded converters do. Lately, time-encoding converters have gained popularity as they are more suitable to nanometer CMOS nodes than Sigma-Delta converters. Among the ones that have drawn more interest we find voltage-controlled oscillator based ADCs (VCOADCs). VCO-ADCs can be implemented using CMOS inverter based ring oscillators (RO) and digital circuitry. They also show noise-shaping properties. This makes them a very interesting alternative for implementation of ADCs in nanometer CMOS nodes. Nevertheless, two main circuit impairments are present in VCO-ADCs, and both come from the oscillator non-idealities. The first of them is the oscillator phase noise, that reduces the resolution of the ADC. The second is the non-linear tuning curve of the oscillator, that results in harmonic distortion at medium to high input amplitudes. In this thesis we analyze the use of time encoding ADCs for MEMS microphones with special focus on ring oscillator based ADCs (RO-ADCs). Firstly, we study the use of a dual-slope based SAR noise shaped quantizer (SAR-NSQ) in sigma-delta loops. This quantizer adds and extra level of noise-shaping to the modulator, improving the resolution. The quantizer is explained, and equations for the noise transfer function (NTF) of a third order sigma-delta using a second order filter and the NSQ are presented. Secondly, we move our attention to the topic of RO-ADCs. We present a high dynamic range MEMS microphone 130nm CMOS chip based on an open-loop VCO-ADC. This dissertation shows the implementation of the analog front-end that includes the oscillator and the MEMS interface, with a focus on achieving low power consumption with low noise and a high dynamic range. The digital circuitry is left to be explained by the coauthor of the chip in his dissertation. The chip achieves a 80dBA peak SNDR and 108dB dynamic range with a THD of 1.5% at 128 dBSPL with a power consumption of 438μW. After that, we analyze the use of a frequency-dependent-resistor (FDR) to implement an unsampled feedback loop around the oscillator. The objective is to reduce distortion. Additionally phase noise mitigation is achieved. A first topology including an operational amplifier to increase the loop gain is analyzed. The design is silicon proven in a 130 nm CMOS chip that achieves a 84 dBA peak SNDR with an analog power consumption of 600μW. A second topology without the operational amplifier is also analyzed. Two chips are designed with this topology. The first chip in 130 nm CMOS is a full VCO-ADC including the frequencyto- digital converter (F2D). This chip achieves a peak SNDR of 76.6 dBA with a power consumption of 482μW. The second chip includes only the oscillator and is implemented in 55nm CMOS. The peak SNDR is 78.15 dBA and the analog power consumption is 153μW. To finish this thesis, two circuits that use an FDR with a ring oscillator are presented. The first is a capacity-to-digital converter (CDC). The second is a filter made with an FDR and an oscillator intended for voice activity detection tasks (VAD).En los últimos años, el desarrollo de las tecnologías móviles y las aplicaciones de machine-learning han aumentado la demanda de micrófonos digitales basados en MEMS. Los dipositivos móviles tienen varios micrófonos que permiten la cancelación de ruido, el beamforming o conformación de haces y el reconocimiento de voz. Con el desarrollo de aplicaciones de aprendizaje automático, el interés por integrar sensores con redes neuronales ha aumentado. Esto ha impulsado el interés por desarrollar micrófonos digitales en nodos CMOS nanométricos donde el front-end analógico y el procesamiento digital del micrófono, que puede incluir redes neuronales, está integrado en el mismo chip. Tradicionalmente, los convertidores analógicos-digitales (ADC) en micrófonos digitales han sido implementados utilizando moduladores Sigma-Delta de orden elevado. La técnica más común para implementar estos moduladores Sigma- Delta es el uso de circuitos CMOS de capacidades conmutadas. Recientemente, para reducir el consumo de potencia y hacerlos más adecuados para las tareas que requieren una operación continua, como el reconocimiento de palabras clave, los convertidores Sigma-Delta de capacidades conmutadas has sido mejorados con el uso de integradores implementados con amplificadores operacionales basados en inversores CMOS. Alternativamente, los Sigma-Delta de capacidades conmutadas han sido reemplazados por moduladores en tiempo continuo. No obstante, en ambas implementaciones, la señal de entrada es codificada en voltaje durante el proceso de conversión, lo que hace que la integración en nodos CMOS más pequeños sea complicada debido a la menor tensión de alimentación. Una técnica alternativa consiste en codificar la señal de entrada en tiempo (o frecuencia) en lugar de tensión. Esto es lo que hacen los convertidores de codificación temporal. Recientemente, los convertidores de codificación temporal han ganado popularidad ya que son más adecuados para nodos CMOS nanométricos que los convertidores Sigma-Delta. Entre los que más interés han despertado encontramos los ADCs basados en osciladores controlados por tensión (VCO-ADC). Los VCO-ADC se pueden implementar usando osciladores en anillo (RO) implementados con inversores CMOS y circuitos digitales. Esta familia de convertidores también tiene conformado de ruido. Esto los convierte en una alternativa muy interesante para la implementación de convertidores en nodos CMOS nanométricos. Sin embargo, dos problemas principales están presentes en este tipo de ADCs debidos ambos a las no idealidades del oscilador. El primero de los problemas es la presencia de ruido de fase en el oscilador, lo que reduce la resolución del ADC. El segundo es la curva de conversion voltaje-frecuencia no lineal del oscilador, lo que causa distorsión a amplitudes medias y altas. En esta tesis analizamos el uso de ADCs de codificación temporal para micrófonos MEMS, con especial interés en ADCS basados en osciladores de anillo (RO-ADC). En primer lugar, estudiamos el uso de un cuantificador SAR con conformado de ruido (SAR-NSQ) en moduladores Sigma-Delta. Este cuantificador agrega un orden adicional de conformado de ruido al modulador, mejorando la resolución. En este documento se explica el cuantificador y obtienen las ecuaciones para la función de transferencia de ruido (NTF) de un sigma-delta de tercer orden usando un filtro de segundo orden y el NSQ. En segundo lugar, dirigimos nuestra atención al tema de los RO-ADC. Presentamos el chip de un micrófono MEMS de alto rango dinámico en CMOS de 130 nm basado en un VCO-ADC de bucle abierto. En esta tesis se explica la implementación del front-end analógico que incluye el oscilador y la interfaz con el MEMS. Esta implementación se ha llevado a cabo con el objetivo de lograr un bajo consumo de potencia, un bajo nivel de ruido y un alto rango dinámico. La descripción del back-end digital se deja para la tesis del couator del chip. La SNDR de pico del chip es de 80dBA y el rango dinámico de 108dB con una THD de 1,5% a 128 dBSPL y un consumo de potencia de 438μW. Finalmente, se analiza el uso de una resistencia dependiente de frecuencia (FDR) para implementar un bucle de realimentación no muestreado alrededor del oscilador. El objetivo es reducir la distorsión. Además, también se logra la mitigación del ruido de fase del oscilador. Se analyza una primera topologia de realimentación incluyendo un amplificador operacional para incrementar la ganancia de bucle. Este diseño se prueba en silicio en un chip CMOS de 130nm que logra un pico de SNDR de 84 dBA con un consumo de potencia de 600μW en la parte analógica. Seguidamente, se analiza una segunda topología sin el amplificador operacional. Se fabrican y miden dos chips diseñados con esta topologia. El primero de ellos en CMOS de 130 nm es un VCO-ADC completo que incluye el convertidor de frecuencia a digital (F2D). Este chip alcanza un pico SNDR de 76,6 dBA con un consumo de potencia de 482μW. El segundo incluye solo el oscilador y está implementado en CMOS de 55nm. El pico SNDR es 78.15 dBA y el el consumo de potencia analógica es de 153μW. Para cerrar esta tesis, se presentan dos circuitos que usan la FDR con un oscilador en anillo. El primero es un convertidor de capacidad a digital (CDC). El segundo es un filtro realizado con una FDR y un oscilador, enfocado a tareas de detección de voz (VAD).Programa de Doctorado en Ingeniería Eléctrica, Electrónica y Automática por la Universidad Carlos III de MadridPresidente: Antonio Jesús Torralba Silgado.- Secretaria: María Luisa López Vallejo.- Vocal: Pieter Rombout

Extended-Range Second-Order Incremental Sigma-Delta ADC

A single-stage two-steps Extended-Range Second-Order Incremental ADC in 0.13um CMOS technology is presented here which achieves a Signal-to-Noise and Distortion Ratio (SNDR) as large as 73 dB. The proposed architecture of Extended-Range ADC based on Second-order multi-bit CIFF Incremental ADC reuses the IADC structure for coarse (input signal) as well as fine (residue) quantization without need of employment of explicit second ADC thereby minimizing power consumption and area occupancy. With a clock frequency of 80 MHz, the complete ERADC achieves in extracted simulation a peak SNDR of 73 dB at a data rate of 3.2 MS/s (25 clock cycles per conversion).A single-stage two-steps Extended-Range Second-Order Incremental ADC in 0.13um CMOS technology is presented here which achieves a Signal-to-Noise and Distortion Ratio (SNDR) as large as 73 dB. The proposed architecture of Extended-Range ADC based on Second-order multi-bit CIFF Incremental ADC reuses the IADC structure for coarse (input signal) as well as fine (residue) quantization without need of employment of explicit second ADC thereby minimizing power consumption and area occupancy. With a clock frequency of 80 MHz, the complete ERADC achieves in extracted simulation a peak SNDR of 73 dB at a data rate of 3.2 MS/s (25 clock cycles per conversion)

Design techniques for low power ADCs

This dissertation presents an incremental analog-to-digital converter (ADC) with digital digital-to-analog converter (DAC) mismatch correction. A theoretical time-domain analysis technique was developed to predict the noise performance of the incremental ADC, and a new optimization technique was proposed to minimize the output noise. In the calibration mode, the incremental ADC itself is used to measure the mismatches of the internal multi-bit DAC. Three new calibration techniques, equation-solving calibration, inter-DAC mismatch calibration and modified “Sarhang-Nejad” calibration are proposed. To verify the above techniques, a test chip was designed and fabricated in 0.18 µm CMOS process. The chip can work in single-sampling or double-sampling mode. Chopping with a fractal sequence is used to eliminate 1/f noise. The calibration circuit was implemented to calibrate the multi-bit DAC mismatches the in single-sampling mode and inter-DAC mismatches in the double-sampling mode. Finally, two new design techniques for low-power ADCs, the two-step split-junction successive-approximation register (SAR) ADC and the hybrid cascaded ∆Σ ADC, are proposed

Bluetooth/WLAN receiver design methodology and IC implementations

Emerging technologies such as Bluetooth and 802.11b (Wi-Fi) have fuelled the growth of the short-range communication industry. Bluetooth, the leading WPAN (wireless personal area network) technology, was designed primarily for cable replacement applications. The first generation Bluetooth products are focused on providing low-cost radio connections among personal electronic devices. In the WLAN (wireless local area network) arena, Wi-Fi appears to be the superior product. Wi-Fi is designed for high speed internet access, with higher radio power and longer distances. Both technologies use the same 2.4GHz ISM band. The differences between Bluetooth and Wi-Fi standard features lead to a natural partitioning of applications. Nowadays, many electronics devices such as laptops and PDAs, support both Bluetooth and Wi-Fi standards to cover a wider range of applications. The cost of supporting both standards, however, is a major concern. Therefore, a dual-mode transceiver is essential to keep the size and cost of such system transceivers at a minimum. A fully integrated low-IF Bluetooth receiver is designed and implemented in a low cost, main stream 0.35um CMOS technology. The system includes the RF front end, frequency synthesizer and baseband blocks. It has -82dBm sensitivity and draws 65mA current. This project involved 6 Ph.D. students and I was in charge of the design of the channel selection complex filter is designed. In the Bluetooth transmitter, a frequency modulator with fine frequency steps is needed to generate the GFSK signal that has +/-160kHz frequency deviation. A low power ROM-less direct digital frequency synthesizer (DDFS) is designed to implement the frequency modulation. The DDFS can be used for any frequency or phase modulation communication systems that require fast frequency switching with fine frequency steps. Another contribution is the implementation of a dual-mode 802.11b/Bluetooth receiver in IBM 0.25um BiCMOS process. Direct-conversion architecture was used for both standards to achieve maximum level of integration and block sharing. I was honored to lead the efforts of 7 Ph.D. students in this project. I was responsible for system level design as well as the design of the variable gain amplifier. The receiver chip consumes 45.6/41.3mA and the sensitivity is -86/-91dBm

Conception pour la testabilité des systèmes biomédicaux implantables

Architecture générale des systèmes implantables -- Principes de stimulation électrique -- Champs d'application des systèmes implantables -- Les particularités des circuits implantables -- Tendance future -- Conception pour la testabilité de la partie numérique des circuits implantables -- "Desigh and realization of an accurate built-in current sensor for Iddq testing and power dissipation measurement -- Conception pour la testabilité de la partie analogique des circuits implantables -- BIST for digital-to-analog and Analogo-to-digital converters -- Efficient and accurate testing of analog-to-digital converters using oscillation test method -- Design for testability of Embedded integrated operational amplifiers -- Vérification des interfaces bioélectroniques des systèmes implantables -- Monitorin the electrode and lead failures in implanted microstimulators and sensors -- Capteurs de température intégrés pour la vérification de l'état thermique des puces dédiées -- Built-in temperature sensors for on-line thermal monitoring of microelectronic structures -- Un protocole de communication fiable pour la programmation et la télémétrie des système implantables -- A reliable communication protoco for externally controlled biomedical implanted devices