11 research outputs found

    Design of a wideband variable gain amplifier

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    Synteettisapertuurinen tutka (SAR) on hyvin tunnettu tekniikka maanpinnan kuvantamiseen. Tässä diplomityössä on suunniteltu laajakaistainen säädettävä vahvistin, jota voidaan käyttää SAR:in suorasekoitusvastaanottimessa (DCR). Ensin näytetään kuinka tärkeät muuttujat, kuten esimerkiksi VGA:n vahvistus, kaistanleveys ja kohina, saadaan määritettyä vastaanottimen kokonaisvaatimuksista. Seuraavaksi esitetään yleisesti suunnittelutapa VGA:lle, jossa tunnistetaan VGA:n tärkeimmät suunnittelumoduulit. Laajakaistaiset asteet, joita voidaan käyttää VGA:n suunnittelussa, esitellään lyhyesti, kuten myös tekniikoita, joilla siirrosjännite saadaan kompensoitua. Seuraavaksi esitellään yksityiskohtaisesti kuinka VGA suunnitellaan. Työssä esitetään piensignaali- ja kohina-analyysit VGA:n vahvistusasteille kuten myös simulaatiotulokset. VGA on suunniteltu ja valmistettu 0.13 µm CMOS prosessilla. Piirikuvion jälkeiset simulaatiot on myös esitetty ja ne todentavat lopullisen piirikuvion toimivuutta. Lopuksi esitetään VGA:n mittaustulokset, jotka näyttävät, että halutut vahvistus ja kaistanleveys on saavutettu. Mikropiirin digitaalisen ohjauksen epätasaisesta toimivuudesta johtuen, VGA:n taajuusvasteessa näkyi vahvistuksen piikittämistä. VGA:n tulon kohinatiheyden mittaustulokset eri vahvistusasetuksilla on myös esitetty ja ne vastaavat hyvin simuloituja arvoja. Tulon 1 dB:n kompressiopiste ja tulon kolmannen kertaluvun keskinäismodulaatiosärön leikkauspiste on myös annettu VGA:lle. Yleisesti ottaen VGA:n toimintaa voidaan pitää onnistuneena SAR:ssa käytettävälle suorasekoitusvastaanottimelle.Synthetic Aperture Radar (SAR) is a well known technique for imaging the earth's surface. This thesis presents a wideband variable gain amplifier which can be used in the direct conversion receiver (DCR) for SAR. The thesis first introduces how to extract the important parameters i.e. gain, bandwidth and noise of the VGA from the overall receiver requirements. Next, a general design philosophy for the VGA is presented which identifies the main design modules in the amplifier. Also, a brief introduction to wideband stages and DC-offset compensation techniques is presented. Then a detailed explanation of the VGA design is given. Small-signal and noise analyses are presented for the VGA gain stages along with their simulation results. VGA post-layout simulation results are also shown to verify the functionality of the final layout drawn using 0.13 µm CMOS. At the end, measurement results for the VGA are given which show that the VGA achieved the desired gain and bandwidth. However, due to irregular operation of the digital control for the chip, the frequency response of the VGA showed gain peaking. The measured input noise density of the VGA at different gain settings is also given and it matched well with the simulated value. Moreover, the input 1 dB compression point and the third order input intercept point results for the VGA are also given. The overall operation of VGA was deemed satisfactory for the direct conversion receiver for SAR

    High Performance Integrated Circuit Blocks for High-IF Wideband Receivers

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    Due to the demand for high‐performance radio frequency (RF) integrated circuit design in the past years, a system‐on‐chip (SoC) that enables integration of analog and digital parts on the same die has become the trend of the microelectronics industry. As a result, a major requirement of the next generation of wireless devices is to support multiple standards in the same chip‐set. This would enable a single device to support multiple peripheral applications and services. Based on the aforementioned, the traditional superheterodyne front‐end architecture is not suitable for such applications as it would require a complete receiver for each standard to be supported. A more attractive alternative is the highintermediate frequency (IF) radio architecture. In this case the signal is digitalized at an intermediate frequency such as 200MHz. As a consequence, the baseband operations, such as down‐conversion and channel filtering, become more power and area efficient in the digital domain. Such architecture releases the specifications for most of the front‐end building blocks, but the linearity and dynamic range of the ADC become the bottlenecks in this system. The requirements of large bandwidth, high frequency and enough resolution make such ADC very difficult to realize. Many ADC architectures were analyzed and Continuous‐Time Bandpass Sigma‐Delta (CT‐BP‐ΣΔ) architecture was found to be the most suitable solution in the high‐IF receiver architecture since they combine oversampling and noise shaping to get fairly high resolution in a limited bandwidth. A major issue in continuous‐time networks is the lack of accuracy due to powervoltage‐ temperature (PVT) tolerances that lead to over 20% pole variations compared to their discrete‐time counterparts. An optimally tuned BP ΣΔ ADC requires correcting for center frequency deviations, excess loop delay, and DAC coefficients. Due to these undesirable effects, a calibration algorithm is necessary to compensate for these variations in order to achieve high SNR requirements as technology shrinks. In this work, a novel linearization technique for a Wideband Low‐Noise Amplifier (LNA) targeted for a frequency range of 3‐7GHz is presented. Post‐layout simulations show NF of 6.3dB, peak S21 of 6.1dB, and peak IIP3 of 21.3dBm, respectively. The power consumption of the LNA is 5.8mA from 2V. Secondly, the design of a CMOS 6th order CT BP‐ΣΔ modulator running at 800 MHz for High‐IF conversion of 10MHz bandwidth signals at 200 MHz is presented. A novel transconductance amplifier has been developed to achieve high linearity and high dynamic range at high frequencies. A 2‐bit quantizer with offset cancellation is alsopresented. The sixth‐order modulator is implemented using 0.18 um TSMC standard analog CMOS technology. Post‐layout simulations in cadence demonstrate that the modulator achieves a SNDR of 78 dB (~13 bit) performance over a 14MHz bandwidth. The modulator’s static power consumption is 107mW from a supply power of ± 0.9V. Finally, a calibration technique for the optimization of the Noise Transfer Function CT BP ΣΔ modulators is presented. The proposed technique employs two test tones applied at the input of the quantizer to evaluate the noise transfer function of the ADC, using the capabilities of the Digital Signal Processing (DSP) platform usually available in mixed‐mode systems. Once the ADC output bit stream is captured, necessary information to generate the control signals to tune the ADC parameters for best Signal‐to‐Quantization Noise Ratio (SQNR) performance is extracted via Least‐ Mean Squared (LMS) software‐based algorithm. Since the two tones are located outside the band of interest, the proposed global calibration approach can be used online with no significant effect on the in‐band content

    Bandwidth Enhancement Techniques For Cmos Transimpedance Amplifier

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    Tez (Doktora) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2016Thesis (PhD) -- İstanbul Technical University, Institute of Science and Technology, 2016CMOS Transferempedans Kuvvetlendiricinin bandgenis¸lig˘ i bas¸arımını gelis¸tirmeye yönelik teknikler haberles¸me teknolojisinde ve uygulamalarında ortaya çıkan hızlı gelis¸meler ve uygulamalar verilere hızlı eris¸im avantajı yanında hızlı hesaplama ve haberles¸me tekniklerine imkan veren bir bilgi çag˘ ını ortaya çıkarmıs¸tır. Sürekli artan hızlı bilgi transferi ihtiyacı, hızlı elemanların ve tümdevrelerin tasarımına yönelik aras¸tırmalara liderlik eden optik haberles¸me teknig˘ ini dog˘ urmus¸tur. Veri iletimi için mevcut ortamlar arasında optik fiber yapıları en iyi bas¸arımı sunmaktadır. Günümüzde optik fiberler çok yog˘ un sayısal veri transferinde genis¸ kullanım alanı bulmaktadır. Yog˘ un veri aktarımı kilometrelerce uzunlukta optik fiberler üzerinde önemli bir kayıp olmaksızın yapılabilmektedir. Normal s¸artlarda, is¸aret aktarımının ıs¸ık ile yapılması durumunda ortaya çıkan kayıp elektriksel yolla yapılan aktarıma gore daha düs¸üktür. Optik fiberler genel bas¸arımı iyiles¸tirmenin yanında düs¸ük maliyet avantajını da sunmaktadır. En yüksek teknolojilerde, optik fiber elemanları ve sistemleri çok yog˘ un veri aktarımı amacıyla kullanılmaktadır. Sonuç olarak optik fiber teknolojisi düs¸ük kayıpla çok yog˘ un veri aktarımını az maliyetle sunabilen bir teknoloji olarak günümüzde çok önemli bir konuma sahiptir. Genel olarak, optik haberles¸me sistemlerinde kullanılan analog devreler Galyum Arsenik (GaAs) veya Indiyum Fosfid (InP) teknolojileri ile üretilmektedir. Bu prosesler yüksek hızlı devreler için olus¸turulmakta olup optik haberles¸me sistemlerinin ihtiyaç duydug˘ u yüksek band genis¸lig˘ ine sahip devreleri üretmek için genellikle tek alternatif olarak kars¸ımıza çıkmaktadırlar. Bununla birlikte, CMOS proseslerinde ortaya çıkan hızlı gelis¸meler sayesinde daha yüksek bas¸arımlara sahip analog devreleri CMOS proses kullanarak tasarlama ve gerçekles¸tirme imkanları gittikçe artmaktadır. CMOS prosesin tercih edilmesine sebep olan en önemli avantaj maliyetlerde ortaya çıkan büyük düs¸üs¸tür. CMOS proseslerin maliyetinin düs¸ük olmasının sebebi, büyük alan kullanımı gerektiren sayısal devre gerçekles¸tirmelerinde çok genis¸ bir kullanıma sahip olmasıdır. CMOS prosesin dig˘ er bir avantajı sayısal ve analog devrelerin aynı taban üzerinde gerçekles¸tirilmesine imkan vermesidir. Transferempedans kuvvetlendirici (TIA) optik haberles¸me alıcılarındaki ilk blok olup giris¸indeki akımı çıkıs¸ında gerilime dönüs¸türmektedir. Tipik bir TIA’nın önemli bas¸arım ihtiyaçları genis¸ bandgenis¸lig˘ i, yüksek transferempedans kazancı, düs¸ük gürültü, düs¸ük güç tüketimi ve küçük grup geçikme deg˘ is¸im aralıg˘ ıdır. Nano teknolojilerdeki güncel gelis¸meler, optik alıcıların giris¸ katı uygulamalarında gerekli kolay bir s¸ekilde elde edilemeyen bas¸arımları sag˘ layabilen CMOS Transfer- empedans Kuvvetlendiricinin (TIA) tasarımını ekonomik hale getirmis¸tir. TIA tasarımında dikkat edilmesi gereken iki önemli mesele bandgenis¸lig˘ i ve giris¸ hassasiyetidir. TIA’nın bandgenis¸lig˘ i genellikle giris¸teki parasitic kapasite tarafından sınırlanmaktadır. TIA’nın bandgenis¸lig˘ i fotodiyot kapasitesi, transistor giris¸ kapasitesi ve transistor giris¸ direncinin belirledig˘ i RC zaman sabiti ile bulunabilir. Giris¸ hassasiyeti ise TIA’nın giris¸ gürültü akımından etkilenmektedir. Bundan dolayı TIA’nın bandgenis¸lig˘ i ve giris¸ is¸areti hassasiyeti bas¸arımlarını optimum bir s¸ekilde temin eden uygun devre topolojisinin belirlenmesi önemli bir meseledir. Bu tez, CMOS teknolojisi kullanan Transferempedans Kuvvetlendiricinin band- genis¸lig˘ i bas¸arımını gelis¸tirmeye yönelik yeni teknikler sunan bir çalıs¸madır. CMOS TIA’nın bandgenis¸lig˘ i bas¸arımını iyiles¸tirmeye yönelik farklı yaklas¸ımlar tez içerisinde gösterilmektedir. Bundan bas¸ka, bu çalıs¸ma transferempedansı kuvvetlendiricinin analizini ve tasarımını tam olarak anlamak için gerekli altyapı bilgisini de sunmaktadır. Bu tezde, sistemle devre tasarımı arasındaki bos¸lug˘ u doldurmak için s¸unlar yapılmıs¸tır: - Band genis¸lig˘ i bas¸arımının arttırılmasının matematiksel analizlerle anlas¸ılması. - Gerçekles¸tirilebilir yeni devre yapılarının tanıtılması. - Teklif edilen tasarımların CMOS teknolojisiyle gerçekles¸tirilebilirlig˘ inin kapsamlı ve detaylı simülasyonlar kullanılarak gösterilmesi. Sunulan yeni devre yapılarının ilki olarak, negatif empedans devresinin bandgenis¸lig˘ i artıs¸ı için kullanılabileceg˘ i bu tezde gösterilmis¸ olup bu teknik bu tezde TIA’nın çıkıs¸ kutpu için uygulanmaktadır. Bandgenis¸lig˘ i, kazancı (gmRout) arttırarak ve çıkıs¸ta aynı zaman sabiti korunarak arttırılabilir. Çıkıs¸ direnci arttırılarak kazanç (A) yükseltilebilir. Çıkıs¸ direnci çıkıs¸a uygulanacak bir negative direnç devresi ile arttırılabilir. Çıkıs¸ta aynı zaman sabitini korumak için ise negatif kapasite devresi kullanılabilir. Daha yüksek kazanç deg˘ eri (A) rezistif geribesleme sayesinde giris¸ direncini azaltarak giris¸ kutbunun yükselmesini sag˘ lamaktadır. Sonuç olarak, bandgenis¸lig˘ i bas¸arımında bir iyiles¸tirme elde edilebilmektedir. Teklif edilen topoloji ile 7GHz bandgenis¸lig˘ ine ve 54.3dB’lik kazanca sahip bir TIA tasarlanmıs¸tır. Teklif edilen TIA’nın 1.8V’luk besleme kaynag˘ ından çektig˘ i toplam güç 29mW’tır. Teklif edilen TIA’nın 0.18um CMOS proses ile post-serimi yapılmıs¸tır. Benzetimle elde edilmis¸ giris¸ gürültü akım yog˘ unlug˘ u 5.9pA/ Hz olup kapladıg˘ ı alan 230umX45um olmus¸tur. Tezde bir sonraki çalıs¸mada es¸les¸tirme teknig˘ i kullanılarak genis¸ bantlı bs¸r TIA tasarlanmıs¸tır. Giris¸te seri empedans es¸les¸tirme teknig˘ i ve çıkıs¸ta T tipi es¸les¸tirme yapısı birlikte kullanılarak TIA’nın bandgenis¸lig˘ i bas¸arımının iyi bir düzeyde iyiles¸tirilebileceg˘ i gösterilmis¸tir. Bu yaklas¸ım 0.18um CMOS teknolojisi ile yapılmıs¸ bir tasarım örneg˘ i ile desteklenmis¸tir. Post serim sonuçları 50fF’lık bir fotodiyot kapasitesi için 20GHz’lik bandgenis¸lig˘ i, 52.6dB’lik transferdirenci kazancı, 8.7pA/ Hz ‘lik giris¸ gürültü akımı ve 3pS’den daha az grup geçikmesi bas¸arımılarını vermis¸tir. Bu TIA uygulaması 1.8V’luk besleme kaynag˘ ından 1.3mW güç çekmis¸tir. Tezin üçüncü as¸amasında TIA band genis¸lig˘ i bas¸arımını arttırmaya yönelik bas¸ka bir yapı sunulmaktadır. Bu yapı, literatürde bilinen regule edilmis¸ ortak geçitli mimari ile birlikte farklı rezonans frekanslarına sahip iki rezonans devresinin paralel kullanımını içermektedir. Teklif edilen TIA devresinde, kapasite dejenarasyon ve seri endüktif tepe teknikleri kutup-sıfır kompanzasyonu için kullanılmıs¸tır. 100fF’lık fotodiyot kapasitesine sahip bir TIA 0.18um CMOS prosesi ili tasarlanmıs¸tır. Post-serim sonuçları 13GHz’lik bandgenis¸lig˘ i, 53dB’lik transferdirenci kazancı, 24pA/ Hz ‘lik xxvi giris¸ gürültü akımı ve 5pS’den daha az grup geçikmesi bas¸arımılarını vermis¸tir. Bu TIA uygulaması 1.8V’luk besleme kaynag˘ ından 11mW güç çekmis¸tir. Tezin dördüncü as¸amasında, regule edilmis¸ ortak geçitli mimari kullanan TIA’nın bandgenis¸lig˘ i bas¸arımını arttırmaya yönelik bir teknik tanıtılmıs¸tır. Bu teknik, resistif kompanzasyon teknig˘ ini ve merdiven es¸les¸tirme yapısını bir kaskod akım kaynag˘ ı ile birlikte kullanmaya dayanmaktadır. Bu yapının bas¸arımını göstermek amacıyla, 0.18um CMOS prosesi ile bir tasarım yapılmıs¸tır. Post-serim sonuçları 8.4GHz’lik bandgenis¸lig˘ i, 51.3dB’lik transferdirenci kazancı, 20pA/ Hz ‘lik giris¸ gürültü akımı ve 4pS’den daha az grup geçikmesi bas¸arımılarını vermis¸tir. Bu TIA uygulaması 1.8V’luk besleme kaynag˘ ından 17.8mW güç çekmis¸tir. Tezin son as¸amasında, tezde sunulan teknikler ve yapıların kendi aralarında kars¸ılas¸tırılması verilmektedir. Kars¸ılas¸tırma öncelikli olarak band genis¸lig˘ i, transferempedansı kazancı, gürültü, güç tüketimi, grup geçikme deg˘ is¸im aralıg˘ ı ve kapladıg˘ ı alan için yapılmaktadır. Bunlara ek olarak, sunulan yapıların kullandıg˘ ı tekniklerin avantajlı yanları ile birlikte (kararlılık üzerinde olus¸abilecek negatif etkiler gibi) dezavantajlı tarafları da tezin son as¸amasında verilmektedir. Tezin son as¸amasında yapılan kars¸ılas¸tırmalar, en iyi bant genis¸lig˘ i bas¸arımının es¸les¸tirme teknig˘ ini kullanan yapıdan elde edildig˘ ini göstermektedir. Bununla birlikte dig˘ er yapıların da band genis¸lig˘ i bas¸arımı üzerinde önemli iyiles¸tirmeler yaptıg˘ ı ortaya konulmaktadır. Gürültü açısından ise en yüksek bas¸arımın negatif empedans teknig˘ ini kullanan yapıda elde edildig˘ i görülmektedir. Bu yapı aynı zamanda düs¸ük alan kullanımı imkanı da sunmaktadır. Tezde sunulan dig˘ er iki yapı ise özellikle yüksek deg˘ erli fotodiyot kapasiteleri için incelenmis¸ olup band genis¸lig˘ i bas¸arımı üzerinde önemli iyiles¸tirmeler yaptıkları gösterilmektedir. Sonuç olarak, bu tezde transferempedans kuvvetlendiricinin bandgenis¸lig˘ i bas¸arımını iyiles¸tiren farklı teknikler sunulmakta olup bu teknikler ayrıntılı ve kars¸ılas¸tırmalı olarak incelenmektedir. Tezde verilen sonuçlar sunulan yeni tekniklerin bas¸arımlarının yüksek oldug˘ unu ve literature yeni ve güçlü alternatfiler sunuldug˘ unu göstermektedir. Tezde sunulan yaklas¸ımların ve tekniklerin gelecekte yapılacak benzer aras¸tırmalara hem yardımcı olacak hem de referans olacak nitelikte oldug˘ u düs¸ünülmektedir.The accelerated development of integrated systems in the communication technology and their application are among the significant technologies that have developed the information era by empowering high-speed computation and communication technique besides high-speed access to stored data. The continuous growth demand for high-speed transport of information has rekindled optical communications, leading to derived research on high-speed device and integrated circuit design. Among the available medium to transfer the data, optical fibers have the best performance. Optical fibers are very common these days to transport very high rate digital data. Such high speed data rates can be transported over kilometers of optical fiber and without significant loss. Normally loss is very low when the signal is transmitted using light rather than electrical signal. These fibers also have the advantage of being low cost in addition to improvement of performance. In state-of-the-art technology, fiber optic devices and systems are evidently employed to realize very high data rates. Fiber optic communication is a solution because high data rates can be transmitted through this high capacity cable with high performance. Traditionally, analog circuits used in optical communication systems are implemented using Gallium Arsenide (GaAs) or Indium Phosphide (InP) technologies. These processes are designed for high speed circuits, and have been traditionally the only technologies able to produce the high bandwidth circuits required in optical communication systems. However, due to the aggressive scaling of the CMOS process, it is now becoming possible to design high performance analog circuits in CMOS. The primary advantage of moving to a CMOS process is a dramatic reduction in cost due to its widespread use in high volume digital circuits. Another advantage of using CMOS is its ability to integrate digital and analog circuits onto the same substrate. Transimpedance amplifier (TIAs) is the first building block in the optical communication receiver that converts the small signal current to a corresponding output voltage signal. The important requirements of a typical TIA are large bandwidth, high transimpedance gain, low noise, low power consumption, and small group delay variation. Current developments in nanoscale technologies made it economically feasible to design CMOS transimpedance amplifier (TIA) that satisfies the stringent performances necessary for the front-end optical transceivers applications such as low power, low cost and high integration which offers the most economical solution in the consumer application market. In designing of TIA, the two major factors that must be considered are the bandwidth and the input sensitivity. The bandwidth of TIA is usually limited by the parasitic capacitance at the input stage, and it can be calculated by its RC time constant contributed by photodiode capacitance, parasitic capacitance and input resistance of the amplifier. The sensitivity is affected by the input current noise of the TIA. Therefore it is challenge to choose the suitable circuit topology that provides an optimal trade-off between bandwidth and input signal sensitivity for TIA. This thesis is an attempt toward providing novel techniques to extend the bandwidth of the transimpedance amplifier using CMOS technology. Different approaches used to improve the bandwidth of CMOS TIAs are covered. Moreover, this research provides the necessary background knowledge to fully understand the analysis and design of the transimpedance amplifier (TIA). Bridging the gap between system and circuit design is done by: Understanding the bandwidth expansion by mathematical analysis. Introducing new circuit architectures that can be realized. Demonstrating implementation of the proposed designs using extensive simulations in CMOS technology. It is shown in this thesis that, using a negative impedance NI circuit can be used for bandwidth extension. In our application, the negative impedance is incorporated into the output pole of TIA. The bandwidth can be improved by increasing the gain (A = gmRout ) and by maintaining the same time constant at the output pole. A better gain A can be obtained if the output resistance Rout is increased. Increasing Rout can be done by placing a negative resistance RIN in parallel with the output resistance Rout . In order to maintain the same time constant at the output node, a negative capacitance can be used. It have been reported that, the shunt feedback architecture is used to improve the bandwidth of TIA. Increasing the gain A effectively decreases the input resistance and hence increase the frequency of the input pole due to feedback. As a result, an improvement of the bandwidth can be obtained. Using the proposed topology, a wide band transimpedance amplifier with a bandwidth of 7 GH z and transimpedance gain of 54.3 dBΩ is achieved. The total power consumption of the proposed TIA from the 1.8 V power supply is 29 mW . The TIA is designed in 0.18 µ m CMOS technology. The simulated input referred noise current spectral density is 5.9 pA/√H z and the TIA occupies 230µ m × 45µ m of area. Furthermore, a wide band TIA is designed using the matching technique. It is shown that by simultaneously using of series input matching topology and T-output matching network, the bandwidth of the TIA can be obviously improved. This methodology is supported by a design example in a 0.18 µ m CMOS technology. The post layout simulation results show a bandwidth of 20 GH z with 50 f F photodiode capacitance, a transimpedance gain of 52.6 dBΩ, 11 pA/√H z input referred noise and group delay less than 8.3 ps. The TIA dissipates 1.3 mW from a 1.8 V supply voltage. In addition, a new design possessing to extend the bandwidth of the TIA is presented. This TIA employs a parallel combination of two series resonate circuits with different resonate frequencies on the conventional regulated common gate (RGC) architecture. In the proposed TIA, a capacitance degeneration and series inductive peaking technique are used for pole-zero elimination. The TIA is implemented in a 0.18 µ m CMOS process, where a 100 f F photodiode is considered. The post layout simulation results show a transimpedance gain of 53 dBΩ transimpedance gain along with a 13 GH z bandwidth. The designed TIA consumes 11 mW from a 1.8 V supply, and its group-delay variation is 5 ps with 24 pA/√H z input referred noise. xxii In the last phase of the work, a technique to enhance the bandwidth of the regulated common gate (RCG) transimpedance amplifier is described. The technique is based on using a cascode current mirror with resistive compensation technique and a ladder matching network. In order to verify the operation and the performance of the proposed technique, a CMOS design example is designed using the 0.18µ m CMOS process technology. The post layout simulation results show that, the proposed TIA achieved a bandwidth of 8.4 GH z, a transimpedance gain of 51.3 dBΩ and input referred noise current spectral density of 20 pA/√H z. The average group-delay variation is 4 ps over the bandwidth and the TIA consumes 17.8 mW from a 1.8 V supply. To sum up, this thesis focuses on various design techniques of transimpedance amplifier (TIA) that improves the bandwidth performance. We believe that, our approaches and techniques exhibit a path which other future researchers can follow and as well refer to as their researching domain and also could be used in their research applications.DoktoraPh

    메모리 인터페이스를 위한 20Gbps급 직렬화 송수신기 설계

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    학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2013. 8. 정덕균.Various types of serial link for current and future memory interface are presented in this thesis. At first, PHY design for commercial GDDR3 memory is proposed. GDDR3 PHY is consists of read path, write path, command path. Write path and command path calibrate skew by using VDL (Variable delay line), while read path calibrates skew by using DLL (Delay locked loop) and VDL. There are four data channels and one command/address channel. Each data channel consists of one clock signal (DQS) and eight data signals (DQ). Data channel operates in 1.2Gbps (1.08Gbps~1.2Gbps), and command/address channel operates 600Mbps (540Mbps~600Mbps). In particular, DLL design for high speed and for SSN (simultaneous switching noise) is concentrated in this thesis. Secondly, serial link design for silicon photonics is proposed. Silicon photonics is the strongest candidate for next generation memory interface. Modulator driver for modulator, TIA (trans-impedance amplifier) and LA (limiting amplifier) for photo diode design are discussed. It operates above 12.5Gbps but it consumes much power 7.2mW/Gbps (transmitter core), 2mW/Gbps (receiver core) because it is connected with optical device which has large parasitic capacitance. Overall receiver which includes CDR (clock and data recovery) is also implemented. Many chips are fabricated in 65nm, 0.13um CMOS process. Finally, electrical serial link for 20Gbps memory link is proposed. Overall architecture is forwarded clocking architecture, and is very simple and intuitive. It does not need additional synchronizer. This open loop delay matched stream line receiver finds optimum sampling point with DCDL (Digitally controlled delay line) controller and expects to consume low power structurally. Only two phase half rate clock is transmitted through clock channel, but half rate time interleaved way sampling is performed by aid of initial value settable PRBS chaser. A CMOS Chip is fabricated by 65nm process and it occupies 2500um x 2500um (transceiver). It is expected that about 2.6mW(2.4mW)/Gbps (transmitter), 4.1mW(2.7mW)/Gbps (receiver). Power consumption improvement is expected in advanced process.ABSTRACT I CONTENTS V LIST OF FIGURES VII LIST OF TABLES XII CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 10 CHAPTER 2 A SERIAL LINK PHY DESIGN FOR GDDR3 MEMORY INTERFACE 11 2.1 INTRODUCTION 11 2.2 GDDR3 MEMORY INTERFACE ARCHITECTURE 12 2.2.1 READ PATH ARCHITECTURE 15 2.2.2 WRITE PATH ARCHITECTURE 17 2.2.3 COMMAND PATH ARCHITECTURE 19 2.3 DLL DESIGN FOR MEMORY INTERFACE 20 2.3.1 SSN(SIMULTANEOUS SWITCHING NOISE) 20 2.3.2 DLL ARCHITECTURE 21 2.3.3 VOLTAGE CONTROLLED DELAY LINE (VCDL) 22 2.3.4 HYSTERESIS COARSE LOCK DETECTOR (HCLD) 23 2.3.5 DYNAMIC PHASE DETECTOR AND CHARGE PUMP 26 2.4 SIMULATION RESULT 29 2.5 CONCLUSION 32 CHAPTER 3 OPTICAL FRONT-END SERIAL LINK DESIGN FOR 20 GBPS MEMORY INTERFACE 35 3.1 SILICON PHOTONICS INTRODUCTION 35 3.2 OPTICAL FRONT-END TRANSMITTER DESIGN 45 3.2.1 MODULATOR DRIVER REQUIREMENTS 46 3.2.2 MODULATOR DRIVER DESIGN - CURRENT MODE DRIVER 47 3.2.3 MODULATOR DRIVER DESIGN - CURRENT MODE DRIVER 50 3.3 OPTICAL FRONT-END RECEIVER DESIGN 55 3.3.1 OPTICAL RECEIVER BACK END REQUIREMENTS 56 3.3.2 OPTICAL RECEIVER BACK END DESIGN – TIA 57 3.3.3 OPTICAL RECEIVER BACK END DESIGN – LA, DRIVER 63 3.3.4 OPTICAL RECEIVER BACK END DESIGN – CDR 66 3.4 MEASUREMENT AND SIMULATION RESULTS 70 3.4.1 MEASUREMENT AND SIMULATION ENVIRONMENTS 70 3.4.2 OPTICAL TX FRONT END MEASUREMENT AND SIMULATION 74 3.4.3 OPTICAL RX FRONT END MEASUREMENT AND SIMULATION 77 3.4.4 OPTICAL RX BACK END SIMULATION 79 3.4.5 OPTICAL-ELECTRICAL OVERALL MEASUREMENTS 80 3.4.6 DIE PHOTO AND LAYOUT 82 3.5 CONCLUSION 86 CHAPTER 4 ELECTRICAL FRONT-END SERIAL LINK DESIGN FOR 20GBPS MEMORY INTERFACE 87 4.1 INTRODUCTION 87 4.2 CONVENTIONAL ELECTRICAL FRONT-END HIGH SPEED SERIAL LINK ARCHITECTURES 90 4.3 DESIGN CONCEPT AND PROPOSED SERIAL LINK ARCHITECTURE – OPEN LOOP DELAY MATCHED STREAM LINED RECEIVER. 95 4.3.1 PROPOSED OVERALL ARCHITECTURE 95 4.3.2 DESIGN CONCEPT 97 4.3.3 PROPOSED PROTOCOL AND LOCKING PROCESS 100 4.4 OPTIMUM POINT SEARCH ALGORITHM BASED DCDL CONTROLLER DESIGN 102 4.5 DCDL (DIGITALLY CONTROLLED DELAY LINE) DESIGN 112 4.6 DFE (DECISION FEEDBACK EQUALIZER) AND OTHER BLOCKS DESIGN 115 4.7 SIMULATION RESULTS 117 4.8 POWER EXPECTATION AND CHIP LAYOUT 122 4.9 CONCLUSION 124 CHAPTER 5 CONCLUSION 126 BIBLIOGRAPHY 128Docto

    High Performance Integrated Circuit Blocks for High-IF Wideband Receivers

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    Due to the demand for high‐performance radio frequency (RF) integrated circuit design in the past years, a system‐on‐chip (SoC) that enables integration of analog and digital parts on the same die has become the trend of the microelectronics industry. As a result, a major requirement of the next generation of wireless devices is to support multiple standards in the same chip‐set. This would enable a single device to support multiple peripheral applications and services. Based on the aforementioned, the traditional superheterodyne front‐end architecture is not suitable for such applications as it would require a complete receiver for each standard to be supported. A more attractive alternative is the highintermediate frequency (IF) radio architecture. In this case the signal is digitalized at an intermediate frequency such as 200MHz. As a consequence, the baseband operations, such as down‐conversion and channel filtering, become more power and area efficient in the digital domain. Such architecture releases the specifications for most of the front‐end building blocks, but the linearity and dynamic range of the ADC become the bottlenecks in this system. The requirements of large bandwidth, high frequency and enough resolution make such ADC very difficult to realize. Many ADC architectures were analyzed and Continuous‐Time Bandpass Sigma‐Delta (CT‐BP‐ΣΔ) architecture was found to be the most suitable solution in the high‐IF receiver architecture since they combine oversampling and noise shaping to get fairly high resolution in a limited bandwidth. A major issue in continuous‐time networks is the lack of accuracy due to powervoltage‐ temperature (PVT) tolerances that lead to over 20% pole variations compared to their discrete‐time counterparts. An optimally tuned BP ΣΔ ADC requires correcting for center frequency deviations, excess loop delay, and DAC coefficients. Due to these undesirable effects, a calibration algorithm is necessary to compensate for these variations in order to achieve high SNR requirements as technology shrinks. In this work, a novel linearization technique for a Wideband Low‐Noise Amplifier (LNA) targeted for a frequency range of 3‐7GHz is presented. Post‐layout simulations show NF of 6.3dB, peak S21 of 6.1dB, and peak IIP3 of 21.3dBm, respectively. The power consumption of the LNA is 5.8mA from 2V. Secondly, the design of a CMOS 6th order CT BP‐ΣΔ modulator running at 800 MHz for High‐IF conversion of 10MHz bandwidth signals at 200 MHz is presented. A novel transconductance amplifier has been developed to achieve high linearity and high dynamic range at high frequencies. A 2‐bit quantizer with offset cancellation is alsopresented. The sixth‐order modulator is implemented using 0.18 um TSMC standard analog CMOS technology. Post‐layout simulations in cadence demonstrate that the modulator achieves a SNDR of 78 dB (~13 bit) performance over a 14MHz bandwidth. The modulator’s static power consumption is 107mW from a supply power of ± 0.9V. Finally, a calibration technique for the optimization of the Noise Transfer Function CT BP ΣΔ modulators is presented. The proposed technique employs two test tones applied at the input of the quantizer to evaluate the noise transfer function of the ADC, using the capabilities of the Digital Signal Processing (DSP) platform usually available in mixed‐mode systems. Once the ADC output bit stream is captured, necessary information to generate the control signals to tune the ADC parameters for best Signal‐to‐Quantization Noise Ratio (SQNR) performance is extracted via Least‐ Mean Squared (LMS) software‐based algorithm. Since the two tones are located outside the band of interest, the proposed global calibration approach can be used online with no significant effect on the in‐band content

    SiGe-based broadband and high suppression frequency doubler ICs for wireless communications

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    制度:新 ; 報告番号:甲3419号 ; 学位の種類:博士(工学) ; 授与年月日:2011/9/15 ; 早大学位記番号:新574

    High gain and bandwidth current-mode amplifiers : study and implementation

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    Doutoramento em Engenharia ElectrotécnicaEsta tese aborda o problema do projecto de amplificadores com grandes produtos de ganho por largura de banda. A aplicação final considerada consistiu no projecto de amplificadores adequados à recepção de sinais ópticos em sistemas de transmissão ópticos usando o espaço livre. Neste tipo de sistemas as maiores limitações de ganho e largura de banda surgem nos circuitos de entrada. O uso de detectores ópticos com grande área fotosensível é uma necessidade comum neste tipo de sistemas. Estes detectores apresentam grandes capacidades intrínsecas, o que em conjunto com a impedância de entrada apresentada pelo amplificador estabelece sérias restrições no produto do ganho pela largura de banda. As técnicas mais tradicionais para combater este problema recorrem ao uso de amplificadores com retroacção baseados em configurações de transimpedância. Estes amplificadores apresentam baixas impedâncias de entrada devido à acção da retroacção. Contudo, os amplificadores de transimpedância também apresentam uma relação directa entre o ganho e a impedância de entrada. Logo, diminuir a impedância de entrada implica diminuir o ganho. Esta tese propõe duas técnicas novas para combater os problemas referidos. A primeira técnica tem por base uma propriedade fundamental dos amplificadores com retroacção. Em geral, todos os circuitos electrónicos têm tempos de atraso associados, os amplificadores com retroacção não são uma excepção a esta regra. Os tempos de atraso são em geral reconhecidos como elementos instabilizadores neste tipos da amplificadores. Contudo, se usados judiciosamente, este tempos de atraso podem ser explorados como uma forma da aumentar a largura de banda em amplificadores com retroacção. Com base nestas ideias, esta tese apresenta o conceito geral de reatroacção com atraso, como um método de optimização de largura de banda em amplificadores com retroacção. O segundo método baseia-se na destruição da dualidade entre ganho e impedância de entrada existente nos amplificadores de transimpedância. O conceito de adaptação activa em modo de corrente é neste sentido uma forma adequada para separar o detector óptico da entrada do amplificador. De acordo com este conceito, emprega-se um elemento de adaptação em modo de corrente para isolar o detector óptico da entrada do amplificador. Desta forma as tradicionais limitações de ganho e largura de banda podem ser tratadas em separado. Esta tese defende o uso destas técnicas no desenho de amplificadores de transimpedância para sistemas de recepção de sinais ópticos em espaço livre.This thesis addresses the problem of achieving high gain-bandwidth products in amplifiers. The adopted framework consisted on the design of a free-space optical (FSO) front end amplifier able to amplify very small optical signals over large frequency bandwidths. The major gain-bandwidth limitations in FSO front end amplifiers arise due to the input circuitry. Usually, it is necessary to have large area optical detectors in order to maximize signal reception. These detectors have large intrinsic capacitances, which together with the amplifier input impedance poses a severe restriction on the gain-bandwidth product. Traditional techniques to combat this gain-bandwidth limitation resort to feedback amplifiers consisting on transimpedance configurations. These amplifiers have small input impedances due to the feedback action. Nevertheless, transimpedance amplifiers have a direct relation between gain and input impedance. Thus reducing the input impedance usually implies reducing the gain. This thesis advances two new methods suitable to combat the above mentioned problems. The first method is based on a fundamental property of feedback amplifiers. In general, all electronic circuits have associated time delays, and feedback amplifiers are not an exception to this rule. Time delays in feedback amplifiers have been recognized as destabilizing elements. Nevertheless, when used with appropriate care, these delays can be exploited as bandwidth enhancement elements. Based on these ideas, this thesis presents the general concept of delayed feedback, as a bandwidth optimization method suitable for feedback amplifiers. The second method is based on the idea of destroying the impedance-gain duality in transimpedance amplifiers. The concept of active current matching is in this sense a suitable method to detach the optical detector from the transimpedance amplifier input. According to this concept, a current matching device (CMD) is used to convey the signal current sensed by the optical detector, to the amplifier’s input. Using this concept the traditional gainbandwidth limitations can be treated in a separate fashion. This thesis advocates the usage of these techniques for the design of transimpedance amplifiers suited for FSO receiving systems

    A 15 GHz, 1.8V, variable-gain, modified Cherry-Hooper amplifier

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    High Performance LNAs and Mixers for Direct Conversion Receivers in BiCMOS and CMOS Technologies

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    The trend in cellular chipset design today is to incorporate support for a larger number of frequency bands for each new chipset generation. If the chipset also supports receiver diversity two low noise amplifiers (LNAs) are required for each frequency band. This is however associated with an increase of off-chip components, i.e. matching components for the LNA inputs, as well as complex routing of the RF input signals. If balanced LNAs are implemented the routing complexity is further increased. The first presented work in this thesis is a novel multiband low noise single ended LNA and mixer architecture. The mixer has a novel feedback loop suppressing both second order distortion as well as DC-offset. The performance, verified by Monte Carlo simulations, is sufficient for a WCDMA application. The second presented work is a single ended multiband LNA with programmable integrated matching. The LNA is connected to an on-chip tunable balun generating differential RF signals for a differential mixer. The combination of the narrow band input matching and narrow band balun of the presented LNA is beneficial for suppressing third harmonic downconversion of a WLAN interferer. The single ended architecture has great advantages regarding PCB routing of the RF input signals but is on the other hand more sensitive to common mode interferers, e.g. ground, supply and substrate noise. An analysis of direct conversion receiver requirements is presented together with an overview of different LNA and mixer architectures in both BiCMOS and CMOS technology
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