오프셋 제거기의 적응 제어 등화기와 보우-레이트 위상 검출기를 활용한 수신기 설계

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2021.8. 염제완.In this thesis, designs of high-speed, low-power wireline receivers (RX) are explained. To be specific, the circuit techniques of DC offset cancellation, merged-summer DFE, stochastic Baud-rate CDR, and the phase detector (PD) for multi-level signal are proposed. At first, an RX with adaptive offset cancellation (AOC) and merged summer decision-feedback equalizer (DFE) is proposed. The proposed AOC engine removes the random DC offset of the data path by examining the random data stream's sampled data and edge outputs. In addition, the proposed RX incorporates a shared-summer DFE in a half-rate structure to reduce power dissipation and hardware complexity of the adaptive equalizer. A prototype chip fabricated in 40 nm CMOS technology occupies an active area of 0.083 mm2. Thanks to the AOC engine, the proposed RX achieves the BER of less than 10-12 in a wide range of data rates: 1.62-10 Gb/s. The proposed RX consumes 18.6 mW at 10 Gb/s over a channel with a 27 dB loss at 5 GHz, exhibiting a figure-of-merit of 0.068 pJ/b/dB. Secondly, a 40 nm CMOS RX with Baud-rate phase-detector (BRPD) is proposed. The RX includes two PDs: the BRPD employing the stochastic technique and the BRPD suitable for multi-level signals. Thanks to the Baud-rate CDR’s advantage, by not using an edge-sampling clock, the proposed CDR can reduce the power consumption by lowering the hardware complexity. Besides, the proposed stochastic phase detector (SPD) tracks an optimal phase-locking point that maximizes the vertical eye opening. Furthermore, despite residual inter-symbol interference, proposed BRPD for multi-level signal secures vertical eye margin, which is especially vulnerable in the multi-level signal. Besides, the proposed BRPD has a unique lock point with an adaptive DFE, unlike conventional Mueller-Muller PD. A prototype chip fabricated in 40 nm CMOS technology occupies an active area of 0.24 mm2. The proposed PAM-4 RX achieves the bit-error-rate less than 10-11 in 48 Gb/s and the power efficiency of 2.42 pJ/b.본 논문은 고속, 저전력으로 동작하는 유선 수신기의 설계에 대해 설명하고 있다. 구체적으로 말하면, 오프셋 상쇄, 병합된 서머를 사용하는 결정 피드백 등화기 기술, 확률적 보우 레이트 클럭과 데이터 복원기, 그리고 다중 레벨 신호에 적합한 위상 검출기를 제안한다. 첫째로, 적응 오프셋 제거 및 병합된 서머를 사용하는 결정 피드백 등화기를 갖춘 수신기를 제안한다. 제안된 적응 오프셋 제거 엔진은 임의의 데이터 스트림의 샘플링 데이터, 에지 출력을 검사하여 데이터 경로 상의 오프셋을 제거한다. 또한 하프 레이트 구조의 병합된 서머를 사용하는 결정 피드백 등화기는 전력의 사용과 하드웨어의 복잡성을 줄인다. 40 nm CMOS 기술로 제작된 프로토타입 칩은 0.083 mm2 의 면적을 가진다. 적응 오프셋 제거기 덕분에 제안된 수신기는 10-12 미만의 BER을 달성한다. 또한 제안된 수신기는 5GHz에서 27 dB의 로스를 갖는 채널에서 10 Gb/s의 속도에서 18.6 mW를 소비하며 0.068 pJ/b/dB의 FoM을 달성하였다. 두번째로, 보우 레이트 위상 검출기가 있는 40 nm CMOS 수신기가 제안되었다. 수신기에는 두개의 보우 레이트 위상 검출기를 포함한다. 하나는 확률론적 기법을 사용하는 보우 레이트 위상 검출기이다. 보우 레이트 클럭 데이터 복원기의 장점 덕분에 에지 샘플링 클럭을 사용하지 않음으로서 파워의 소모와 하드웨어의 복잡성을 줄였다. 또한 확률적 위상 검출기는 수직 아이 오프닝을 최대화하는 최적의 위상 지점을 찾을 수 있었다. 다른 위상 검출기는 다중 레벨 신호에 적합한 방식이다. 심볼 간 간섭이 다중 레벨 신호에 매우 취약한 문제가 있더라도 제안된 다중 레벨 신호용 보우 레이트 위상 검출기는 수직 아이 마진을 확보한다. 게다가 제안된 보우 레이트 위상 검출기는 기존의 뮬러-뮐러 위상 검출기와 달리 적응형 결정 피드백 등화기가 있더라도 유일한 락 지점을 갖는다. 프로토타입 칩은 0.24mm2의 면적을 가진다. 제안된 PAM-4 수신기는 48 Gb/s의 속도에서 10-11 미만의 BER을 가지고, 2.42 pJ/b의 FoM을 가진다.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 5 CHAPTER 2 BACKGROUNDS 6 2.1 BASIC ARCHITECTURE IN SERIAL LINK 6 2.1.1 SERIAL COMMUNICATION 6 2.1.2 CLOCK AND DATA RECOVERY 8 2.1.3 MULTI-LEVEL PULSE-AMPLITUDE MODULATION 10 2.2 EQUALIZER 12 2.2.1 EQUALIZER OVERVIEW 12 2.2.2 DECISION-FEEDBACK EQUALIZER 15 2.2.3 ADAPTIVE EQUALIZER 18 2.3 CLOCK RECOVERY 21 2.3.1 2X OVERSAMPLING PD ALEXANDER PD 22 2.3.2 BAUD-RATE PD MUELLER MULLER PD 25 CHAPTER 3 AN ADAPTIVE OFFSET CANCELLATION SCHEME AND SHARED SUMMER ADAPTIVE DFE 28 3.1 OVERVIEW 28 3.2 AN ADAPTIVE OFFSET CANCELLATION SCHEME AND SHARED-SUMMER ADAPTIVE DFE FOR LOW POWER RECEIVER 31 3.3 SHARED SUMMER DFE 37 3.4 RECEIVER IMPLEMENTATION 42 3.5 MEASUREMENT RESULTS 45 CHAPTER 4 PAM-4 BAUD-RATE DIGITAL CDR 51 4.1 OVERVIEW 51 4.2 OVERALL ARCHITECTURE 53 4.2.1 PROPOSED BAUD-RATE CDR ARCHITECTURE 53 4.2.2 PROPOSED ANALOG FRONT-END STRUCTURE 59 4.3 STOCHASTIC PHASE DETECTION PAM-4 CDR 64 4.3.1 PROPOSED STOCHASTIC PHASE DETECTION 64 4.3.2 COMPARISON OF THE STOCHASTIC PD WITH SS-MMPD 70 4.4 PHASE DETECTION FOR MULTI-LEVEL SIGNALING 73 4.4.1 PROPOSED BAUD-RATE PHASE DETECTOR FOR MULTI-LEVEL SIGNAL 73 4.4.2 DATA LEVEL AND DFE COEFFICIENT ADAPTATION 79 4.4.3 PROPOSED PHASE DETECTOR 84 4.5 MEASUREMENT RESULT 88 4.5.1 MEASUREMENT OF THE PROPOSED STOCHASTIC BAUD-RATE PHASE DETECTION 94 4.5.2 MEASUREMENT OF THE PROPOSED BAUD-RATE PHASE DETECTION FOR MULTI-LEVEL SIGNAL 97 CHAPTER 5 CONCLUSION 103 BIBLIOGRAPHY 105 초 록 109박

메모리 인터페이스를 위한 20Gbps급 직렬화 송수신기 설계

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2013. 8. 정덕균.Various types of serial link for current and future memory interface are presented in this thesis. At first, PHY design for commercial GDDR3 memory is proposed. GDDR3 PHY is consists of read path, write path, command path. Write path and command path calibrate skew by using VDL (Variable delay line), while read path calibrates skew by using DLL (Delay locked loop) and VDL. There are four data channels and one command/address channel. Each data channel consists of one clock signal (DQS) and eight data signals (DQ). Data channel operates in 1.2Gbps (1.08Gbps~1.2Gbps), and command/address channel operates 600Mbps (540Mbps~600Mbps). In particular, DLL design for high speed and for SSN (simultaneous switching noise) is concentrated in this thesis. Secondly, serial link design for silicon photonics is proposed. Silicon photonics is the strongest candidate for next generation memory interface. Modulator driver for modulator, TIA (trans-impedance amplifier) and LA (limiting amplifier) for photo diode design are discussed. It operates above 12.5Gbps but it consumes much power 7.2mW/Gbps (transmitter core), 2mW/Gbps (receiver core) because it is connected with optical device which has large parasitic capacitance. Overall receiver which includes CDR (clock and data recovery) is also implemented. Many chips are fabricated in 65nm, 0.13um CMOS process. Finally, electrical serial link for 20Gbps memory link is proposed. Overall architecture is forwarded clocking architecture, and is very simple and intuitive. It does not need additional synchronizer. This open loop delay matched stream line receiver finds optimum sampling point with DCDL (Digitally controlled delay line) controller and expects to consume low power structurally. Only two phase half rate clock is transmitted through clock channel, but half rate time interleaved way sampling is performed by aid of initial value settable PRBS chaser. A CMOS Chip is fabricated by 65nm process and it occupies 2500um x 2500um (transceiver). It is expected that about 2.6mW(2.4mW)/Gbps (transmitter), 4.1mW(2.7mW)/Gbps (receiver). Power consumption improvement is expected in advanced process.ABSTRACT I CONTENTS V LIST OF FIGURES VII LIST OF TABLES XII CHAPTER 1 INTRODUCTION １ 1.1 MOTIVATION １ 1.2 THESIS ORGANIZATION １０ CHAPTER 2 A SERIAL LINK PHY DESIGN FOR GDDR3 MEMORY INTERFACE 11 2.1 INTRODUCTION 11 2.2 GDDR3 MEMORY INTERFACE ARCHITECTURE 12 2.2.1 READ PATH ARCHITECTURE 15 2.2.2 WRITE PATH ARCHITECTURE 17 2.2.3 COMMAND PATH ARCHITECTURE 19 2.3 DLL DESIGN FOR MEMORY INTERFACE 20 2.3.1 SSN(SIMULTANEOUS SWITCHING NOISE) 20 2.3.2 DLL ARCHITECTURE 21 2.3.3 VOLTAGE CONTROLLED DELAY LINE (VCDL) 22 2.3.4 HYSTERESIS COARSE LOCK DETECTOR (HCLD) 23 2.3.5 DYNAMIC PHASE DETECTOR AND CHARGE PUMP 26 2.4 SIMULATION RESULT 29 2.5 CONCLUSION 32 CHAPTER 3 OPTICAL FRONT-END SERIAL LINK DESIGN FOR 20 GBPS MEMORY INTERFACE 35 3.1 SILICON PHOTONICS INTRODUCTION 35 3.2 OPTICAL FRONT-END TRANSMITTER DESIGN 45 3.2.1 MODULATOR DRIVER REQUIREMENTS 46 3.2.2 MODULATOR DRIVER DESIGN - CURRENT MODE DRIVER 47 3.2.3 MODULATOR DRIVER DESIGN - CURRENT MODE DRIVER 50 3.3 OPTICAL FRONT-END RECEIVER DESIGN 55 3.3.1 OPTICAL RECEIVER BACK END REQUIREMENTS 56 3.3.2 OPTICAL RECEIVER BACK END DESIGN – TIA 57 3.3.3 OPTICAL RECEIVER BACK END DESIGN – LA, DRIVER 63 3.3.4 OPTICAL RECEIVER BACK END DESIGN – CDR 66 3.4 MEASUREMENT AND SIMULATION RESULTS 70 3.4.1 MEASUREMENT AND SIMULATION ENVIRONMENTS 70 3.4.2 OPTICAL TX FRONT END MEASUREMENT AND SIMULATION 74 3.4.3 OPTICAL RX FRONT END MEASUREMENT AND SIMULATION 77 3.4.4 OPTICAL RX BACK END SIMULATION 79 3.4.5 OPTICAL-ELECTRICAL OVERALL MEASUREMENTS 80 3.4.6 DIE PHOTO AND LAYOUT 82 3.5 CONCLUSION 86 CHAPTER 4 ELECTRICAL FRONT-END SERIAL LINK DESIGN FOR 20GBPS MEMORY INTERFACE 87 4.1 INTRODUCTION 87 4.2 CONVENTIONAL ELECTRICAL FRONT-END HIGH SPEED SERIAL LINK ARCHITECTURES 90 4.3 DESIGN CONCEPT AND PROPOSED SERIAL LINK ARCHITECTURE – OPEN LOOP DELAY MATCHED STREAM LINED RECEIVER. 95 4.3.1 PROPOSED OVERALL ARCHITECTURE 95 4.3.2 DESIGN CONCEPT 97 4.3.3 PROPOSED PROTOCOL AND LOCKING PROCESS 100 4.4 OPTIMUM POINT SEARCH ALGORITHM BASED DCDL CONTROLLER DESIGN 102 4.5 DCDL (DIGITALLY CONTROLLED DELAY LINE) DESIGN 112 4.6 DFE (DECISION FEEDBACK EQUALIZER) AND OTHER BLOCKS DESIGN 115 4.7 SIMULATION RESULTS 117 4.8 POWER EXPECTATION AND CHIP LAYOUT 122 4.9 CONCLUSION 124 CHAPTER 5 CONCLUSION 126 BIBLIOGRAPHY 128Docto

Architectural & circuit level techniques to improve energy efficiency of high speed serial links

High performance computing and communication are two key aspects of all information processing systems. With aggressive scaling of silicon technology enabling integration of a large number of transistors in a small area, managing power and thermal reliability has become very challenging. While lowering the power needed for performing computation has been the prime focus for decades, energy consumed for data transfer has recently become a major bottleneck especially in high performance applications. The focus of this thesis is on improving energy efficiency of communication links by exploring design techniques at both the architectural and circuit levels. In the first part of this work, we propose a time-based equalization scheme to implement transmit de-emphasis in voltage-mode output drivers. Using two-level pulse-width modulation, it overcomes the tradeoff between impedance matching, output swing, and de-emphasis resolution in conventional voltage-mode drivers. A prototype PWM-based 5$\,$Gb/s voltage-mode transmitter was implemented in a 90$\,$nm CMOS process and characterized across different channels and output swings to demonstrate the effectiveness of proposed techniques. The horizontal/vertical eye openings (BER=$\rm 10^{-12}$) at the ends of 60$\,$inch and 96$\,$inch stripline channels are 78$\,$mV/0.6$\,$UI and 8$\,$mV/0.3$\,$UI, respectively. This transmitter achieves an energy efficiency of 3.1$\,$mW/Gb/s while compensating for 16-28$\,$dB channel loss, which compares favorably with the state-of-the-art. In the second part, techniques to improve energy efficiency of a complete transceiver are presented. The transmitter employs a novel partially segmented voltage-mode output driver to lower power consumption in pre-drivers during 2-tap FIR equalization. The receiver implements a low power half-rate clock and data recovery with the proposed ring PLL based multi-phase sampling clock generation in CDR loop and charge-based sampling and deserialization. These techniques are verified using the measured results obtained from a 14Gb/s transceiver prototype. Transmitter achieves an energy efficiency of 0.89$\,$mW/Gb/s while securing a 0.36$\,$UI sampling time margin with $\rm{BER=10^{-12}}$ at the end of the channel with 11$\,$dB loss at Nyquist frequency. The receiver recovers sampling clock with 1.8$\,$$\rm{ps_{rms}}$ long term absolute jitter while recovering 14$\,$Gb/s data at $\rm{BER=10^{-12}}$. The receiver achieves an energy efficiency of 1.69$\,$mW/Gb/s. Transmitter and receiver share an LC PLL, which achieves 0.605$\,$$\rm{ps_{rms}}$ integrated jitter at 7$\,$GHz output with an energy efficiency of 0.5$\,$mW/GHz. The transceiver as a whole achieves an energy efficiency of 2.8$\,$mW/Gb/s

Digital Centric Multi-Gigabit SerDes Design and Verification

Advances in semiconductor manufacturing still lead to ever decreasing feature sizes and constantly allow higher degrees of integration in application specific integrated circuits (ASICs). Therefore the bandwidth requirements on the external interfaces of such systems on chips (SoC) are steadily growing. Yet, as the number of pins on these ASICs is not increasing in the same pace - known as pin limitation - the bandwidth per pin has to be increased. SerDes (Serializer/Deserializer) technology, which allows to transfer data serially at very high data rates of 25Gbps and more is a key technology to overcome pin limitation and exploit the computing power that can be achieved in todays SoCs. As such SerDes blocks together with the digital logic interfacing them form complex mixed signal systems, verification of performance and functional correctness is very challenging. In this thesis a novel mixed-signal design methodology is proposed, which tightly couples model and implementation in order to ensure consistency throughout the design cycles and hereby accelerate the overall implementation flow. A tool flow that has been developed is presented, which integrates well into state of the art electronic design automation (EDA) environments and enables the usage of this methodology in practice. Further, the design space of todays high-speed serial links is analyzed and an architecture is proposed, which pushes complexity into the digital domain in order to achieve robustness, portability between manufacturing processes and scaling with advanced node technologies. The all digital phase locked loop (PLL) and clock data recovery (CDR), which have been developed are described in detail. The developed design flow was used for the implementation of the SerDes architecture in a 28nm silicon process and proved to be indispensable for future projects

차세대 HBM 용 고집적, 저전력 송수신기 설계

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 정덕균.This thesis presents design techniques for high-density power-efficient transceiver for the next-generation high bandwidth memory (HBM). Unlike the other memory interfaces, HBM uses a 3D-stacked package using through-silicon via (TSV) and a silicon interposer. The transceiver for HBM should be able to solve the problems caused by the 3D-stacked package and TSV. At first, a data (DQ) receiver for HBM with a self-tracking loop that tracks a phase skew between DQ and data strobe (DQS) due to a voltage or thermal drift is proposed. The self-tracking loop achieves low power and small area by uti-lizing an analog-assisted baud-rate phase detector. The proposed pulse-to-charge (PC) phase detector (PD) converts the phase skew to a voltage differ-ence and detects the phase skew from the voltage difference. An offset calibra-tion scheme that can compensates for a mismatch of the PD is also proposed. The proposed calibration scheme operates without any additional sensing cir-cuits by taking advantage of the write training of HBM. Fabricated in 65 nm CMOS, the DQ receiver shows a power efficiency of 370 fJ/b at 4.8 Gb/s and occupies 0.0056 mm2. The experimental results show that the DQ receiver op-erates without any performance degradation under a ± 10% supply variation. In a second prototype IC, a high-density transceiver for HBM with a feed-forward-equalizer (FFE)-combined crosstalk (XT) cancellation scheme is pre-sented. To compensate for the XT, the transmitter pre-distorts the amplitude of the FFE output according to the XT. Since the proposed XT cancellation (XTC) scheme reuses the FFE implemented to equalize the channel loss, additional circuits for the XTC is minimized. Thanks to the XTC scheme, a channel pitch can be significantly reduced, allowing for the high channel density. Moreover, the 3D-staggered channel structure removes the ground layer between the verti-cally adjacent channels, which further reduces a cross-sectional area of the channel per lane. The test chip including 6 data lanes is fabricated in 65 nm CMOS technology. The 6-mm channels are implemented on chip to emulate the silicon interposer between the HBM and the processor. The operation of the XTC scheme is verified by simultaneously transmitting 4-Gb/s data to the 6 consecutive channels with 0.5-um pitch and the XTC scheme reduces the XT-induced jitter up to 78 %. The measurement result shows that the transceiver achieves the throughput of 8 Gb/s/um. The transceiver occupies 0.05 mm2 for 6 lanes and consumes 36.6 mW at 6 x 4 Gb/s.본 논문에서는 차세대 HBM을 위한 고집적 저전력 송수신기 설계 방법을 제안한다. 첫 번째로, 전압 및 온도 변화에 의한 데이터와 클럭 간 위상 차이를 보상할 수 있는 자체 추적 루프를 가진 데이터 수신기를 제안한다. 제안하는 자체 추적 루프는 데이터 전송 속도와 같은 속도로 동작하는 위상 검출기를 사용하여 전력 소모와 면적을 줄였다. 또한 메모리의 쓰기 훈련 (write training) 과정을 이용하여 효과적으로 위상 검출기의 오프셋을 보상할 수 있는 방법을 제안한다. 제안하는 데이터 수신기는 65 nm 공정으로 제작되어 4.8 Gb/s에서 370 fJ/b을 소모하였다. 또한 10 % 의 전압 변화에 대하여 안정적으로 동작하는 것을 확인하였다. 두 번째로, 피드 포워드 이퀄라이저와 결합된 크로스 토크 보상 방식을 활용한 고집적 송수신기를 제안한다. 제안하는 송신기는 크로스 토크 크기에 해당하는 만큼 송신기 출력을 왜곡하여 크로스 토크를 보상한다. 제안하는 크로스 토크 보상 방식은 채널 손실을 보상하기 위해 구현된 피드 포워드 이퀄라이저를 재활용함으로써 추가적인 회로를 최소화한다. 제안하는 송수신기는 크로스 토크가 보상 가능하기 때문에, 채널 간격을 크게 줄여 고집적 통신을 구현하였다. 또한 집적도를 더 증가시키기 위해 세로로 인접한 채널 사이의 차폐 층을 제거한 적층 채널 구조를 제안한다. 6개의 송수신기를 포함한 프로토타입 칩은 65 nm 공정으로 제작되었다. HBM과 프로세서 사이의 silicon interposer channel 을 모사하기 위한 6 mm 의 채널이 칩 위에 구현되었다. 제안하는 크로스 토크 보상 방식은 0.5 um 간격의 6개의 인접한 채널에 동시에 데이터를 전송하여 검증되었으며, 크로스 토크로 인한 지터를 최대 78 % 감소시켰다. 제안하는 송수신기는 8 Gb/s/um 의 처리량을 가지며 6 개의 송수신기가 총 36.6 mW의 전력을 소모하였다.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 4 CHAPTER 2 BACKGROUND ON HIGH-BANDWIDTH MEMORY 6 2.1 OVERVIEW 6 2.2 TRANSCEIVER ARCHITECTURE 10 2.3 READ/WRITE OPERATION 15 2.3.1 READ OPERATION 15 2.3.2 WRITE OPERATION 19 CHAPTER 3 BACKGROUNDS ON COUPLED WIRES 21 3.1 GENERALIZED MODEL 21 3.2 EFFECT OF CROSSTALK 26 CHAPTER 4 DQ RECEIVER WITH BAUD-RATE SELF-TRACKING LOOP 29 4.1 OVERVIEW 29 4.2 FEATURES OF DQ RECEIVER FOR HBM 33 4.3 PROPOSED PULSE-TO-CHARGE PHASE DETECTOR 35 4.3.1 OPERATION OF PULSE-TO-CHARGE PHASE DETECTOR 35 4.3.2 OFFSET CALIBRATION 37 4.3.3 OPERATION SEQUENCE 39 4.4 CIRCUIT IMPLEMENTATION 42 4.5 MEASUREMENT RESULT 46 CHAPTER 5 HIGH-DENSITY TRANSCEIVER FOR HBM WITH 3D-STAGGERED CHANNEL AND CROSSTALK CANCELLATION SCHEME 57 5.1 OVERVIEW 57 5.2 PROPOSED 3D-STAGGERED CHANNEL 61 5.2.1 IMPLEMENTATION OF 3D-STAGGERED CHANNEL 61 5.2.2 CHANNEL CHARACTERISTICS AND MODELING 66 5.3 PROPOSED FEED-FORWARD-EQUALIZER-COMBINED CROSSTALK CANCELLATION SCHEME 72 5.4 CIRCUIT IMPLEMENTATION 77 5.4.1 OVERALL ARCHITECTURE 77 5.4.2 TRANSMITTER WITH FFE-COMBINED XTC 79 5.4.3 RECEIVER 81 5.5 MEASUREMENT RESULT 82 CHAPTER 6 CONCLUSION 93 BIBLIOGRAPHY 95 초 록 102Docto

데이터 전송로 확장성과 루프 선형성을 향상시킨 다중채널 수신기들에 관한 연구

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2013. 2. 정덕균.Two types of serial data communication receivers that adopt a multichannel architecture for a high aggregate I/O bandwidth are presented. Two techniques for collaboration and sharing among channels are proposed to enhance the loop-linearity and channel-expandability of multichannel receivers, respectively. The first proposed receiver employs a collaborative timing scheme recovery which relies on the sharing of all outputs of phase detectors (PDs) among channels to extract common information about the timing and multilevel signaling architecture of PAM-4. The shared timing information is processed by a common global loop filter and is used to update the phase of the voltage-controlled oscillator with better rejection of per-channel noise. In addition to collaborative timing recovery, a simple linearization technique for binary PDs is proposed. The technique realizes a high-rate oversampling PD while the hardware cost is equivalent to that of a conventional 2x-oversampling clock and data recovery. The first receiver exploiting the collaborative timing recovery architecture is designed using 45-nm CMOS technology. A single data lane occupies a 0.195-mm2 area and consumes a relatively low 17.9 mW at 6 Gb/s at 1.0V. Therefore, the power efficiency is 2.98 mW/Gb/s. The simulated jitter is about 0.034 UI RMS given an input jitter value of 0.03 UI RMS, while the relatively constant loop bandwidth with the PD linearization technique is about 7.3-MHz regardless of the data-stream noise. Unlike the first receiver, the second proposed multichannel receiver was designed to reduce the hardware complexity of each lane. The receiver employs shared calibration logic among channels and yet achieves superior channel expandability with slim data lanes. A shared global calibration control, which is used in a forwarded clock receiver based on a multiphase delay-locked loop, accomplishes skew calibration, equalizer adaptation, and the phase lock of all channels during a calibration period, resulting in reduced hardware overhead and less area required by each data lane. The second forwarded clock receiver is designed in 90-nm CMOS technology. It achieves error-free eye openings of more than 0.5 UI across 9− 28 inch Nelco 4000-6 microstrips at 4− 7 Gb/s and more than 0.42 UI at data rates of up to 9 Gb/s. The data lane occupies only 0.152 mm2 and consumes 69.8 mW, while the rest of the receiver occupies 0.297 mm2 and consumes 56 mW at a data rate of 7 Gb/s and a supply voltage of 1.35 V.1. Introduction 1 1.1 Motivations 1.2 Thesis Organization 2. Previous Receivers for Serial-Data Communications 2.1 Classification of the Links 2.2 Clocking architecture of transceivers 2.3 Components of receiver 2.3.1 Channel loss 2.3.2 Equalizer 2.3.3 Clock and data recovery circuit 2.3.3.1. Basic architecture 2.3.3.2. Phase detector 2.3.3.2.1. Linear phase detector 2.3.3.2.2. Binary phase detector 2.3.3.3. Frequency detector 2.3.3.4. Charge pump 2.3.3.5. Voltage controlled oscillator and delay-line 2.3.4 Loop dynamics of PLL 2.3.5 Loop dynamics of DLL 3. The Proposed PLL-Based Receiver with Loop Linearization Technique 3.1 Introduction 3.2 Motivation 3.3 Overview of binary phase detection 3.4 The proposed BBPD linearization technique 3.4.1 Architecture of the proposed PLL-based receiver 3.4.2 Linearization technique of binary phase detection 3.4.3 Rotational pattern of sampling phase offset 3.5 PD gain analysis and optimization 3.6 Loop Dynamics of the 2nd-order CDR 3.7 Verification with the time-accurate behavioral simulation 3.8 Summary 4. The Proposed DLL-Based Receiver with Forwarded-Clock 4.1 Introduction 4.2 Motivation 4.3 Design consideration 4.4 Architecture of the proposed forwarded-clock receiver 4.5 Circuit description 4.5.1 Analog multi-phase DLL 4.5.2 Dual-input interpolating deley cells 4.5.3 Dedicated half-rate data samplers 4.5.4 Cherry-Hooper continuous-time linear equalizer 4.5.5 Equalizer adaptation and phase-lock scheme 4.6 Measurement results 5. Conclusion 6. BibliographyDocto

Design of Energy-Efficient Equalization and Data Encoding/Decoding Techniques for Wireline Communication Systems

Ever increasing global internet data traffic has driven up the demand for cutting-edge high-speed wireline communication systems including SerDes PHY for various interfaces, interconnects, data centers servers and switches in optical systems. Operating wireline communications at higher data rates leads to signals suffering from greater channel loss and exponential increase in power consumption, mainly caused by a heavier amount of required equalization. In this dissertation, two distinct methodologies for designing SerDes transceivers are presented: 1) a pulse width modulated (PWM) time-domain feed forward equalizer (FFE) and linearity improvement technique for higher-order pulse amplitude modulation (PAM) including PAM-8, and 2) an inter-symbol interference (ISI)-resilient data encoding and decoding technique with Dicode encoding and error correction logic for low-bandwidth wireline channels, as an alternative strategy for communicating in an energy-efficient way on bandwidth-limited wireline channels without using conventional equalizers or filters. The first topic is a PAM-8 wireline transceiver with receiver-side pulse-width-modulated (PWM) or time-domain based feed forward equalization (FFE) technique. The receiver converts voltage-modulated signals or PAM signals to PWM signals and processes them using inverter based delay elements having rail to rail voltage swing. Time-to-voltage and voltage-to-time converters are designed to have non-linearity with opposite signs with the aim of achieving higher front-end linearity on the receiver. The proposed PAM-8 transceiver can operate from 12.0 Gb/s to 39.6 Gb/s and compensates 14 dB loss at 6.6 GHz with an efficiency of 8.66 pJ/bit in 65 nm CMOS. The second topic is an alternative strategy for communicating on bandwidth-limited wireline channels without using conventional equalizers or filters (FFE, DFE, and CTLE): Inter-symbol interference (ISI) resilient Dicode encoding and error correction for low-bandwidth wireline channels. The key observation is that Dicode-encoded data have no consecutive 1s or -1s. With this known information, the error correction logic at the receiver can correct multi-bit errors due to ISI. Implemented in 65 nm CMOS, the proposed digital encoding and decoding approach can achieve BER less than 10−12 while communicating on a channel with an insertion loss of 24.2 dB and 21.4 dB with 2.56 pJ/bit and 2.66 pJ/bit efficiency while operating at 13.6 Gb/s and 16 Gb/s, respectively

Power-Proportional Optical Links

The continuous increase in data transfer rate in short-reach links, such as chip-to-chip and between servers within a data-center, demands high-speed links. As power efficiency becomes ever more important in these links, power-efficient optical links need to be designed. Power efficiency in a link can be achieved by enabling power-proportional communication over the serial link. In power-proportional links, the power dissipated by a link is proportional to the amount of data communicated. Normally, data-rate demand is not constant, and the peak data-rate is not required all the time. If a link is not adapted according to the data-rate demand, there will be a fixed power dissipation, and the power efficiency of the link will degrade during the sub-maximal link utilization. Adapting links to real-time data-rate requirements reduces power dissipation. Power proportionality is achieved by scaling the power of the serial link linearly with the link utilization, and techniques such as variable data-rate and burst-mode can be adopted for this purpose. Links whose data rate (and hence power dissipation) can be varied in response to system demands are proposed in this work. Past works have presented rapidly reconfigurable bandwidth in variable data-rate receivers, allowing lower power dissipation for lower data-rate operation. However, maintaining synchronization during reconfiguration was not possible since previous approaches have introduced changes in front-end delay when they are reconfigured. This work presents a technique that allows rapid bandwidth adjustment while maintaining a near-constant delay through the receiver suitable for a power-scalable variable data-rate optical link. Measurements of a fabricated integrated circuit (IC) show nearly constant energy per bit across a 2× variation in data rate while introducing less than 10 % of a unit interval (UI) of delay variation. With continuously increasing data communication in data-centers, parallel optical links with ever-increasing per-lane data rates are being used to meet overall throughput demands. Simultaneously, power efficiency is becoming increasingly important for these links since they do not transmit useful data all the time. The burst-mode solution for vertical-cavity surface-emitting laser (VCSEL)-based point-to-point communication can be used to improve links’ energy efficiency during low link activity. The burst-mode technique for VCSEL-based links has not yet been deployed commercially. Past works have presented burst-mode solutions for single-channel receivers, allowing lower power dissipation during low link activity and solutions for fast activation of the receivers. However, this work presents a novel technique that allows rapid activation of a front-end and fast locking of a clock-and-data-recovery (CDR) for a multi-channel parallel link, utilizing opportunities arising from the parallel nature of many VCSEL-based links. The idea has been demonstrated through electrical and optical measurements of a fabricated IC at 10 Gbps, which show fast data detection and activation of the circuitry within 49 UIs while allowing the front-end to achieve better energy efficiency during low link activity. Simulation results are also presented in support of the proposed technique which allows the CDR to lock within 26 UIs from when it is powered on

Design of energy efficient high speed I/O interfaces

Energy efficiency has become a key performance metric for wireline high speed I/O interfaces. Consequently, design of low power I/O interfaces has garnered large interest that has mostly been focused on active power reduction techniques at peak data rate. In practice, most systems exhibit a wide range of data transfer patterns. As a result, low energy per bit operation at peak data rate does not necessarily translate to overall low energy operation. Therefore, I/O interfaces that can scale their power consumption with data rate requirement are desirable. Rapid on-off I/O interfaces have a potential to scale power with data rate requirements without severely affecting either latency or the throughput of the I/O interface. In this work, we explore circuit techniques for designing rapid on-off high speed wireline I/O interfaces and digital fractional-N PLLs. A burst-mode transmitter suitable for rapid on-off I/O interfaces is presented that achieves 6 ns turn-on time by utilizing a fast frequency settling ring oscillator in digital multiplying delay-locked loop and a rapid on-off biasing scheme for current mode output driver. Fabricated in 90 nm CMOS process, the prototype achieves 2.29 mW/Gb/s energy efficiency at peak data rate of 8 Gb/s. A 125X (8 Gb/s to 64 Mb/s) change in effective data rate results in 67X (18.29 mW to 0.27 mW) change in transmitter power consumption corresponding to only 2X (2.29 mW/Gb/s to 4.24 mW/Gb/s) degradation in energy efficiency for 32-byte long data bursts. We also present an analytical bit error rate (BER) computation technique for this transmitter under rapid on-off operation, which uses MDLL settling measurement data in conjunction with always-on transmitter measurements. This technique indicates that the BER bathtub width for 10^(−12) BER is 0.65 UI and 0.72 UI during rapid on-off operation and always-on operation, respectively. Next, a pulse response estimation-based technique is proposed enabling burst-mode operation for baud-rate sampling receivers that operate over high loss channels. Such receivers typically employ discrete time equalization to combat inter-symbol interference. Implementation details are provided for a receiver chip, fabricated in 65nm CMOS technology, that demonstrates efficacy of the proposed technique. A low complexity pulse response estimation technique is also presented for low power receivers that do not employ discrete time equalizers. We also present techniques for implementation of highly digital fractional-N PLL employing a phase interpolator based fractional divider to improve the quantization noise shaping properties of a 1-bit ∆Σ frequency-to-digital converter. Fabricated in 65nm CMOS process, the prototype calibration-free fractional-N Type-II PLL employs the proposed frequency-to-digital converter in place of a high resolution time-to-digital converter and achieves 848 fs rms integrated jitter (1 kHz-30 MHz) and -101 dBc/Hz in-band phase noise while generating 5.054 GHz output from 31.25 MHz input