233 research outputs found

    Energy Efficient Techniques For Algorithmic Analog-To-Digital Converters

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    Analog-to-digital converters (ADCs) are key design blocks in state-of-art image, capacitive, and biomedical sensing applications. In these sensing applications, algorithmic ADCs are the preferred choice due to their high resolution and low area advantages. Algorithmic ADCs are based on the same operating principle as that of pipelined ADCs. Unlike pipelined ADCs where the residue is transferred to the next stage, an N-bit algorithmic ADC utilizes the same hardware N-times for each bit of resolution. Due to the cyclic nature of algorithmic ADCs, many of the low power techniques applicable to pipelined ADCs cannot be directly applied to algorithmic ADCs. Consequently, compared to those of pipelined ADCs, the traditional implementations of algorithmic ADCs are power inefficient. This thesis presents two novel energy efficient techniques for algorithmic ADCs. The first technique modifies the capacitors' arrangement of a conventional flip-around configuration and amplifier sharing technique, resulting in a low power and low area design solution. The other technique is based on the unit multiplying-digital-to-analog-converter approach. The proposed approach exploits the power saving advantages of capacitor-shared technique and capacitor-scaled technique. It is shown that, compared to conventional techniques, the proposed techniques reduce the power consumption of algorithmic ADCs by more than 85\%. To verify the effectiveness of such approaches, two prototype chips, a 10-bit 5 MS/s and a 12-bit 10 MS/s ADCs, are implemented in a 130-nm CMOS process. Detailed design considerations are discussed as well as the simulation and measurement results. According to the simulation results, both designs achieve figures-of-merit of approximately 60 fJ/step, making them some of the most power efficient ADCs to date

    Solid-state imaging : a critique of the CMOS sensor

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    Analyses and design strategies for fundamental enabling building blocks: Dynamic comparators, voltage references and on-die temperature sensors

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    Dynamic comparators and voltage references are among the most widely used fundamental building blocks for various types of circuits and systems, such as data converters, PLLs, switching regulators, memories, and CPUs. As thermal constraints quickly emerged as a dominant performance limiter, on-die temperature sensors will be critical to the reliable operation of future integrated circuits. This dissertation investigates characteristics of these three enabling circuits and design strategies for improving their performances. One of the most critical specifications of a dynamic comparator is its input referred offset voltage, which is pivotal to achieving overall system performance requirements of many mixed-signal circuits and systems. Unlike offset voltages in other circuits such as amplifiers, the offset voltage in a dynamic comparator is extremely challenging to analyze and predict analytically due to its dependence on transient response and due to internal positive feedback and time-varying operating points in the comparator. In this work, a novel balanced method is proposed to facilitate the evaluation of time-varying operating points of transistors in a dynamic comparator. Two types of offsets are studied in the model: (1) static offset voltage caused by mismatches in mobilities, transistor sizes, and threshold voltages, and (2) dynamic offset voltage caused by mismatches in parasitic capacitors or loading capacitors. To validate the proposed method, dynamic comparators in two prevalent topologies are implemented in 0.25 μm and 40 nm CMOS technologies. Agreement between predicted results and simulated results verifies the effectiveness of the proposed method. The new method and the analytical models enable designers to identify the most dominant contributors to offset and to optimize the dynamic comparators\u27 performances. As an illustrating example, the Lewis-Gray dynamic comparator was analyzed using the balanced method and redesigned to minimize its offset voltage. Simulation results show that the offset voltage was easily reduced by 41% while maintaining the same silicon area. A bandgap voltage reference is one of the core functional blocks in both analog and digital systems. Despite the reported improvements in performance of voltage references, little attention has been focused on theoretical characterizations of non-ideal effects on the value of the output voltage, on the inflection point location and on the curvature of the reference voltage. In this work, a systematic approach is proposed to analytically determine the effects of two non-ideal elements: the temperature dependent gain-determining resistors and the amplifier offset voltage. The effectiveness of the analytical models is validated by comparing analytical results against Spectre simulation results. Research on on-die temperature sensor design has received rapidly increasing attention since component and power density induced thermal stress has become a critical factor in the reliable operation of integrated circuits. For effective power and thermal management of future multi-core systems, hundreds of sensors with sufficient accuracy, small area and low power are required on a single chip. This work introduces a new family of highly linear on chip temperature sensors. The proposed family of temperature sensors expresses CMOS threshold voltage as an output. The sensor output is independent of power supply voltage and independent of mobility values. It can achieve very high temperature linearity, with maximum nonlinearity around +/- 0.05oC over a temperature range of -20oC to 100oC. A sizing strategy based on combined analytical analysis and numerical optimization has been presented. Following this method, three circuits A, B and C have been designed in standard 0.18 ym CMOS technology, all achieving excellent linearity as demonstrated by Cadence Spectre simulations. Circuits B and C are the modified versions of circuit A, and have improved performance at the worst corner-low voltage supply and high threshold voltage corner. Finally, a direct temperature-to-digital converter architecture is proposed as a master-slave hybrid temperature-to-digital converter. It does not require any traditional constant reference voltage or reference current, it does not attempt to make any node voltage or branch current constant or precisely linear to temperature, yet it generates a digital output code that is very linear with temperature

    Low-power CMOS digital-pixel Imagers for high-speed uncooled PbSe IR applications

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    This PhD dissertation describes the research and development of a new low-cost medium wavelength infrared MWIR monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapour phase deposition (VPD) PbSe-based medium wavelength IR (MWIR) detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. The work supports on the hypothesis that, by the use of the preceding design techniques, current standard inexpensive CMOS technologies fulfill all operational requirements of the VPD PbSe detector in terms of connectivity, reliability, functionality and scalability to integrate the device. The resulting monolithic PbSe-CMOS camera must consume very low power, operate at kHz frequencies, exhibit good uniformity and fit the CMOS read-out active pixels in the compact pitch of the focal plane, all while addressing the particular characteristics of the MWIR detector: high dark-to-signal ratios, large input parasitic capacitance values and remarkable mismatching in PbSe integration. In order to achieve these demands, this thesis proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation. The main aim is to potentiate the integration of PbSe-based infra-red (IR)-image sensing technologies so as to widen its use, not only in distinct scenarios, but also at different stages of PbSe-CMOS integration maturity. For this purpose, we posit to investigate a comprehensive set of functional blocks distributed in two parallel approaches: • Frame-based “Smart” MWIR imaging based on new DPS circuit topologies with gain and offset FPN correction capabilities. This research line exploits the detector pitch to offer fully-digital programmability at pixel level and complete functionality with input parasitic capacitance compensation and internal frame memory. • Frame-free “Compact”-pitch MWIR vision based on a novel DPS lossless analog integrator and configurable temporal difference, combined with asynchronous communication protocols inside the focal plane. This strategy is conceived to allow extensive pitch compaction and readout speed increase by the suppression of in-pixel digital filtering, and the use of dynamic bandwidth allocation in each pixel of the FPA. In order make the electrical validation of first prototypes independent of the expensive PbSe deposition processes at wafer level, investigation is extended as well to the development of affordable sensor emulation strategies and integrated test platforms specifically oriented to image read-out integrated circuits. DPS cells, imagers and test chips have been fabricated and characterized in standard 0.15μm 1P6M, 0.35μm 2P4M and 2.5μm 2P1M CMOS technologies, all as part of research projects with industrial partnership. The research has led to the first high-speed uncooled frame-based IR quantum imager monolithically fabricated in a standard VLSI CMOS technology, and has given rise to the Tachyon series [1], a new line of commercial IR cameras used in real-time industrial, environmental and transportation control systems. The frame-free architectures investigated in this work represent a firm step forward to push further pixel pitch and system bandwidth up to the limits imposed by the evolving PbSe detector in future generations of the device.La present tesi doctoral descriu la recerca i el desenvolupament d'una nova tecnologia monolítica d'imatgeria infraroja de longitud d'ona mitja (MWIR), no refrigerada i de baix cost, per a usos industrials d'alta velocitat. El treball pren el relleu dels últims avenços assolits pel soci industrial NIT S.L. en el camp dels detectors MWIR de PbSe depositats en fase vapor (VPD), afegint-hi coneixement fonamental en la investigació de noves tècniques de disseny de circuits VLSI analògics i mixtes pel desenvolupament del dispositiu integrat de lectura unit al detector pixelat. Es parteix de la hipòtesi que, mitjançant l'ús de les esmentades tècniques de disseny, les tecnologies CMOS estàndard satisfan tots els requeriments operacionals del detector VPD PbSe respecte a connectivitat, fiabilitat, funcionalitat i escalabilitat per integrar de forma econòmica el dispositiu. La càmera PbSe-CMOS resultant ha de consumir molt baixa potència, operar a freqüències de kHz, exhibir bona uniformitat, i encabir els píxels actius CMOS de lectura en el pitch compacte del pla focal de la imatge, tot atenent a les particulars característiques del detector: altes relacions de corrent d'obscuritat a senyal, elevats valors de capacitat paràsita a l'entrada i dispersions importants en el procés de fabricació. Amb la finalitat de complir amb els requisits previs, es proposen arquitectures de sensors de visió de molt baix acoblament interpíxel basades en l'ús d'una matriu de pla focal (FPA) de píxels actius exclusivament digitals. Cada píxel sensor digital (DPS) està equipat amb mòduls de comunicació d'alta velocitat, autopolarització, cancel·lació de l'offset, conversió analògica-digital (ADC) i correcció del soroll de patró fixe (FPN). El consum en cada cel·la es minimitza fent un ús exhaustiu del MOSFET operant en subllindar. L'objectiu últim és potenciar la integració de les tecnologies de sensat d'imatge infraroja (IR) basades en PbSe per expandir-ne el seu ús, no només a diferents escenaris, sinó també en diferents estadis de maduresa de la integració PbSe-CMOS. En aquest sentit, es proposa investigar un conjunt complet de blocs funcionals distribuïts en dos enfocs paral·lels: - Dispositius d'imatgeria MWIR "Smart" basats en frames utilitzant noves topologies de circuit DPS amb correcció de l'FPN en guany i offset. Aquesta línia de recerca exprimeix el pitch del detector per oferir una programabilitat completament digital a nivell de píxel i plena funcionalitat amb compensació de la capacitat paràsita d'entrada i memòria interna de fotograma. - Dispositius de visió MWIR "Compact"-pitch "frame-free" en base a un novedós esquema d'integració analògica en el DPS i diferenciació temporal configurable, combinats amb protocols de comunicació asíncrons dins del pla focal. Aquesta estratègia es concep per permetre una alta compactació del pitch i un increment de la velocitat de lectura, mitjançant la supressió del filtrat digital intern i l'assignació dinàmica de l'ample de banda a cada píxel de l'FPA. Per tal d'independitzar la validació elèctrica dels primers prototips respecte a costosos processos de deposició del PbSe sensor a nivell d'oblia, la recerca s'amplia també al desenvolupament de noves estratègies d'emulació del detector d'IR i plataformes de test integrades especialment orientades a circuits integrats de lectura d'imatge. Cel·les DPS, dispositius d'imatge i xips de test s'han fabricat i caracteritzat, respectivament, en tecnologies CMOS estàndard 0.15 micres 1P6M, 0.35 micres 2P4M i 2.5 micres 2P1M, tots dins el marc de projectes de recerca amb socis industrials. Aquest treball ha conduït a la fabricació del primer dispositiu quàntic d'imatgeria IR d'alta velocitat, no refrigerat, basat en frames, i monolíticament fabricat en tecnologia VLSI CMOS estàndard, i ha donat lloc a Tachyon, una nova línia de càmeres IR comercials emprades en sistemes de control industrial, mediambiental i de transport en temps real.Postprint (published version
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