State of the art in chip-to-chip interconnects

This thesis presents a study of short-range links for chips mounted in the same package, on printed circuit boards or interposers. Implemented in CMOS technology between 7 and 250 nm, with links that operate at a data rate between 0,4 and 112 Gb/s/pin and with energy efficiencies from 0,3 to 67,7 pJ/bit. The links operate on channels with an attenuation lower than 50 dB. A comparison is made with graphical representations between the different articles that shows the correlation between the different essential metrics of chip-to-chip interconnects, as well as its evolution over the last 20 years.Esta tesis presenta un estudio de enlaces de corto alcance para chips montados en un mismo paquete, en placas de circuito impreso o intercaladores. Implementado en tecnología CMOS entre 7 y 250 nm, con enlaces que operan a una velocidad de datos entre 0,4 y 112 Gb/s/pin y con eficiencias energéticas de 0,3 a 67,7 pJ/bit. Los enlaces operan en canales con una atenuación inferior a 50 dB. Se realiza una comparación con representaciones gráficas entre los diferentes artículos que muestra la correlación entre las distintas métricas esenciales de las interconexiones chip a chip, así como su evolución en los últimos 20 años.Aquesta tesi presenta un estudi d'enllaços de curt abast per a xips muntats en el mateix paquet, en plaques de circuits impresos o interposers. Implementat en tecnologia CMOS entre 7 i 250 nm, amb enllaços que funcionen a una velocitat de dades entre 0,4 i 112 Gb/s/pin i amb eficiències energètiques de 0,3 a 67,7 pJ/bit. Els enllaços funcionen en canals amb una atenuació inferior a 50 dB. Es fa una comparació amb representacions gràfiques entre els diferents articles que mostra la correlació entre les diferents mètriques essencials d'interconnexions xip a xip, així com la seva evolució en els darrers 20 anys

데이터 전송로 확장성과 루프 선형성을 향상시킨 다중채널 수신기들에 관한 연구

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2013. 2. 정덕균.Two types of serial data communication receivers that adopt a multichannel architecture for a high aggregate I/O bandwidth are presented. Two techniques for collaboration and sharing among channels are proposed to enhance the loop-linearity and channel-expandability of multichannel receivers, respectively. The first proposed receiver employs a collaborative timing scheme recovery which relies on the sharing of all outputs of phase detectors (PDs) among channels to extract common information about the timing and multilevel signaling architecture of PAM-4. The shared timing information is processed by a common global loop filter and is used to update the phase of the voltage-controlled oscillator with better rejection of per-channel noise. In addition to collaborative timing recovery, a simple linearization technique for binary PDs is proposed. The technique realizes a high-rate oversampling PD while the hardware cost is equivalent to that of a conventional 2x-oversampling clock and data recovery. The first receiver exploiting the collaborative timing recovery architecture is designed using 45-nm CMOS technology. A single data lane occupies a 0.195-mm2 area and consumes a relatively low 17.9 mW at 6 Gb/s at 1.0V. Therefore, the power efficiency is 2.98 mW/Gb/s. The simulated jitter is about 0.034 UI RMS given an input jitter value of 0.03 UI RMS, while the relatively constant loop bandwidth with the PD linearization technique is about 7.3-MHz regardless of the data-stream noise. Unlike the first receiver, the second proposed multichannel receiver was designed to reduce the hardware complexity of each lane. The receiver employs shared calibration logic among channels and yet achieves superior channel expandability with slim data lanes. A shared global calibration control, which is used in a forwarded clock receiver based on a multiphase delay-locked loop, accomplishes skew calibration, equalizer adaptation, and the phase lock of all channels during a calibration period, resulting in reduced hardware overhead and less area required by each data lane. The second forwarded clock receiver is designed in 90-nm CMOS technology. It achieves error-free eye openings of more than 0.5 UI across 9− 28 inch Nelco 4000-6 microstrips at 4− 7 Gb/s and more than 0.42 UI at data rates of up to 9 Gb/s. The data lane occupies only 0.152 mm2 and consumes 69.8 mW, while the rest of the receiver occupies 0.297 mm2 and consumes 56 mW at a data rate of 7 Gb/s and a supply voltage of 1.35 V.1. Introduction 1 1.1 Motivations 1.2 Thesis Organization 2. Previous Receivers for Serial-Data Communications 2.1 Classification of the Links 2.2 Clocking architecture of transceivers 2.3 Components of receiver 2.3.1 Channel loss 2.3.2 Equalizer 2.3.3 Clock and data recovery circuit 2.3.3.1. Basic architecture 2.3.3.2. Phase detector 2.3.3.2.1. Linear phase detector 2.3.3.2.2. Binary phase detector 2.3.3.3. Frequency detector 2.3.3.4. Charge pump 2.3.3.5. Voltage controlled oscillator and delay-line 2.3.4 Loop dynamics of PLL 2.3.5 Loop dynamics of DLL 3. The Proposed PLL-Based Receiver with Loop Linearization Technique 3.1 Introduction 3.2 Motivation 3.3 Overview of binary phase detection 3.4 The proposed BBPD linearization technique 3.4.1 Architecture of the proposed PLL-based receiver 3.4.2 Linearization technique of binary phase detection 3.4.3 Rotational pattern of sampling phase offset 3.5 PD gain analysis and optimization 3.6 Loop Dynamics of the 2nd-order CDR 3.7 Verification with the time-accurate behavioral simulation 3.8 Summary 4. The Proposed DLL-Based Receiver with Forwarded-Clock 4.1 Introduction 4.2 Motivation 4.3 Design consideration 4.4 Architecture of the proposed forwarded-clock receiver 4.5 Circuit description 4.5.1 Analog multi-phase DLL 4.5.2 Dual-input interpolating deley cells 4.5.3 Dedicated half-rate data samplers 4.5.4 Cherry-Hooper continuous-time linear equalizer 4.5.5 Equalizer adaptation and phase-lock scheme 4.6 Measurement results 5. Conclusion 6. BibliographyDocto

Architectural & circuit level techniques to improve energy efficiency of high speed serial links

High performance computing and communication are two key aspects of all information processing systems. With aggressive scaling of silicon technology enabling integration of a large number of transistors in a small area, managing power and thermal reliability has become very challenging. While lowering the power needed for performing computation has been the prime focus for decades, energy consumed for data transfer has recently become a major bottleneck especially in high performance applications. The focus of this thesis is on improving energy efficiency of communication links by exploring design techniques at both the architectural and circuit levels. In the first part of this work, we propose a time-based equalization scheme to implement transmit de-emphasis in voltage-mode output drivers. Using two-level pulse-width modulation, it overcomes the tradeoff between impedance matching, output swing, and de-emphasis resolution in conventional voltage-mode drivers. A prototype PWM-based 5$\,$Gb/s voltage-mode transmitter was implemented in a 90$\,$nm CMOS process and characterized across different channels and output swings to demonstrate the effectiveness of proposed techniques. The horizontal/vertical eye openings (BER=$\rm 10^{-12}$) at the ends of 60$\,$inch and 96$\,$inch stripline channels are 78$\,$mV/0.6$\,$UI and 8$\,$mV/0.3$\,$UI, respectively. This transmitter achieves an energy efficiency of 3.1$\,$mW/Gb/s while compensating for 16-28$\,$dB channel loss, which compares favorably with the state-of-the-art. In the second part, techniques to improve energy efficiency of a complete transceiver are presented. The transmitter employs a novel partially segmented voltage-mode output driver to lower power consumption in pre-drivers during 2-tap FIR equalization. The receiver implements a low power half-rate clock and data recovery with the proposed ring PLL based multi-phase sampling clock generation in CDR loop and charge-based sampling and deserialization. These techniques are verified using the measured results obtained from a 14Gb/s transceiver prototype. Transmitter achieves an energy efficiency of 0.89$\,$mW/Gb/s while securing a 0.36$\,$UI sampling time margin with $\rm{BER=10^{-12}}$ at the end of the channel with 11$\,$dB loss at Nyquist frequency. The receiver recovers sampling clock with 1.8$\,$$\rm{ps_{rms}}$ long term absolute jitter while recovering 14$\,$Gb/s data at $\rm{BER=10^{-12}}$. The receiver achieves an energy efficiency of 1.69$\,$mW/Gb/s. Transmitter and receiver share an LC PLL, which achieves 0.605$\,$$\rm{ps_{rms}}$ integrated jitter at 7$\,$GHz output with an energy efficiency of 0.5$\,$mW/GHz. The transceiver as a whole achieves an energy efficiency of 2.8$\,$mW/Gb/s

Millimeter-wave Communication and Radar Sensing — Opportunities, Challenges, and Solutions

With the development of communication and radar sensing technology, people are able to seek for a more convenient life and better experiences. The fifth generation (5G) mobile network provides high speed communication and internet services with a data rate up to several gigabit per second (Gbps). In addition, 5G offers great opportunities of emerging applications, for example, manufacture automation with the help of precise wireless sensing. For future communication and sensing systems, increasing capacity and accuracy is desired, which can be realized at millimeter-wave spectrum from 30 GHz to 300 GHz with several tens of GHz available bandwidth. Wavelength reduces at higher frequency, this implies more compact transceivers and antennas, and high sensing accuracy and imaging resolution. Challenges arise with these application opportunities when it comes to realizing prototype or demonstrators in practice. This thesis proposes some of the solutions addressing such challenges in a laboratory environment.High data rate millimeter-wave transmission experiments have been demonstrated with the help of advanced instrumentations. These demonstrations show the potential of transceiver chipsets. On the other hand, the real-time communication demonstrations are limited to either low modulation order signals or low symbol rate transmissions. The reason for that is the lack of commercially available high-speed analog-to-digital converters (ADCs); therefore, conventional digital synchronization methods are difficult to implement in real-time systems at very high data rates. In this thesis, two synchronous baseband receivers are proposed with carrier recovery subsystems which only require low-speed ADCs [A][B].Besides synchronization, high-frequency signal generation is also a challenge in millimeter-wave communications. The frequency divider is a critical component of a millimeter-wave frequency synthesizer. Having both wide locking range and high working frequencies is a challenge. In this thesis, a tunable delay gated ring oscillator topology is proposed for dual-mode operation and bandwidth extension [C]. Millimeter-wave radar offers advantages for high accuracy sensing. Traditional millimeter-wave radar with frequency-modulated continuous-wave (FMCW), or continuous-wave (CW), all have their disadvantages. Typically, the FMCW radar cannot share the spectrum with other FMCW radars.\ua0 With limited bandwidth, the number of FMCW radars that could coexist in the same area is limited. CW radars have a limited ambiguous distance of a wavelength. In this thesis, a phase-modulated radar with micrometer accuracy is presented [D]. It is applicable in a multi-radar scenario without occupying more bandwidth, and its ambiguous distance is also much larger than the CW radar. Orthogonal frequency-division multiplexing (OFDM) radar has similar properties. However, its traditional fast calculation method, fast Fourier transform (FFT), limits its measurement accuracy. In this thesis, an accuracy enhancement technique is introduced to increase the measurement accuracy up to the micrometer level [E]

Clocking and Skew-Optimization For Source-Synchronous Simultaneous Bidirectional Links

There is continuous expansion of computing capabilities in mobile devices which demands higher I/O bandwidth and dense parallel links supporting higher data rates. Highspeed signaling leverages technology advancements to achieve higher data rates but is limited by the bandwidth of the electrical copper channel which have not scaled accordingly. To meet the continuous data-rate demand, Simultaneous Bi-directional (SBD) signaling technique is an attractive alternative relative to uni-directional signaling as it can work at lower clock speeds, exhibits better spectral efficiency and provides higher throughput in pad limited PCBs. For low-power and more robust system, the SBD transceiver should utilize forwarded clock system and per-pin de-skew circuits to correct the phase difference developed between the data and clock. The system can be configured in two roles, master and slave. To save more power, the system should have only one clock generator. The master has its own clock source and shares its clock to the slave through the clock channel, and the slave uses this forwarded clock to deserialize the inbound data and serialize the outbound data. A clock-to-data skew exists which can be corrected with a phase tracking CDR. This thesis presents a low-power implementation of forwarded clocking and clock-to-data skew optimization for a 40 Gbps SBD transceiver. The design is implemented in 28nm CMOS technology and consumes 8.8mW of power for 20 Gbps NRZ data at 0.9 V supply. The area occupied by the clocking 0.018 mm^2 area

A 2-40 Gb/s PAM4/NRZ dual-mode wireline transmitter with 4:1 MUX in 65-nm CMOS

This paper presents a 2-40 Gb/s dual-mode wireline transmitter supporting the four-level pulse amplitude modulation (PAM4) and non-return-to-zero (NRZ) modulation with a multiplexer (MUX)-based two-tap feed-forward equalizer (FFE). An edge-acceleration technique is proposed for the 4:1 MUX to increase the bandwidth. By utilizing a dedicated cascode current source, the output swing can achieve 900 mV with a level deviation of only 0.12% for PAM4. Fabricated in a 65-nm CMOS process, the transmitter consumes 117 mW and 89 mW at 40 Gb/s in PAM4 and NRZ at 1.2 V supply. © 2018, Institute of Electronics Engineers of Korea. All rights reserved

오프셋 제거기의 적응 제어 등화기와 보우-레이트 위상 검출기를 활용한 수신기 설계

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2021.8. 염제완.In this thesis, designs of high-speed, low-power wireline receivers (RX) are explained. To be specific, the circuit techniques of DC offset cancellation, merged-summer DFE, stochastic Baud-rate CDR, and the phase detector (PD) for multi-level signal are proposed. At first, an RX with adaptive offset cancellation (AOC) and merged summer decision-feedback equalizer (DFE) is proposed. The proposed AOC engine removes the random DC offset of the data path by examining the random data stream's sampled data and edge outputs. In addition, the proposed RX incorporates a shared-summer DFE in a half-rate structure to reduce power dissipation and hardware complexity of the adaptive equalizer. A prototype chip fabricated in 40 nm CMOS technology occupies an active area of 0.083 mm2. Thanks to the AOC engine, the proposed RX achieves the BER of less than 10-12 in a wide range of data rates: 1.62-10 Gb/s. The proposed RX consumes 18.6 mW at 10 Gb/s over a channel with a 27 dB loss at 5 GHz, exhibiting a figure-of-merit of 0.068 pJ/b/dB. Secondly, a 40 nm CMOS RX with Baud-rate phase-detector (BRPD) is proposed. The RX includes two PDs: the BRPD employing the stochastic technique and the BRPD suitable for multi-level signals. Thanks to the Baud-rate CDR’s advantage, by not using an edge-sampling clock, the proposed CDR can reduce the power consumption by lowering the hardware complexity. Besides, the proposed stochastic phase detector (SPD) tracks an optimal phase-locking point that maximizes the vertical eye opening. Furthermore, despite residual inter-symbol interference, proposed BRPD for multi-level signal secures vertical eye margin, which is especially vulnerable in the multi-level signal. Besides, the proposed BRPD has a unique lock point with an adaptive DFE, unlike conventional Mueller-Muller PD. A prototype chip fabricated in 40 nm CMOS technology occupies an active area of 0.24 mm2. The proposed PAM-4 RX achieves the bit-error-rate less than 10-11 in 48 Gb/s and the power efficiency of 2.42 pJ/b.본 논문은 고속, 저전력으로 동작하는 유선 수신기의 설계에 대해 설명하고 있다. 구체적으로 말하면, 오프셋 상쇄, 병합된 서머를 사용하는 결정 피드백 등화기 기술, 확률적 보우 레이트 클럭과 데이터 복원기, 그리고 다중 레벨 신호에 적합한 위상 검출기를 제안한다. 첫째로, 적응 오프셋 제거 및 병합된 서머를 사용하는 결정 피드백 등화기를 갖춘 수신기를 제안한다. 제안된 적응 오프셋 제거 엔진은 임의의 데이터 스트림의 샘플링 데이터, 에지 출력을 검사하여 데이터 경로 상의 오프셋을 제거한다. 또한 하프 레이트 구조의 병합된 서머를 사용하는 결정 피드백 등화기는 전력의 사용과 하드웨어의 복잡성을 줄인다. 40 nm CMOS 기술로 제작된 프로토타입 칩은 0.083 mm2 의 면적을 가진다. 적응 오프셋 제거기 덕분에 제안된 수신기는 10-12 미만의 BER을 달성한다. 또한 제안된 수신기는 5GHz에서 27 dB의 로스를 갖는 채널에서 10 Gb/s의 속도에서 18.6 mW를 소비하며 0.068 pJ/b/dB의 FoM을 달성하였다. 두번째로, 보우 레이트 위상 검출기가 있는 40 nm CMOS 수신기가 제안되었다. 수신기에는 두개의 보우 레이트 위상 검출기를 포함한다. 하나는 확률론적 기법을 사용하는 보우 레이트 위상 검출기이다. 보우 레이트 클럭 데이터 복원기의 장점 덕분에 에지 샘플링 클럭을 사용하지 않음으로서 파워의 소모와 하드웨어의 복잡성을 줄였다. 또한 확률적 위상 검출기는 수직 아이 오프닝을 최대화하는 최적의 위상 지점을 찾을 수 있었다. 다른 위상 검출기는 다중 레벨 신호에 적합한 방식이다. 심볼 간 간섭이 다중 레벨 신호에 매우 취약한 문제가 있더라도 제안된 다중 레벨 신호용 보우 레이트 위상 검출기는 수직 아이 마진을 확보한다. 게다가 제안된 보우 레이트 위상 검출기는 기존의 뮬러-뮐러 위상 검출기와 달리 적응형 결정 피드백 등화기가 있더라도 유일한 락 지점을 갖는다. 프로토타입 칩은 0.24mm2의 면적을 가진다. 제안된 PAM-4 수신기는 48 Gb/s의 속도에서 10-11 미만의 BER을 가지고, 2.42 pJ/b의 FoM을 가진다.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 5 CHAPTER 2 BACKGROUNDS 6 2.1 BASIC ARCHITECTURE IN SERIAL LINK 6 2.1.1 SERIAL COMMUNICATION 6 2.1.2 CLOCK AND DATA RECOVERY 8 2.1.3 MULTI-LEVEL PULSE-AMPLITUDE MODULATION 10 2.2 EQUALIZER 12 2.2.1 EQUALIZER OVERVIEW 12 2.2.2 DECISION-FEEDBACK EQUALIZER 15 2.2.3 ADAPTIVE EQUALIZER 18 2.3 CLOCK RECOVERY 21 2.3.1 2X OVERSAMPLING PD ALEXANDER PD 22 2.3.2 BAUD-RATE PD MUELLER MULLER PD 25 CHAPTER 3 AN ADAPTIVE OFFSET CANCELLATION SCHEME AND SHARED SUMMER ADAPTIVE DFE 28 3.1 OVERVIEW 28 3.2 AN ADAPTIVE OFFSET CANCELLATION SCHEME AND SHARED-SUMMER ADAPTIVE DFE FOR LOW POWER RECEIVER 31 3.3 SHARED SUMMER DFE 37 3.4 RECEIVER IMPLEMENTATION 42 3.5 MEASUREMENT RESULTS 45 CHAPTER 4 PAM-4 BAUD-RATE DIGITAL CDR 51 4.1 OVERVIEW 51 4.2 OVERALL ARCHITECTURE 53 4.2.1 PROPOSED BAUD-RATE CDR ARCHITECTURE 53 4.2.2 PROPOSED ANALOG FRONT-END STRUCTURE 59 4.3 STOCHASTIC PHASE DETECTION PAM-4 CDR 64 4.3.1 PROPOSED STOCHASTIC PHASE DETECTION 64 4.3.2 COMPARISON OF THE STOCHASTIC PD WITH SS-MMPD 70 4.4 PHASE DETECTION FOR MULTI-LEVEL SIGNALING 73 4.4.1 PROPOSED BAUD-RATE PHASE DETECTOR FOR MULTI-LEVEL SIGNAL 73 4.4.2 DATA LEVEL AND DFE COEFFICIENT ADAPTATION 79 4.4.3 PROPOSED PHASE DETECTOR 84 4.5 MEASUREMENT RESULT 88 4.5.1 MEASUREMENT OF THE PROPOSED STOCHASTIC BAUD-RATE PHASE DETECTION 94 4.5.2 MEASUREMENT OF THE PROPOSED BAUD-RATE PHASE DETECTION FOR MULTI-LEVEL SIGNAL 97 CHAPTER 5 CONCLUSION 103 BIBLIOGRAPHY 105 초 록 109박

Toward realizing power scalable and energy proportional high-speed wireline links

Growing computational demand and proliferation of cloud computing has placed high-speed serial links at the center stage. Due to saturating energy efficiency improvements over the last five years, increasing the data throughput comes at the cost of power consumption. Conventionally, serial link power can be reduced by optimizing individual building blocks such as output drivers, receiver, or clock generation and distribution. However, this approach yields very limited efficiency improvement. This dissertation takes an alternative approach toward reducing the serial link power. Instead of optimizing the power of individual building blocks, power of the entire serial link is reduced by exploiting serial link usage by the applications. It has been demonstrated that serial links in servers are underutilized. On average, they are used only 15% of the time, i.e. these links are idle for approximately 85% of the time. Conventional links consume power during idle periods to maintain synchronization between the transmitter and the receiver. However, by powering-off the link when idle and powering it back when needed, power consumption of the serial link can be scaled proportionally to its utilization. This approach of rapid power state transitioning is known as the rapid-on/off approach. For the rapid-on/off to be effective, ideally the power-on time, off-state power, and power state transition energy must all be close to zero. However, in practice, it is very difficult to achieve these ideal conditions. Work presented in this dissertation addresses these challenges. When this research work was started (2011-12), there were only a couple of research papers available in the area of rapid-on/off links. Systematic study or design of a rapid power state transitioning in serial links was not available in the literature. Since rapid-on/off with nanoseconds granularity is not a standard in any wireline communication, even the popular test equipment does not support testing any such feature, neither any formal measurement methodology was available. All these circumstances made the beginning difficult. However, these challenges provided a unique opportunity to explore new architectural techniques and identify trade-offs. The key contributions of this dissertation are as follows. The first and foremost contribution is understanding the underlying limitations of saturating energy efficiency improvements in serial links and why there is a compelling need to find alternative ways to reduce the serial link power. The second contribution is to identify potential power saving techniques and evaluate the challenges they pose and the opportunities they present. The third contribution is the design of a 5Gb/s transmitter with a rapid-on/off feature. The transmitter achieves rapid-on/off capability in voltage mode output driver by using a fast-digital regulator, and in the clock multiplier by accurate frequency pre-setting and periodic reference insertion. To ease timing requirements, an improved edge replacement logic circuit for the clock multiplier is proposed. Mathematical modeling of power-on time as a function of various circuit parameters is also discussed. The proposed transmitter demonstrates energy proportional operation over wide variations of link utilization, and is, therefore, suitable for energy efficient links. Fabricated in 90nm CMOS technology, the voltage mode driver, and the clock multiplier achieve power-on-time of only 2ns and 10ns, respectively. This dissertation highlights key trade-off in the clock multiplier architecture, to achieve fast power-on-lock capability at the cost of jitter performance. The fourth contribution is the design of a 7GHz rapid-on/off LC-PLL based clock multi- plier. The phase locked loop (PLL) based multiplier was developed to overcome the limita- tions of the MDLL based approach. Proposed temperature compensated LC-PLL achieves power-on-lock in 1ns. The fifth and biggest contribution of this dissertation is the design of a 7Gb/s embedded clock transceiver, which achieves rapid-on/off capability in LC-PLL, current-mode transmit- ter and receiver. It was the first reported design of a complete transceiver, with an embedded clock architecture, having rapid-on/off capability. Background phase calibration technique in PLL and CDR phase calibration logic in the receiver enable instantaneous lock on power-on. The proposed transceiver demonstrates power scalability with a wide range of link utiliza- tion and, therefore, helps in improving overall system efficiency. Fabricated in 65nm CMOS technology, the 7Gb/s transceiver achieves power-on-lock in less than 20ns. The transceiver achieves power scaling by 44x (63.7mW-to-1.43mW) and energy efficiency degradation by only 2.2x (9.1pJ/bit-to-20.5pJ/bit), when the effective data rate (link utilization) changes by 100x (7Gb/s-to-70Mb/s). The sixth and final contribution is the design of a temperature sensor to compensate the frequency drifts due to temperature variations, during long power-off periods, in the fast power-on-lock LC-PLL. The proposed self-referenced VCO-based temperature sensor is designed with all digital logic gates and achieves low supply sensitivity. This sensor is suitable for integration in processor and DRAM environments. The proposed sensor works on the principle of directly converting temperature information to frequency and finally to digital bits. A novel sensing technique is proposed in which temperature information is acquired by creating a threshold voltage difference between the transistors used in the oscillators. Reduced supply sensitivity is achieved by employing junction capacitance, and the overhead of voltage regulators and an external ideal reference frequency is avoided. The effect of VCO phase noise on the sensor resolution is mathematically evaluated. Fabricated in the 65nm CMOS process, the prototype can operate with a supply ranging from 0.85V to 1.1V, and it achieves a supply sensitivity of 0.034oC/mV and an inaccuracy of ±0.9oC and ±2.3oC from 0-100oC after 2-point calibration, with and without static nonlinearity correction, respectively. It achieves a resolution of 0.3oC, resolution FoM of 0.3(nJ/conv)res2 , and measurement (conversion) time of 6.5μs

Design Techniques for Energy Efficient Multi-GB/S Serial I/O Transceivers

Total I/O bandwidth demand is growing in high-performance systems due to the emergence of many-core microprocessors and in mobile devices to support the next generation of multi-media features. High-speed serial I/O energy efficiency must improve in order to enable continued scaling of these parallel computing platforms in applications ranging from data centers to smart mobile devices. The first work, a low-power forwarded-clock I/O transceiver architecture is presented that employs a high degree of output/input multiplexing, supply-voltage scaling with data rate, and low-voltage circuit techniques to enable low-power operation. The transmitter utilizes a 4:1 output multiplexing voltage-mode driver along with 4-phase clocking that is efficiently generated from a passive poly-phase filter. The output driver voltage swing is accurately controlled from 100-200 mV_(ppd) using a low-voltage pseudo-differential regulator that employs a partial negative-resistance load for improved low frequency gain. 1:8 input de-multiplexing is performed at the receiver equalizer output with 8 parallel input samplers clocked from an 8-phase injection-locked oscillator that provides more than 1UI de-skew range. Low-power high-speed serial I/O transmitters which include equalization to compensate for channel frequency dependent loss are required to meet the aggressive link energy efficiency targets of future systems. The second work presents a low power serial link transmitter design that utilizes an output stage which combines a voltage-mode driver, which offers low static-power dissipation, and current-mode equalization, which offers low complexity and dynamic-power dissipation. The utilization of current-mode equalization decouples the equalization settings and termination impedance, allowing for a significant reduction in pre-driver complexity relative to segmented voltage-mode drivers. Proper transmitter series termination is set with an impedance control loop which adjusts the on-resistance of the output transistors in the driver voltage-mode portion. Further reductions in dynamic power dissipation are achieved through scaling the serializer and local clock distribution supply with data rate. Finally, it presents that a scalable quarter-rate transmitter employs an analog-controlled impedance-modulated 2-tap voltage-mode equalizer and achieves fast power-state transitioning with a replica-biased regulator and ILO clock generation. Capacitively-driven 2 mm global clock distribution and automatic phase calibration allows for aggressive supply scaling

Development of Silicon Photonic Multi Chip Module Transceivers

The exponential growth of data generation–driven in part by the proliferation of applications such as high definition streaming, artificial intelligence, and the internet of things–presents an impending bottleneck for electrical interconnects to fulfill data center bandwidth demands. Links now require bandwidths in excess of multiple Tbps while operating on the order of picojoules per bit, in addition to constraints on areal bandwidth densities and pin I/O bandwidth densities. Optical communications built on a silicon photonic platform offers a potential solution to develop power efficient, high bandwidth, low attenuation, small footprint links, all while building off the mature CMOS ecosystem. The development of silicon photonic foundries supporting multi project wafer runs with associated process design kit components supports a path towards widespread commercial production by increasing production volume while reducing fabrication and development costs. While silicon photonics can always be improved in terms of performance and yield, one of the central challenges is the integration of the silicon photonic integrated circuits with the driving electronic integrated circuits and data generating compute nodes such as CPUs, FPGAs, and ASICs. The co-packaging of the photonics with the electronics is crucial for adoption of silicon photonics in datacenters, as improper integration negates all the potential benefits of silicon photonics. The work in this dissertation is centered around the development of silicon photonic multi chip module transceivers to aid in the deployment of silicon photonics within data centers. Section one focuses on silicon photonic integration and highlights multiple integrated transceiver prototypes. The central prototype features a photonic integrated circuit with bus waveguides with WDM microdisk modulators for the transmitter and WDM demuxes with drop ports to photodiodes for the receiver. The 2.5D integrated prototype utilizes a thinned silicon interposer and TIA electronic integrated circuits. The architecture, integration, characterization, performance, and scalability of the prototype are discussed. The development of this first prototype identified key design considerations necessary for designing multi chip module silicon photonic prototypes, which will be addressed in this section. Finally, other multi chip module silicon photonic prototypes will be overviewed. These include a 2.5D integrated transceiver with a different electronic integrated circuit TIA, a 3D integrated receiver, an active interposer network on chip, and a 2.5D integrated transceiver with custom electronic integrated circuits. Section two focuses on research that supports the development of silicon photonic transceivers. The thermal crosstalk from neighboring microdisk modulators as a function of modulator pitch is investigated. As modulators are placed at denser pitches to accommodate areal bandwidth density requirements in transceivers, this thermal crosstalk will become significant. In this section, designs and results from several iterations of custom microring modulators are reported. Custom microring modulators allow for scaling up the number of channels in microring transceivers by offering the ability to fabricate variable resonances and provide a platform for further innovation in bandwidth, free spectral range, and energy efficiency. The designs and results of higher order modulation format modulators, both microring based and Mach Zehnder based, are discussed. High order modulators offer a path towards scaling transceiver total throughput without having to increase the channel counts or component bandwidth. Together, the work in these two sections supports the development of silicon photonic transceivers to aid in the adoption of silicon photonics into data generating systems