399 research outputs found

    High-accuracy switched-capacitor techniques applied to filter and ADC design

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    Robust sigma delta converters : and their application in low-power highly-digitized flexible receivers

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    In wireless communication industry, the convergence of stand-alone, single application transceiver IC’s into scalable, programmable and platform based transceiver ICs, has led to the possibility to create sophisticated mobile devices within a limited volume. These multi-standard (multi-mode), MIMO, SDR and cognitive radios, ask for more adaptability and flexibility on every abstraction level of the transceiver. The adaptability and flexibility of the receive paths require a digitized receiver architecture in which most of the adaptability and flexibility is shifted in the digital domain. This trend to ask for more adaptability and flexibility, but also more performance, higher efficiency and an increasing functionality per volume, has a major impact on the IP blocks such systems are built with. At the same time the increasing requirement for more digital processing in the same volume and for the same power has led to mainstream CMOS feature size scaling, leading to smaller, faster and more efficient transistors, optimized to increase processing efficiency per volume (smaller area, lower power consumption, faster digital processing). As wireless receivers is a comparably small market compared to digital processors, the receivers also have to be designed in a digitally optimized technology, as the processor and transceiver are on the same chip to reduce device volume. This asks for a generalized approach, which maps application requirements of complex systems (such as wireless receivers) on the advantages these digitally optimized technologies bring. First, the application trends are gathered in five quality indicators being: (algorithmic) accuracy, robustness, flexibility, efficiency, and emission, of which the last one is not further analyzed in this thesis. Secondly, using the quality indicators, it is identified that by introducing (or increasing) digitization at every abstraction level of a system, the advantages of modern digitally optimized technologies can be exploited. For a system on a chip, these abstraction levels are: system/application level, analog IP architecture level, circuit topology level and layout level. In this thesis, the quality indicators together with the digitization at different abstraction levels are applied to S¿ modulators. S¿ modulator performance properties are categorized into the proposed quality indicators. Next, it is identified what determines the accuracy, robustness, flexibility and efficiency of a S¿ modulator. Important modulator performance parameters, design parameter relations, and performance-cost relations are derived. Finally, several implementations are presented, which are designed using the found relations. At least one implementation example is shown for each level of digitization. At system level, a flexible (N)ZIF receiver architecture is digitized by shifting the ADC closer to the antenna, reducing the amount of analog signal conditioning required in front of the ADC, and shifting the re-configurability of such a receiver into the digital domain as much as possible. Being closer to the antenna, and because of the increased receiver flexibility, a high performance, multi-mode ADC is required. In this thesis, it is proven that such multi-mode ADCs can be made at low area and power consumption. At analog IP architecture level, a smarter S¿ modulator architecture is found, which combines the advantages of 1-bit and multi-bit modulators. The analog loop filter is partly digitized, and analog circuit blocks are replaced by a digital filter, leading to an area and power efficient design, which above all is very portable, and has the potential to become a good candidate for the ADC in multimode receivers. At circuit and layout level, analog circuits are designed in the same way as digital circuits are. Analog IP blocks are split up in analog unit cells, which are put in a library. For each analog unit cell, a p-cell layout view is created. Once such a library is available, different IP blocks can be created using the same unit cells and using the automatic routing tools normally used for digital circuits. The library of unit cells can be ported to a next technology very quickly, as the unit cells are very simple circuits, increasing portability of IP blocks made with these unit cells. In this thesis, several modulators are presented that are designed using this digital design methodology. A high clock frequency in the giga-hertz range is used to test technology speed. The presented modulators have a small area and low power consumption. A modulator is ported from a 65nm to a 45nm technology in one month without making changes to the unit cells, or IP architecture, proving that this design methodology leads to very portable designs. The generalized system property categorization in quality indicators, and the digitization at different levels of system design, is named the digital design methodology. In this thesis this methodology is successfully applied to S¿ modulators, leading to high quality, mixed-signal S¿ modulator IP, which is more accurate, more robust, more flexible and/or more efficient

    Breadboard linear array scan imager using LSI solid-state technology

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    The performance of large scale integration photodiode arrays in a linear array scan (pushbroom) breadboard was evaluated for application to multispectral remote sensing of the earth's resources. The technical approach, implementation, and test results of the program are described. Several self scanned linear array visible photodetector focal plane arrays were fabricated and evaluated in an optical bench configuration. A 1728-detector array operating in four bands (0.5 - 1.1 micrometer) was evaluated for noise, spectral response, dynamic range, crosstalk, MTF, noise equivalent irradiance, linearity, and image quality. Other results include image artifact data, temporal characteristics, radiometric accuracy, calibration experience, chip alignment, and array fabrication experience. Special studies and experimentation were included in long array fabrication and real-time image processing for low-cost ground stations, including the use of computer image processing. High quality images were produced and all objectives of the program were attained

    A 12-bit, 40 msamples/s, low-power, low-area pipeline analog-to-digital converter in CMOS 0.18 mum technology.

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    With advancements in digital signal processing in recent years, the need for high-speed, high-resolution analog-to-digital converters (ADCs) which can be used in the analog front-end has been increasing. Some examples of these applications are image and video signal processing, wireless communications and asymmetrical digital subscriber line (ADSL). In CMOS integrated circuit design, it is desirable to integrate the digital circuit and the ADC in one microchip to reduce the cost of fabrication. Consequently the power dissipation and area of the ADCs are important design factors. The original contributions in this thesis are as follows. Since the performance of pipeline ADCs significantly depends on the op-amps and comparators circuits, the performance of various comparators is analyzed and the effect of op-amp topology on the performance of pipeline ADCs is investigated. This thesis also presents a novel architecture for design of low-power and low-area pipelined ADCs which will be more useful for very low voltage applications in the future. At the schematic level, a low-power CMOS implementation of the current-mode MDAC is presented and an improved voltage comparator is designed. With the proposed design and the optimization methodology it is possible to reduce power dissipation and area compared with conventional fully differential schemes.Dept. of Electrical and Computer Engineering. Paper copy at Leddy Library: Theses & Major Papers - Basement, West Bldg. / Call Number: Thesis2004 .M64. Source: Masters Abstracts International, Volume: 43-01, page: 0281. Adviser: C. Chen. Thesis (M.A.Sc.)--University of Windsor (Canada), 2004

    Single-chip CMOS tracking image sensor for a complex target

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    Semiconductor-technology exploration : getting the most out of the MOST

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    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

    Analysis and design of wideband voltage controlled oscillators using self-oscillating active inductors.

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    Voltage controlled oscillators (VCOs) are essential components of RF circuits used in transmitters and receivers as sources of carrier waves with variable frequencies. This, together with a rapid development of microelectronic circuits, led to an extensive research on integrated implementations of the oscillator circuits. One of the known approaches to oscillator design employs resonators with active inductors electronic circuits simulating the behavior of passive inductors using only transistors and capacitors. Such resonators occupy only a fraction of the silicon area necessary for a passive inductor, and thus allow to use chip area more eectively. The downsides of the active inductor approach include: power consumption and noise introduced by transistors. This thesis presents a new approach to active inductor oscillator design using selfoscillating active inductor circuits. The instability necessary to start oscillations is provided by the use of a passive RC network rather than a power consuming external circuit employed in the standard oscillator approach. As a result, total power consumption of the oscillator is improved. Although, some of the active inductors with RC circuits has been reported in the literature, there has been no attempt to utilise this technique in wideband voltage controlled oscillator design. For this reason, the dissertation presents a thorough investigation of self-oscillating active inductor circuits, providing a new set of design rules and related trade-os. This includes: a complete small signal model of the oscillator, sensitivity analysis, large signal behavior of the circuit and phase noise model. The presented theory is conrmed by extensive simulations of wideband CMOS VCO circuit for various temperatures and process variations. The obtained results prove that active inductor oscillator performance is obtained without the use of standard active compensation circuits. Finally, the concept of self-oscillating active inductor has been employed to simple and fast OOK (On-Off Keying) transmitter showing energy eciency comparable to the state of the art implementations reported in the literature
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