125 research outputs found

    A Novel Transparent UWB Antenna for Photovoltaic Solar Panel Integration and RF Energy Harvesting

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    A novel transparent ultra-wideband antenna for photovoltaic solar-panel integration and RF energy harvesting is proposed in this paper. Since the approval by the Federal Communications Committee (FCC) in 2002, much research has been undertaken on UWB technology, especially for wireless communications. However, in the last decade, UWB has also been proposed as a power harvester. In this paper, a transparent cone-top-tapered slot antenna covering the frequency range from 2.2 to 12.1 GHz is designed and fabricated to provide UWB communications whilst integrated onto solar panels as well as harvest electromagnetic waves from free space and convert them into electrical energy. The antenna when sandwiched between an a-Si solar panel and glass is able to demonstrate a quasi omni-directional pattern that is characteristic of a UWB. The antenna when connected to a 2.55-GHz rectifier is able to produce 18-mV dc in free space and 4.4-mV dc on glass for an input power of 10 dBm at a distance of 5 cm. Although the antenna presented in this paper is a UWB antenna, only an operating range of 2.49 to 2.58 GHz for power scavenging is possible due to the limitation of the narrowband rectifier used for the study

    A Review on Antenna Technologies for Ambient RF Energy Harvesting and Wireless Power Transfer: Designs, Challenges and Applications

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    Radio frequency energy harvesting (RFEH) and wireless power transmission (WPT) are two emerging alternative energy technologies that have the potential to offer wireless energy delivery in the future. One of the key components of RFEH or WPT system is the receiving antenna. The receiving antenna's performance has a considerable impact on the power delivery capability of an RFEH or WPT system. This paper provides a well-rounded review of recent advancements of receiving antennas for RFEH and WPT. Antennas discussed in this paper are categorized as low-profile antennas, multi-band antennas, circularly polarized antennas, and array antennas. A number of contemporary antennas from each category are presented, compared, and discussed with particular emphasis on design approach and performance. Current design and fabrication challenges, future development, open research issues of the antennas and visions for RFEH and WPT are also discussed in this review

    Inkjet-printed sensors and via-enabled structures for low-cost autonomous wireless platforms

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    Fundamental research to implement the printed autonomous wireless sensor platform is studied in three aspects: fabrication method, material selection, and novel applications for autonomous sensing/communication. Additive fabrication processes, such as inkjet printing technology and electroless electroplating, are discussed and the additively created metal layers are characterized. Fundamentals for material characterization utilizing resonators are presented and electrical properties of flexible low-cost substrates like synthetic Teslin paper and Poly(methyl methacrylate) (PMMA) are characterized. Widely used flexible substrates for printing, such as Liquid Crystal Polymer (LCP) and Kapton (polyimide), are summarized and tabulated as well. Novel antenna-based applications for efficient and autonomous operation of wireless sensor system, such as an antenna on Artificial Magnetic Conductor (AMC) for wearable applications, an active beacon oscillator for Wireless Power Transfer (WPT), and a multiband RF energy harvester, are designed and their performances are experimentally verified. The printed RFID-enabled sensor topologies with/without RFID chip are discussed as a new sensor platform for autonomous wireless operation. Fully inkjet-printed via topology for system miniaturization and integration is proposed for the first time. Challenges, circuit modeling and experimental data are presented. Future and remaining work to implement the novel low-cost autonomous wireless sensor platform are also discussed.Ph.D

    Wideband and UWB antennas for wireless applications. A comprehensive review

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    A comprehensive review concerning the geometry, the manufacturing technologies, the materials, and the numerical techniques, adopted for the analysis and design of wideband and ultrawideband (UWB) antennas for wireless applications, is presented. Planar, printed, dielectric, and wearable antennas, achievable on laminate (rigid and flexible), and textile dielectric substrates are taken into account. The performances of small, low-profile, and dielectric resonator antennas are illustrated paying particular attention to the application areas concerning portable devices (mobile phones, tablets, glasses, laptops, wearable computers, etc.) and radio base stations. This information provides a guidance to the selection of the different antenna geometries in terms of bandwidth, gain, field polarization, time-domain response, dimensions, and materials useful for their realization and integration in modern communication systems

    Integration of conductive materials with textile structures : an overview

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    In the last three decades, the development of new kinds of textiles, so-called smart and interactive textiles, has continued unabated. Smart textile materials and their applications are set to drastically boom as the demand for these textiles has been increasing by the emergence of new fibers, new fabrics, and innovative processing technologies. Moreover, people are eagerly demanding washable, flexible, lightweight, and robust e-textiles. These features depend on the properties of the starting material, the post-treatment, and the integration techniques. In this work, a comprehensive review has been conducted on the integration techniques of conductive materials in and onto a textile structure. The review showed that an e-textile can be developed by applying a conductive component on the surface of a textile substrate via plating, printing, coating, and other surface techniques, or by producing a textile substrate from metals and inherently conductive polymers via the creation of fibers and construction of yarns and fabrics with these. In addition, conductive filament fibers or yarns can be also integrated into conventional textile substrates during the fabrication like braiding, weaving, and knitting or as a post-fabrication of the textile fabric via embroidering. Additionally, layer-by-layer 3D printing of the entire smart textile components is possible, and the concept of 4D could play a significant role in advancing the status of smart textiles to a new level

    Additively Manufactured RF Components, Packaging, Modules, and Flexible Modular Phased Arrays Enabling Widespread Massively Scalable mmWave/5G Applications

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    The 5G era is here and with it comes many challenges, particularily facing the high frequency mmWave adoption. This is because of the cost to implement such dense networks is much greater due to the high propagation losses of signals that range from 26 GHz to 40 GHz. Therefore there needs to be a way to utilize a method of fabrication that can change with the various environments that 5G will be deployed in, be it dense urban areas or suburban sprawl. In this research, the focus is on making these RF components utilized for 5G at low cost and modular with a focus on additive manufacturing. Since additive manufacturing is a rapid prototyping technique, the technology can be quickly adjusted and altered to meet certain specifications with negligible overhead. Several areas of research will be explored. Firstly, various RF passive components such as additively manufactured antennas and couplers with a combination hybrid inkjet and 3D printing will be discussed. Passive components are critical for evaluating the process of additive manufacturing for high frequency operation. Secondly, various structures will be evaluated specifically for packaging mmWave ICs, including interconnects, smart packaging and encapsulants for use in single or multichip modules. Thirdly, various antenna fabrication techniques will be explored which enables fully integrated ICs with antennas, called System on Antenna (SoA) which utilizes both inkjet and 3D printing to combine antennas and ICs into modules. These modules, can then be built into arrays in a modular fashion, allowing for large or smaller arrays to be assembled on the fly. Finally, a method of calibrating the arrays is introduced, utilizing inkjet printed sensors. This allows the sensor to actively detect bends and deformations in the array and restore optimal antenna array performance. Built for flexible phased arrays, the sensor is designed for implementation for ubiquitous use, meaning that its can be placed on any surface, which enables widespread use of 5G technologies.Ph.D

    Low-profile dual-band pixelated defected ground antenna for multistandard IoT devices.

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    A low-profile dual-band pixelated defected ground antenna has been proposed at 3.5 GHz and 5.8 GHz bands. This work presents a flexible design guide for achieving single-band and dual-band antenna using pixelated defected ground (PDG). The unique pixelated defected ground has been designed using the binary particle swarm optimization (BPSO) algorithm. Computer Simulation Technology Microwave Studio incorporated with Matlab has been utilized in the antenna design process. The PDG configuration provides freedom of exploration to achieve the desired antenna performance. Compact antenna design can be achieved by making the best use of designated design space on the defected ground (DG) plane. Further, a V-shaped transfer function based on BPSO with fast convergence allows us to efficiently implement the PDG technique. In the design procedure, pixelization is applied to a small rectangular region of the ground plane. The square pixels on the designated defected ground area of the antenna have been formed using a binary bit string, consisting of 512 bits taken during each iteration of the algorithm. The PDG method is concerned with the shape of the DG and does not rely on the geometrical dimension analysis used in traditional defected ground antennas. Initially, three single band antennas have been designed at 3.5 GHz, 5.2 GHz and 5.8 GHz using PDG technique. Finally, same PDG area has been used to design a dual-band antenna at 3.5 GHz and 5.8 GHz. The proposed antenna exhibits almost omnidirectional radiation performance with nearly 90% efficiency. It also shows dual radiation pattern property with similar patterns having different polarizations at each operational band. The antenna is fabricated on a ROGERS RO4003 substrate with 1.52 mm thickness. Reflection coefficient and radiation patterns are measured to validate its performance. The simulated and measured results of the antenna are closely correlated. The proposed antenna is suitable for different applications in Internet of Things

    Applications of Additive Manufacturing Technologies to Ambient Energy Harvesters for Microwave and Millimeter-Wave Autonomous Wireless Sensing Networks and 3D Packaging Integration

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    The objectives of my researches are developing new RF and mm-wave energy harvester topologies and realizing them with new additive manufacturing fabrication processes. The proposed energy harvester topologies are utilized to achieve energy-autonomous wireless sensing networks for 5G communication and IoT solutions. The developed additive manufacturing fabrication process is adopted to realize not only energy harvesters but also mm-wave IC packaging process. Ambient energy harvesting techniques collect ambient energy such as solar, RF, heat, and vibration and convert them into DC power sources to support the energy requirement of electronics. Since the energy is provided autonomously and constantly, maintenance or replacement for the batteries inside wireless electronics is not necessary resulting in enormous cost reduction. The researches of energy harvester focus on three categories, new topologies to enhance the performances, increased harvested power levels, and applied energy harvester to find new killer applications. This work proposes new designs and improvements in all three categories. Various proof-of-concept backscattered sensing systems with integrated RF energy harvesters for 5G and IoT applications are demonstrated. In this research, high-efficiency and broadband rectifiers are proposed to support high-performance rectifications as well as increase harvested energy. New topologies to utilize both DC and harmonics are demonstrated to increase the reading range of on-body wireless sensing networks. Furthermore, energy-autonomous microfluidic sensing systems are demonstrated to unleash the potential of microfluidic applications. 5G energy harvester is proposed and integrated inside the multi-layered additive manufacturing IC packages to achieve fully-functional SiP modules. While determining the fabrication methods, low-cost, fast-prototyping, and scalable methods with great material and structural flexibilities are preferable, and thus, additive manufacturing technologies including inkjet printing, 3D printing, and glass semi-additive patterning process are adopted. This research utilizes inkjet-printed masks, substrates, and metal traces to simplify the conventional fabrication process. The new low-loss inkjet-printable ink is developed to push the additive manufacturing technologies to mm-wave ranges. The flexible 3D-printed materials are characterized and used for wearable sensor designs, microfluidic channels, and flexible packaging topologies. The 3D features are included inside the IC packages to achieve high-performance multi-layer packaging structures with shorter lengths, lower loss, and smaller parasitics. The high-precision glass semi-additive patterning process is used to realized AiP and SiP designs with great performances. Furthermore, through combining inkjet and 3D printing, this work proposes a fast, cost-effective, scalable, and environmentally-friendly fabrication process for various high-performance and compact antenna designs, microwave/mm-wave components, microfluidic channels, RF energy harvesters, and SiP designs. In summary, this work utilizes additive manufacturing processes to realize various innovative topologies of energy harvesters to harvest more power and achieve higher rectification efficiency with smaller sizes. Additive manufacturing processes and energy harvesting techniques are also used to demonstrate new applications including the first on-body long-range sensing network, the first energy-autonomous long-range microfluidic sensing system, and the first fully-functional energy-autonomous 5G SiP module design. The proposed topologies are suitable for smart cities, smart skin, and IoT applications.Ph.D

    Desenho de antenas para sensores passivos em materiais não convencionais

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    Doutoramento em Engenharia EletrotécnicaMotivado pela larga expansão dos sistemas RFID e com o desenvolvimento do conceito de Internet das Coisas, a evolução no desenho e métodos de produção de antenas em suportes de materiais alternativos tem tido uma exploração intensiva nos últimos anos. Isto permitiu, não só o desenvolvimento de produtos no campo da interação homem-máquina, mas também tornar estes produtos mais pequenos e leves. A procura de novas técnicas e métodos para produzir eletrónica impressa e antenas em materiais alternativos e, portanto, uma porta aberta para o aparecimento de novas tecnologias. Isto aplica-se especialmente no mercado dos sensores, onde o peso, o tamanho, o consumo energético, e a adaptabilidade a diversos ambientes, têm grande relevância. Esta tese foca-se no desenvolvimento de antenas com suporte em materiais não convenvionais, como os já testados papel e têxteis, mas também na exploração de outros, desconhecidos do ponto de vista eléctrico, como a cortiça e polímeros biodegradáveis usados em impressão 3D. Estes materiais são portanto usados como substrato, ou material de suporte, para diversas antenas e, como tal, as propriedades electromagnéticas destes materiais têm de ser determinadas. Assim, e apresentado neste documento uma revisão de métodos de caracterização de materiais, bem como a proposta de um método baseado em linhas de trasmissão impressas, e a respectiva caracterização electromagnética de diversos materiais. Além disso, são propostos desenhos de antenas para diversos cenários e aplicações utilizando os materiais anteriormente mencionados. Com esta tese concluiu-se que a utilização de materiais alternativos e hoje uma realidade e os resultados obtidos são muito encorajodares para o desenvolvimento de um conjunto de sensores para aplicações RFID com uma grande capacidade de integração.The advancement of the design and fabrication of antennas using textiles or paper as substrates has rapidly grown motivated by the boom of RFID systems and the developing concept of the Internet of Things. These advancements have allowed, not only the development of products for manmachine interaction, but also to make these products smaller and lighter. The search for new techniques and methods to produce printed electronics and antennas in alternative materials is therefore an open door for new technologies to emerge. Especially in the sensors market, where weight, size, power consumption and the adaptability to the target application, are of great importance. This thesis focuses on the development of antenna design approaches with alternative materials, such as the already tested paper and textiles, but also others relatively unknown, such as cork and biodegradable polymers used in 3D printing. These materials are applied to act as substrates, or support structures for the antennas. Therefore, their electromagnetic properties need to be determined. Due to that, a review of electromagnetic characterization methods, as well as the proposal of a custom method based on printed transmission lines, is presented in this document. Besides, several antenna designs, for di erent application scenarios, using the previously mentioned materials, are proposed. With this thesis it was proved that it is possible to develop passive sensors in di erent alternative materials for RFID applications and others, which shows great promise in the use of these materials to achieve higher integration in sensing and identi cation applications
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