15 research outputs found

    TFT & ULSIC: Interfacing large-area thin-film sensor arrays with CMOS circuits

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    Large-area, conformable sensing surfaces could find many applications by interfacing humans or machines users with their environment. Given the success of TFT backplanes for flat-panel displays, a promising approach is the fabrication of large integrated thin-film sensor arrays on single substrates. In thin-film technology the number of sensors can be made very large, and they can be deployed on rigid or flexible, conformably shapeable or even elastically stretchable substrates. Flat-panel displays suggest that TFT integration can be less costly than arrays made by placing and interconnecting discrete sensels. Equally important is that low-temperature thin-film technology can accommodate the diversity of materials required by the various sensor technologies. However, thin-film devices and circuits are slow. TFT circuits cannot compete directly with ULSI circuits in controlling large sensor arrays, or in signal processing and extracting the germane information from the huge number of signals that such arrays can generate. To combine the advantages of large-area integrated TFT circuits with the speed of ULSI circuits, we have been making hybrid systems that combine TFT and ULSIC [1]. Our work covers the range from thin-film device materials to subsystems implemented in thin-film technology, to co-designing and interfacing the large-area thin-film domain with the ULSIC domain. We have demonstrated systems for the sensing of mechanical strain [2], image detection [3], acoustic speaker localization [4], electro-encephalography [5], gestures [6], and patterns of pressure. Please click Additional Files below to see the full abstract

    Flexible sensors—from materials to applications

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    Flexible sensors have the potential to be seamlessly applied to soft and irregularly shaped surfaces such as the human skin or textile fabrics. This benefits conformability dependant applications including smart tattoos, artificial skins and soft robotics. Consequently, materials and structures for innovative flexible sensors, as well as their integration into systems, continue to be in the spotlight of research. This review outlines the current state of flexible sensor technologies and the impact of material developments on this field. Special attention is given to strain, temperature, chemical, light and electropotential sensors, as well as their respective applications

    Inorganic micro/nanostructures-based high-performance flexible electronics for electronic skin application

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    Electronics in the future will be printed on diverse substrates, benefiting several emerging applications such as electronic skin (e-skin) for robotics/prosthetics, flexible displays, flexible/conformable biosensors, large area electronics, and implantable devices. For such applications, electronics based on inorganic micro/nanostructures (IMNSs) from high mobility materials such as single crystal silicon and compound semiconductors in the form of ultrathin chips, membranes, nanoribbons (NRs), nanowires (NWs) etc., offer promising high-performance solutions compared to conventional organic materials. This thesis presents an investigation of the various forms of IMNSs for high-performance electronics. Active components (from Silicon) and sensor components (from indium tin oxide (ITO), vanadium pentaoxide (V2O5), and zinc oxide (ZnO)) were realised based on the IMNS for application in artificial tactile skin for prosthetics/robotics. Inspired by human tactile sensing, a capacitive-piezoelectric tandem architecture was realised with indium tin oxide (ITO) on a flexible polymer sheet for achieving static (upto 0.25 kPa-1 sensitivity) and dynamic (2.28 kPa-1 sensitivity) tactile sensing. These passive tactile sensors were interfaced in extended gate mode with flexible high-performance metal oxide semiconductor field effect transistors (MOSFETs) fabricated through a scalable process. The developed process enabled wafer scale transfer of ultrathin chips (UTCs) of silicon with various devices (ultrathin chip resistive samples, metal oxide semiconductor (MOS) capacitors and n‐channel MOSFETs) on flexible substrates up to 4″ diameter. The devices were capable of bending upto 1.437 mm radius of curvature and exhibited surface mobility above 330 cm2/V-s, on-to-off current ratios above 4.32 decades, and a subthreshold slope above 0.98 V/decade, under various bending conditions. While UTCs are useful for realizing high-density high-performance micro-electronics on small areas, high-performance electronics on large area flexible substrates along with low-cost fabrication techniques are also important for realizing e-skin. In this regard, two other IMNS forms are investigated in this thesis, namely, NWs and NRs. The controlled selective source/drain doping needed to obtain transistors from such structure remains a bottleneck during post transfer printing. An attractive solution to address this challenge based on junctionless FETs (JLFETs), is investigated in this thesis via technology computer-aided design (TCAD) simulation and practical fabrication. The TCAD optimization implies a current of 3.36 mA for a 15 μm channel length, 40 μm channel width with an on-to-off ratio of 4.02x 107. Similar to the NRs, NWs are also suitable for realizing high performance e-skin. NWs of various sizes, distribution and length have been fabricated using various nano-patterning methods followed by metal assisted chemical etching (MACE). Synthesis of Si NWs of diameter as low as 10 nm and of aspect ratio more than 200:1 was achieved. Apart from Si NWs, V2O5 and ZnO NWs were also explored for sensor applications. Two approaches were investigated for printing NWs on flexible substrates namely (i) contact printing and (ii) large-area dielectrophoresis (DEP) assisted transfer printing. Both approaches were used to realize electronic layers with high NW density. The former approach resulted in 7 NWs/μm for bottom-up ZnO and 3 NWs/μm for top-down Si NWs while the latter approach resulted in 7 NWs/μm with simultaneous assembly on 30x30 electrode patterns in a 3 cm x 3 cm area. The contact-printing system was used to fabricate ZnO and Si NW-based ultraviolet (UV) photodetectors (PDs) with a Wheatstone bridge (WB) configuration. The assembled V2O5 NWs were used to realize temperature sensors with sensitivity of 0.03% /K. The sensor arrays are suitable for tactile e-skin application. While the above focuses on realizing conventional sensing and addressing elements for e-skin, processing of a large amount of data from e-skin has remained a challenge, especially in the case of large area skin. A Neural NW Field Effect Transistors (υ-NWFETs) based hardware-implementable neural network (HNN) approach for tactile data processing in e-skin is presented in the final part of this thesis. The concept is evaluated by interfacing with a fabricated kirigami-inspired e-skin. Apart from e-skin for prosthetics and robotics, the presented research will also be useful for obtaining high performance flexible circuits needed in many futuristic flexible electronics applications such as smart surgical tools, biosensors, implantable electronics/electroceuticals and flexible mobile phones

    Machine Learning in Sensors and Imaging

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    Machine learning is extending its applications in various fields, such as image processing, the Internet of Things, user interface, big data, manufacturing, management, etc. As data are required to build machine learning networks, sensors are one of the most important technologies. In addition, machine learning networks can contribute to the improvement in sensor performance and the creation of new sensor applications. This Special Issue addresses all types of machine learning applications related to sensors and imaging. It covers computer vision-based control, activity recognition, fuzzy label classification, failure classification, motor temperature estimation, the camera calibration of intelligent vehicles, error detection, color prior model, compressive sensing, wildfire risk assessment, shelf auditing, forest-growing stem volume estimation, road management, image denoising, and touchscreens

    A Contribution Towards Intelligent Autonomous Sensors Based on Perovskite Solar Cells and Ta2O5/ZnO Thin Film Transistors

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    Many broad applications in the field of robotics, brain-machine interfaces, cognitive computing, image and speech processing and wearables require edge devices with very constrained power and hardware requirements that are challenging to realize. This is because these applications require sub-conscious awareness and require to be always “on”, especially when integrated with a sensor node that detects an event in the environment. Present day edge intelligent devices are typically based on hybrid CMOS-memristor arrays that have been so far designed for fast switching, typically in the range of nanoseconds, low energy consumption (typically in nano-Joules), high density and endurance (exceeding 1015 cycles). On the other hand, sensory-processing systems that have the same time constants and dynamics as their input signals, are best placed to learn or extract information from them. To meet this requirement, many applications are implemented using external “delay” in the memristor, in a process which enables each synapse to be modeled as a combination of a temporal delay and a spatial weight parameter. This thesis demonstrates a synaptic thin film transistor capable of inherent logic functions as well as compute-in-memory on similar time scales as biological events. Even beyond a conventional crossbar array architecture, we have relied on new concepts in reservoir computing to demonstrate a delay system reservoir with the highest learning efficiency of 95% reported to date, in comparison to equivalent two terminal memristors, using a single device for the task of image processing. The crux of our findings relied on enhancing our capability to model the unique physics of the device, in the scope of the current thesis, that is not amenable to conventional TCAD simulations. The model provides new insight into the redox characteristics of the gate current and paves way for assessment of device performance in compute-in-memory applications. The diffusion-based mechanism of the device, effectively enables time constants that have potential in applications such as gesture recognition and detection of cardiac arrythmia. The thesis also reports a new orientation of a solution processed perovskite solar cell with an efficiency of 14.9% that is easily integrable into an intelligent sensor node. We examine the influence of the growth orientation on film morphology and solar cell efficiency. Collectively, our work aids the development of more energy-efficient, powerful edge-computing sensor systems for upcoming applications of the IOT

    A novel transparent and flexible pressure sensor for the human machine interface

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    The movement towards flexible and transparent electronics for use in displays, electronic skins, musical instruments and automotive industries, demands electrical components such as pressure sensors to evolve alongside circuitry and electrodes to ensure a fully flexible and transparent system. In the past, piezoresistive pressure sensors made with flexible electrodes have been fabricated, however, many of these systems are opaque. For the first time, we present a technology that exploits the natural self-assembly of polystyrene nanospheres to reproducibly create nanostructured materials to be used in optically transparent pressure sensors with sensing performance comparable to opaque industry standards. The performance of the piezoresistive pressure sensor relies on uniform elastic nano-dome arrays. A thin and homogeneous lining of poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) renders the domes conductive and retains the transparent and flexible qualities of the underlying polymer. The film transparency is primarily dependant on PEDOT:PSS film thickness where transparencies as high as 79.3 \% are achieved for films of less than 100 nm in thickness. The sensors demonstrate a resistance response across the force range appropriate for all human machine interface interactions, which correspond here to 0.07 to 26 N. The fabrication process involves the creation of an electroactive mould which is used to create nanostructred polymer layers. To enable mould reuse and enhance process efficiency, an anti-adhesive treatment in the form of a self-assembled monolayer of alkanethiols has been developed. Three chain lengths for the alkanethiol of chemical structure H3_{3}C-(CH2_{2})n_{n}-SH where n = 3, 5, and 11 are investigated and SAM functionalisation is confirmed with XPS. Peel tests prove that all three are effective at preventing adhesion between the mould and PEDOT:PSS and the treatment is shown not to be detrimental to the polymer electrodeposition process. An adapted fabrication procedure with custom designed electrode housing enables larger samples to be created for prototype devices. A simple functional prototype in the form of a multi-pixel force sensor atop of an LED display is successfully designed and fabricated to highlight the technology for use at the human machine interface.Open Acces

    Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II

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    Wide bandgap (WBG) semiconductors are becoming a key enabling technology for several strategic fields, including power electronics, illumination, and sensors. This reprint collects the 23 papers covering the full spectrum of the above applications and providing contributions from the on-going research at different levels, from materials to devices and from circuits to systems

    The impact of printed electronics on product design

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    Printed electronics (PE) is a disruptive but growing technology that is beginning to integrate its way into viable applications for product design. However, the potential for future impact of the technology on product design and the designer s role and contribution to this has yet to be established. Interest is increasing in the potential for product designers to explore and exploit this technology. Technologies can be seen as being disruptive from both a business, and an adoption point of view. For a business, changing from one technology to another or incorporating a new technology and its production processes can be difficult if they already have their suppliers established and existing relationships in place. Understanding and adopting a new technology can be challenging for a business and individuals working within an established industry as it can cause many questions to be raised around its performance, and direct comparison with the technology they already have in place. However, there have been many technologies that could be seen as disruptive in the past, as they offered an alternative way of working or method of manufacture, such as Bluetooth, 3D printing, and automation (manufacturing/assembly/finishing), etc., and their success has been dictated by individual s perception and adoption of the technology, with their ability to see the worth and potential in the technology. Cost comparison is also an important aspect for a business to consider when choosing whether to change to a new technology or to remain with their existing technology, as changing can disrupt the manufacturing line assembly of a product, and direct cost comparisons of components themselves, such as the cost of buying silicon components in bulk verses printing the components. The new technology needs to offer something different to a product to be worth implementing it in a product, such as its flexible form or lightweight properties of printed electronics being of benefit to the product over what a silicon electronic component/circuit could offer (restricted to rigid circuit boards), the functionality/performance of the components themselves also need to be considered. Performance, availability and maturity of the technology are some of the essential aspects to consider when incorporating a new technology into a product and these can be evaluated using a Technology Readiness Level (TRL) scale. Interest in the stage of development for a technology lies not only with designers; industry and academia also contribute to knowledge by playing a central role in the process of determining a TRL scale that is universally recognised. However, a TRL separation issue occurs between academia (often the technology only reaching an experimental proof of concept stage, a lower number on the TRL scale indicating that the technology is at an early stage of development) and industry (not considering technology for commercialisation until it reaches a stage where there is a demonstration of pre-production capability validated on economic runs, a much higher number on the TRL scale - indicating that the technology is at a much more advanced stage of development). The aim of this doctoral research was to explore the contribution of PE to product design. The researcher experienced the scientific development of the technology first-hand, and undertook a literature review that covered three main topics: 1) printed electronics (the technology itself), 2) impact (approaches to assessing impact and methods of judging new technology) because together they will identify the state of the art of printed electronics technology, and 3) education - educational theories/methods for designers - studying how designers learn, explore different methods in educating them about new technologies, and start to find appropriate methods for educating them about printed electronics technology. A knowledge framework for PE technology was generated and utilised to produce a taxonomy and TRL scale for PE and confirmed by PE expert interview. Existing case studies in which PE technology had been presented to student designers were investigated through interviews with participants from academia and industry to solicit perception and opinions on approaches for the effective communication of PE knowledge to student designers within an educational environment. The findings were interpreted using thematic analysis and, after comparing the data, three main themes identified: technical constraints, designer s perspective, and what a designer is required to do. The findings from the research were combined to create an educational approach for knowledge transfer aimed specifically at meeting the needs of product designers. This resulted in the need for PE technology to be translated into both a visual and written format to create structure and direct links between the technological elements and their form and function in order to facilitate understanding by designers. Conclusions from the research indicate that the translation of this technology into an appropriate design language will equip designers with accessible fundamental knowledge on PE technology (i.e. electrical components: form, function, and area of the technology), which will allow informed decisions to be made about how PE can be used and to utilise its benefits in the design of products. The capabilities and properties of this technology, when paired with product design practice, has the capacity to transform the designs of future products in terms of form/functionality and prevailing/views towards design approaches with electronics. If exposed to a variety of PE elements ranging across different TRLs, designers have the capacity to bridge the TRL separation issue (the gap between academia and industry) through their ability to create design solutions for an end user and provide a commercial application for the technology
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