54 research outputs found

    Heterogeneous 2.5D integration on through silicon interposer

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    © 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity

    Microwave Photonic Applications - From Chip Level to System Level

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    Die Vermischung von Mikrowellen- und optischen Technologien – Mikrowellenphotonik – ist ein neu aufkommendes Feld mit hohem Potential. Durch die Nutzung der Vorzüge beider Welten hat die Mikrowellenphotonik viele Anwendungsfälle und ist gerade erst am Beginn ihrer Erfolgsgeschichte. Der Weg für neue Konzepte, neue Komponenten und neue Anwendungen wird dadurch geebnet, dass ein höherer Grad an Integration sowie neue Technologien wie Silicon Photonics verfügbar sind. In diesem Werk werden zuerst die notwendigen grundlegenden Basiskomponenten – optische Quelle, elektro-optische Wandlung, Übertragungsmedium und opto-elektrische Wandlung – eingeführt. Mithilfe spezifischer Anwendungsbeispiele, die von Chipebene bis hin zur Systemebene reichen, wird der elektrooptische Codesign-Prozess veranschaulicht. Schließlich werden zukünftige Ausrichtungen wie die Unterstützung von elektrischen Trägern im Millimeterwellen- und THz-Bereich sowie Realisierungsoptionen in integrierter Optik und Nanophotonik diskutiert.The hybridization between microwave and optical technologies – microwave photonics – is an emerging field with high potential. Benefitting from the best of both worlds, microwave photonics has many use cases and is just at the beginning of its success story. The availability of a higher degree of integration and new technologies such as silicon photonics paves the way for new concepts, new components and new applications. In this work, first, the necessary basic building blocks – optical source, electro-optical conversion, transmission medium and opto-electrical conversion – are introduced. With the help of specific application examples ranging from chip level to system level, the electro-optical co-design process for microwave photonic systems is illustrated. Finally, future directions such as the support of electrical carriers in the millimeter wave and THz range and realization options in integrated optics and nanophotonics are discussed

    MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS

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    This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due tothe breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter- and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies

    Study of the impact of lithography techniques and the current fabrication processes on the design rules of tridimensional fabrication technologies

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    Working for the photolithography tool manufacturer leader sometimes gives me the impression of how complex and specific is the sector I am working on. This master thesis topic came with the goal of getting the overall picture of the state-of-the-art: stepping out and trying to get a helicopter view usually helps to understand where a process is in the productive chain, or what other firms and markets are doing to continue improvingUniversidad de sevilla.Máster Universitario en Microelectrónica: Diseño y Aplicaciones de Sistemas Micro/Nanométrico

    Integrated silicon photonic packaging

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    Silicon photonics has garnered plenty of interests from both the academia and industry due to its high-speed transmission potential as well as sensing capability to complement silicon electronics. This has led to significant growth on the former, valuing at US626.8Min2017andisexpectedtogrow3foldtoUS 626.8M in 2017 and is expected to grow 3-fold to US 1,988.2M by 2023, based on data from MarketsandMarkets™. Silicon photonics’ huge potential has led to worldwide attention on fundamental research, photonic circuit designs and device fabrication technologies. However, as with silicon electronics in its early years, the silicon photonics industry today is extremely fragmented with various chip designs and layouts. Most silicon photonic devices fabricated are not able to reach the hand of consumers, due to a lack of information related to packaging design rules, components and processes. The importance of packaging technologies, which play a crucial role in turning photonic circuits and devices into the final product that end users can used in their daily lives, has been overlooked and understudied. This thesis aims to – 1. fill the missing gap by adapting existing electronics packaging techniques, 2. assess its scalability, 3. assess supply chain integration and finally 4. develop unique packaging approaches specifically for silicon photonics. The first section focused on high density packaging components and processes using University of California, Berkeley’s state-of-the-art silicon photonic MEMS optical switches as test devices. Three test vehicles were developed using (1) via-less ceramic and (2) spring-contacted electrical interposers for 2D integration and (3) through-glass-via electrical interposers for 2.5D heterogeneous integration. A high density (1) lidless fibre array and (2) a 2D optical interposer, which allows pitch-reduction of optical waveguides were also developed in this thesis. Together, these components demonstrated the world’s first silicon 2 photonic MEMS optical switch package and subsequently the highest density silicon photonic packaging components with 512 electrical I/Os and 272 optical I/Os. The second section then moved away from active optical coupling that was used in the former, investigating instead passive optical packaging concepts for the future. Two approaches were investigated - (1) grating-to-grating and (2) evanescent couplings. The former allows the development of pluggable packages, separating fibre coupling away from the device while the latter allows simultaneous optical and electrical packaging on a glass wafer in a single process. Lastly, the knowhow and concepts developed in this thesis were compiled into packaging design rules and subsequently introduced into H2020-MORPHIC, PIXAPP packaging training courses (as a trainer) and other packaging projects within the group
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