Tuning of 2D rod-type photonic crystal cavity for optical modulation and impact sensing

We propose a novel way of mechanical perturbation of photonic crystal cavities for on-chip applications. We utilize the equivalence of the 2D photonic crystals with perfect electric conductor (PEC) boundary conditions to the infinite height 3D counterparts for rod type photonic crystals. Designed structures are sandwiched with PEC boundaries above and below and the perturbation of the cavity structures is demonstrated by changing the height of PEC boundary. Once a defect filled with air is introduced, the metallic boundary conditions is disturbed and the effective mode permittivity changes leading to a tuned optical properties of the structures. Devices utilizing this perturbation are designed for telecom wavelengths and PEC boundaries are replaced by gold plates during implementation. For 10 nm gold plate displacement, two different cavity structures showed a 21.5 nm and 26 nm shift in the resonant wavelength. Optical modulation with a 1.3 MHz maximum modulation frequency with a maximum power consumption of 36.81 nW and impact sensing with 20 μs response time (much faster compared to the commercially available ones) are shown to be possible

Design and simulation of a SOI based mems differential accelerometer

In this paper, the design and analysis of a differential MEMS capacitive accelerometer is presented. The device is designed to be compatible for SOI based fabrication process. The outstanding mechanical and electrical properties of silicon on insulator (SOI) wafers make it popular for high-performance MEMS sensors such as accelerometers. The operating range of the designed device is 0-10g with its sense axis in the in-plane direction. The movable comb fingers attached to the proof mass form capacitors with the fixed electrode fingers. The movable and fixed fingers are spaced with unequal gaps to form the differential capacitive sensing configuration. The base capacitance of this configuration is about 0.77pF and the sensitivity in response to acceleration input is about 0.776 fF/g. The resonance frequency of the structure in the sensing mode is found to be 7.138 kHz.The work was partially funded by the Russian Federation Ministry of Education and Science

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Enhancements of MEMS design flow for Automotive and Optoelectronic applications

In the latest years we have been witnesses of a very rapidly and amazing grown of MicroElectroMechanical systems (MEMS) which nowadays represent the outstanding state-of-the art in a wide variety of applications from automotive to commercial, biomedical and optical (MicroOptoElectroMechanicalSystems). The increasing success of MEMS is found in their high miniaturization capability, thus allowing an easy integration with electronic circuits, their low manufacturing costs (that comes directly from low unit pricing and indirectly from cutting service and maintaining costs) and low power consumption. With the always growing interest around MEMS devices the necessity arises for MEMS designers to define a MEMS design flow. Indeed it is widely accepted that in any complex engineering design process, a well defined and documented design flow or procedure is vital. The top-level goal of a MEMS/MOEMS design flow is to enable complex engineering design in the shortest time and with the lowest number of fabrication iterations, preferably only one. These two characteristics are the measures of a good flow, because they translate directly to the industry-desirable reductions of the metrics “time to market” and “costs”. Like most engineering flows, the MEMS design flow begins with the product definition that generally involves a feasibility study and the elaboration of the device specifications. Once the MEMS specifications are set, a Finite Element Method (FEM) model is developed in order to study its physical behaviour and to extract the characteristic device parameters. These latter are used to develop a high level MEMS model which is necessary to the design of the sensor read out electronics. Once the MEMS geometry is completely defined and matches the device specifications, the device layout must be generated, and finally the MEMS sensor is fabricated. In order to have a MEMS sensor working according to specifications at first production run is essential that the MEMS design flow is as close as possible to the optimum design flow. The key factors in the MEMS design flow are the development of a sensor model as close as possible to the real device and the layout realization. This research work addresses these two aspects by developing optimized custom tools (a tool for layout check (LVS) and a tool for parasitic capacitances extraction) and new methodologies (a methodology for post layout simulations) which support the designer during the crucial steps of the design process as well as by presenting the models of two cases studies belonging to leading MEMS applications (a micromirror for laser projection system and a control loop for the shock immunity enhancement in gyroscopes for automotive applications)

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Piezoelectric Fused Silica Resonators for Timing References.

MEMS resonators have the capability to match or exceed the performance of state-of-the-art quartz timing references at a fraction of the size, power, and cost. To enable this capability, this work investigates the use of fused silica as a substrate for piezoelectrically actuated resonators for applications in timing references. This thesis presents the design and fabrication of a piezoelectrically actuated fused silica resonator. The fabricated resonators show a quality factor (Q) of 19,671 at 4.96 MHz with an insertion loss of 16.9 dB, and is the first reported example of a piezoelectrically actuated fused silica resonator in literature. An in-depth investigation into loss mechanisms in fused silica is performed in order to identify and address the major losses in the device and maximize potential performance. Multiple experimental and analytical investigations are presented, with a new form of loss, known as charge redistribution, presented as a possible dominant loss in these piezoelectric resonators. This loss mechanism is analytically modeled and simulated to have a Q of 25,100, within 20% of the experimentally measured devices. The temperature sensitivity of fused silica is also addressed; as fused silica shows a temperature coefficient of elasticity almost three times higher than that shown in uncompensated silicon. Both active and passive methods of temperature compensation are implemented, including a fused silica ovenized platform and nickel-refilled trenches for temperature compensation. The nickel-refilled trenches are shown to reduce temperature sensitivity in piezoelectrically actuated fused silica resonators from 78 ppm/K to 50 ppm/K, with larger compensation possible but complete compensation infeasible from passive techniques alone. From this, a dual-mode system is proposed for use in ovenized systems where two modes are simultaneously activated in a single device volume. In this system, one mode acts as a stable reference frequency and the second mode acts as a temperature sensor, allowing for extremely accurate ovenization. A silicon-based prototype is developed, showing a +14 ppm/K temperature difference between the two modes, with additional temperature differential possible through the addition of material-based passive compensation.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/135878/1/peczalsk_1.pd

The Convergence of Parametric Resonance and Vibration Energy Harvesting

Energy harvesting is an emerging technology that derives electricity from the ambient environment in a decentralised and self-contained fashion. Applications include self-powered medical implants, wearable electronics and wireless sensors for structural health monitoring. Amongst the vast options of ambient sources, vibration energy harvesting (VEH) has attracted by far the most research attention. Two of the key persisting issues of VEH are the limited power density compared to conventional power supplies and confined operational frequency bandwidth in light of the random, broadband and fast-varying nature of real vibration. The convention has relied on directly excited resonance to maximise the mechanical-to-electrical energy conversion efficiency. This thesis takes a fundamentally different approach by employing parametric resonance, which, unlike the former, its resonant amplitude growth does not saturate due to linear damping. Therefore, parametric resonance, when activated, has the potential to accumulate much more energy than direct resonance. The vibrational nonlinearities that are almost always associated with parametric resonance can offer a modest frequency widening. Despite its promising theoretical potentials, there is an intrinsic damping dependent initiation threshold amplitude, which must be attained prior to its onset. The relatively low amplitude of real vibration and the unavoidable presence of electrical damping to extract the energy render the onset of parametric resonance practically elusive. Design approaches have been devised to passively minimise this initiation threshold. Simulation and experimental results of various design iterations have demonstrated favourable results for parametric resonance as well as the various threshold-reduction mechanisms. For instance, one of the macro-scale electromagnetic prototypes (∼1800 cm3) when parametrically driven, has demonstrated around 50% increase in half power band and an order of magnitude higher peak power (171.5 mW at 0.57 ms−2) in contrast to the same prototype directly driven at fundamental resonance (27.75 mW at 0.65 ms−2). A MEMS (micro-electromechanical system) prototype with the additional threshold-reduction design needed 1 ms−2 excitation to activate parametric resonance while a comparable device without the threshold-reduction mechanism required in excess of 30 ms−2. One of the macro-scale piezoelectric prototypes operated into auto-parametric resonance has demon-strated notable further reduction to the initiation threshold. A vacuum packaged MEMS prototype demonstrated broadening of the frequency bandwidth along with higher power peak (324 nW and 160 Hz) for the parametric regime compared to when operated in room pressure (166 nW and 80 Hz), unlike the higher but narrower direct resonant peak (60.9 nW and 11 Hz in vacuum and 20.8 nW and 40 Hz in room pressure). The simultaneous incorporation of direct resonance and bi-stability have been investigated to realise multi-regime VEH. The potential to integrate parametric resonance in the electrical domains have also been numerically explored. The ultimate aim is not to replace direct resonance but rather for the various resonant phenomena to complement each other and together harness a larger region of the available power spectrum