707 research outputs found

    MEMS tunable infrared metamaterial and mechanical sensors

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    Sub-wavelength resonant structures open the path for fine controlling the near-field at the nanoscale dimension. They constitute into macroscopic “metamaterials” with macroscale properties such as transmission, reflection, and absorption being tailored to exhibit a particular electromagnetic response. The properties of the resonators are often fixed at the time of fabrication wherein the tunability is demanding to overcome fabrication tolerances and afford fast signal processing. Hybridizing dynamic components such as optically active medium into the device makes tunable devices. Microelectromechanical systems (MEMS) compatible integrated circuit fabrication process is a promising platform that can be merged with photonics or novel 2D materials. The prospect of enormous freedom in integrating nanophotonics, MEMS actuators and sensors, and microelectronics into a single platform has driven the rapid development of MEMS-based sensing devices. This thesis describes the design and development of four tunable plasmonic structures based on active media or MEMS, two graphene-based MEMS sensors and a novel tape-based cost-effective nanotransfer printing techniques. First of all, we present two tunable plasmonic devices with the use of two active medium, which are electrically controlled liquid crystals and temperature-responsive hydrogels, respectively. By incorporating a nematic liquid crystal layer into quasi-3D mushroom plasmonic nanostructures and thanks to the unique coupling between surface plasmon polariton and Rayleigh anomaly, we have achieved the electrical tuning of the properties of plasmonic crystal at a low operating electric field. We also present another tunable plasmonic device with the capability to sense environmental temperature variations. The device is bowtie nanoantenna arrays coated with a submicron-thick, thermos-responsive hydrogel. The favorable scaling of plasmonic dimers at the nanometer scale and ionic diffusion at the submicron scale is leveraged to achieve strong optical resonance and rapid hydrogel response, respectively. Secondly, we present two MEMS -based tunable near-to-mid infrared metamaterials on a silicon-on-insulator wafer via electrically and thermally actuating the freestanding nanocantilevers. The two devices are developed on the basis of the same fabrication process and are easy-to-implement. The electrostatically driven metamaterial affords ultrahigh mechanical modulation (several tens of MHz) of an optical signal while the thermo-mechanically tunable metamaterial provides up to 90% optical signal modulation at a wavelength of 3.6 õm. Next, we present MEMS graphene-based pressure and gas flow sensors realized by transferring a large area and few-layered graphene onto a suspended silicon nitride thin membrane perforated with micro-through-holes. Due to the increased strain in the through-holes, the pressure sensor exhibits a very high sensitivty outperformed than most existing MEMS-based pressure sensors using graphene, silicon, and carbon nanotubes. An air flow sensor is also demonstrated via patterning graphene sheets with flow-through microholes. The flow rate of the air is measured by converting the mechanically deflection of the membrane into the electrical readout due to the graphene piezeroresistors. Finally, we present a tape-based multifunctional nanotransfer printing process based on a simple stick-and-peel procedure. It affords fast production of large-area metallic and dielectric nanophotonic sensing devices and metamaterials using Scotch tape

    Plasmomechanical Systems: Principles and Applications

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    AbstractExtreme confinement of electromagnetic waves and mechanical displacement fields to nanometer dimensions through plasmonic nanostructures offers unprecedented opportunities for greatly enhanced interaction strength, increased bandwidth, lower power consumption, chip‐scale fabrication, and efficient actuation of mechanical systems at the nanoscale. Conversely, coupling mechanical oscillators to plasmonic nanostructures introduces mechanical degrees of freedom to otherwise static plasmonic structures thus giving rise to the generation of extremely large resonance shifts even for minor position changes. This nanoscale marriage of plasmonics and mechanics has led to the emergence of a new field of study called plasmomechanics that explores the fundamental principles underneath the coupling between light and plasmomechanical nanoresonators. In this review, both the fundamental concepts and applications of plasmomechanics as an emerging field of study are discussed. After an overview of the basic principles of plasmomechanics, the active tuning mechanisms of plasmonic nano‐mechanical systems are extensively analyzed. Moreover, the recent developments on the practical implications of plasmomechanic systems for such applications as biosensing and infrared detection are highlighted. Finally, an outlook on the implications of the plasmomechanical nanosystems for development of point‐of‐care diagnostic devices that can help early and rapid detection of fatal diseases are forwarded

    Agenda: Second International Workshop on Thin Films for Electronics, Electro-Optics, Energy and Sensors (TFE3S)

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    University of Dayton’s Center of Excellence for Thin Film Research and Surface Engineering (CETRASE) is delighted to organize its second international workshop at the University of Dayton’s Research Institute (UDRI) campus in Dayton, Ohio, USA. The purpose of the new workshop is to exchange technical knowledge and boost technical and educational collaboration activities within the thin film research community through our CETRASE and the UDRI

    MEMS for Photonic Integrated Circuits

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    The field of microelectromechanical Systems (MEMS) for photonic integrated circuits (PICs) is reviewed. This field leverages mechanics at the nanometer to micrometer scale to improve existing components and introduce novel functionalities in PICs. This review covers the MEMS actuation principles and the mechanical tuning mechanisms for integrated photonics. The state of the art of MEMS tunable components in PICs is quantitatively reviewed and critically assessed with respect to suitability for large-scale integration in existing PIC technology platforms. MEMS provide a powerful approach to overcome current limitations in PIC technologies and to enable a new design dimension with a wide range of applications

    MEMS-enabled silicon photonic integrated devices and circuits

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    Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms. Mechanical movement of wave-guiding structures at the micro- and nanoscale provides unique opportunities to further enhance functionality and to reduce power consumption in photonic integrated circuits. We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC's Standard iSiPP50G Silicon Photonics Platform and a custom release process
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