Slow positron beam generator for lifetime studies

A slow positron beam generator uses a conductive source residing between two test films. Moderator pieces are placed next to the test film on the opposite side of the conductive source. A voltage potential is applied between the moderator pieces and the conductive source. Incident energetic positrons: (1) are emitted from the conductive source; (2) are passed through test film; and (3) isotropically strike moderator pieces before diffusing out of the moderator pieces as slow positrons, respectively. The slow positrons diffusing out of moderator pieces are attracted to the conductive source which is held at an appropriate potential below the moderator pieces. The slow positrons have to pass through the test films before reaching the conductive source. A voltage is adjusted so that the potential difference between the moderator pieces and the conductive source forces the positrons to stop in the test films. Measurable annihilation radiation is emitted from the test film when positrons annihilate (combine) with electrons in the test film

Conductive lithographic films

This paper reports progress in the development of a novel fabrication technique for printing circuit board designs directly onto suitable substrates. Circuit tracks can be formed on organic or synthetic substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. The application of this work is in substitutes for conventional (copper-clad resin/laminate) circuit boards where, for low complexity circuits, directly printed substrates offer cost advantages and environmental benefits. The paper is a resume of work and results, including; ink formulation, environmental test, circuit modelling and life cycle analysis. Conductive lithographic films have now been successfully demonstrated in a telephone handset developed in conjunction with Nortel, microprocessor and microwave stripline applications. Whilst developed primarily as a low cost, low environmental impact alternative to subtractive PCB manufacture, other potential advantages such as flexibility and environmental robustness are apparent

Four point probe structures with buried electrodes for the electrical characterization of ultrathin conducting films

Test structures for the electrical characterization of ultrathin conductive (ALD) films are presented based on buried electrodes on which the ultrathin film is deposited.\ud This work includes test structure design and fabrication, and the electrical characterization of ALD TiN films down to 4 nm. It is shown that these structures can be used successfully to characterize sub 10 nm films.\u

Lithographic technology for microwave integrated circuits

Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs

Mod silver metallization: Screen printing and ink-jet printing

Basic material efforts have proven to be very successful. Adherent and conductive films were achieved. A silver neodecanoate/bismuth 2-ethylhexanoate mixture has given the best results in both single and double layer applications. Another effort is continuing to examine the feasibility of applying metallo-organic deposition films by use of an ink jet printer. Direct line writing would result in a saving of process time and materials. So far, some well defined lines have been printed