InGaAsP as a Promising Narrow Band Gap Semiconductor for Photoelectrochemical Water Splitting

While photoelectrochemical (PEC) water splitting is a very promising route toward zero-carbon energy, conversion efficiency remains limited. Semiconductors with narrower band gaps can absorb a much greater portion of the solar spectrum, thereby increasing efficiency. However, narrow band gap (∼1 eV) III–V semiconductor photoelectrodes have not yet been thoroughly investigated. In this study, the narrow band gap quaternary III–V alloy InGaAsP is demonstrated for the first time to have great potential for PEC water splitting, with the long-term goal of developing high-efficiency tandem PEC devices. TiO2-coated InGaAsP photocathodes generate a photocurrent density of over 30 mA/cm2 with an onset potential of 0.45 V versus reversible hydrogen electrode, yielding an applied bias efficiency of over 7%. This is an excellent performance, given that nearly all power losses can be attributed to reflection losses. X-ray photoelectron spectroscopy and photoluminescence spectroscopy show that InGaAsP and TiO2 form a type-II band alignment, greatly enhancing carrier separation and reducing recombination losses. Beyond water splitting, the tunable band gap of InGaAsP could be of further interest in other areas of photocatalysis, including CO2 reduction

15% Efficiency Ultrathin Silicon Solar Cells with Fluorine-Doped Titanium Oxide and Chemically Tailored Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) as Asymmetric Heterocontact

In order to achieve a high performance-to-cost ratio to photovoltaic devices, the development of crystalline silicon (c-Si) solar cells with thinner substrates and simpler fabrication routes is an important step. Thin-film heterojunction solar cells (HSCs) with dopant-free and carrier-selective configurations look like ideal candidates in this respect. Here, we investigated the application of n-type silicon/poly­(3,4-ethylenedioxythiophene):poly­(styrenesulfonate) (PEDOT:PSS) HSCs on periodic nanopyramid textured, ultrathin c-Si (∼25 μm) substrates. A fluorine-doped titanium oxide film was used as an electron-selective passivating layer showing excellent interfacial passivation (surface recombination velocity ∼10 cm/s) and contact property (contact resistivity ∼20 mΩ/cm2). A high efficiency of 15.10% was finally realized by optimizing the interfacial recombination and series resistance at both the front and rear sides, showing a promising strategy to fabricate high-performance ultrathin c-Si HSCs with a simple and low-temperature procedure