Investigation of low cost, high reliability sealing techniques for hybrid microcircuits, phase 1

A preliminary investigation was made to determine the feasibility of using adhesive package sealing for hybrid microcircuits. Major effort consisted of: (1) surveying representative hybrid manufacturers to assess the current use of adhesives for package sealing; (2) making a cost comparison of metallurgical versus adhesive package sealing; (3) determining the seal integrity of gold plated flatpack type packages sealed with selected adhesives, thermal shock, temperature cycling, mechanical shock, and constant acceleration test environments; and (4) defining a more comprehensive study to continue the evaluation of adhesives for package sealing. Results showed that 1.27 cm square gold plated flatpack type packages sealed with the film adhesives and the paste adhesive retained their seal integrity after all tests, and that similarly prepared 2.54 cm square packages retained their seal integrity after all tests except the 10,000 g's constant acceleration test. It is concluded that these results are encouraging, but by no means sufficient to establish the suitability of adhesives for sealing high reliability hybrid microcircuits

Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided

Investigation of organic adhesives for hybrid microcircuits

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure

Mapping the dynamic interactions between vortex species in highly anisotropic superconductors

Here we use highly sensitive magnetisation measurements performed using a Hall probe sensor on single crystals of highly anisotropic high temperature superconductors $Bi_{2}Sr_{2}CaCu_{2}O_{8}$ to study the dynamic interactions between the two species of vortices that exist in such superconductors. We observe a remarkable and clearly delineated high temperature regime that mirrors the underlying vortex phase diagram. Our results map out the parameter space over which these dynamic interaction processes can be used to create vortex ratchets, pumps and other fluxonic devices.Comment: 7 pages, 3 figures, to be published in Supercond. Sci. Techno

Critical Fields and Critical Currents in MgB2

We review recent measurements of upper (Hc2) and lower (Hc1) critical fields in clean single crystals of MgB2, and their anisotropies between the two principal crystallographic directions. Such crystals are far into the "clean limit" of Type II superconductivity, and indeed for fields applied in the c-direction, the Ginzburg-Landau parameter k is only about 3, just large enough for Type II behaviour. Because m0Hc2 is so low, about 3 T for fields in the c-direction, MgB2 has to be modified for it to become useful for high-current applications. It should be possible to increase Hc2 by the introduction of strong electron scattering (but because of the electronic structure and the double gap that results, the scatterers will have to be chosen carefully). In addition, pinning defects on a scale of a few nm will have to be engineered in order to enhance the critical current density at high fields.Comment: BOROMAG Conference Invited paper. To appear in Supercond. Sci. Tec

Effective Vortex Pinning in MgB2 thin films

We discuss pinning properties of MgB2 thin films grown by pulsed-laser deposition (PLD) and by electron-beam (EB) evaporation. Two mechanisms are identified that contribute most effectively to the pinning of vortices in randomly oriented films. The EB process produces low defected crystallites with small grain size providing enhanced pinning at grain boundaries without degradation of Tc. The PLD process produces films with structural disorder on a scale less that the coherence length that further improves pinning, but also depresses Tc

Design guidelines for use of adhesives and organic coatings in hybrid microcircuits

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits