8 research outputs found
Local Deformation-Controlled Fast Directional Metal Outflow in Metal/Ceramic Nanolayer Sandwiches upon Low Temperature Annealing
Precise
nanoindentation on AlN/Cu/AlN nanolayer sandwiches has
been conducted by using an atomic force microscope to promote fast
and directional metal (Cu) outflow upon heating at low temperatures.
Local plastic deformation during indentation results in the generation
of high defect densities and stress gradients, which not only effectively
reduce the activation energies for fast in-plane diffusion but also
direct the in-plane transport of confined Cu to the indent location.
In addition, a steep chemical potential gradient of O will be established
across the AlN barrier upon exposure to air, which drives fast outward
diffusion of Cu along defective pathways in the top AlN layer at the
indent location. Selective and fast Cu metal outflow can thus be achieved
at the indent locations upon annealing at a relatively low temperature
of 350 °C for 5 min in air. The microstructures and phase boundaries
of the AlN barrier and confined Cu nanolayers are unperturbed outside
the plastically deformed region and remain metastable after annealing
at 350 °C. By changing the surface processing modes, patterned
nanoparticles and isolated nanowire structures can be fabricated straightforwardly.
Such local deformation-controlled directional mass transport phenomena
can be utilized to manipulate materials down to the atomic scale for
designing functional nanoarchitectures for nanophotonic and nanoelectronic
applications
Plasmon-Induced Heterointerface Thinning for Schottky Barrier Modification of Core/Shell SiC/SiO<sub>2</sub> Nanowires
In this work, plasmon-induced
heterointerface thinning for Schottky barrier modification of core/shell
SiC/SiO2 nanowires is conducted by femtosecond (fs) laser
irradiation. The incident energy of polarized fs laser (50 fs, 800
nm) is confined in the SiO2 shell of the nanowire due to
strong plasmonic localization in the region of the electrode–nanowire
junction. With intense nonlinear absorption in SiO2, the
thickness of the SiO2 layer can be thinned in a controllable
way. The tuning of the SiO2 barrier layer allows the promotion
of electron transportation at the electrode–nanowire interface.
The switching voltage of the rectifying junction made by the SiC/SiO2 nanowire can be significantly tuned from 15.7 to 1 V. When
selectively thinning at source and drain electrodes and leaving the
SiO2 barrier layer at the gate electrode intact, a metal/oxide/semiconductor
(MOS) device is fabricated with low leakage current. This optically
controlled interfacial engineering technology should be applicable
for MOS components and other heterogeneous integration structures
Ultralong, High Aspect Ratio Graphene Nanoribbon Arrays Fabricated by Laser Interference Lithography: Implications for Integrated Nanocircuits
Ultralong graphene nanoribbons (GNRs) have drawn much
attention
in the field of high performance nanoelectronics. In this work, a
mask-free ultrafast laser lithography method is demonstrated for the
mass production of ultralong GNR arrays with an intact carbon network.
The longest GNR reaches ∼42 μm with a width of ∼400
nm. The orientation of the as-received GNR arrays is always parallel
to the incident laser polarization direction. Original carbon network
structures of remaining GNRs are preserved, which are ascribed to
the precise energy injection and selective nanoablation in graphene
flakes. The formation of large-scale GNR arrays is mainly determined
by the interference between the incident laser and the stimulated
transverse electric mode surface plasmon (TE-SPs) wave. The excitation
of the TE-SPs wave prefers to be triggered at the geometrical fluctuations
on ablated graphene surfaces as well as the interface with a large
discrepancy of dielectric permittivity (e.g., graphene and SiO2). With the initial generation of the nanoablated groove on
the surface, the interference between TE-SPs waves and incident laser
beams further extends to the far end with periodic intervals, which
results in the continuous formation of GNRs. This ultrafast laser-induced
periodic lithography may provide an alternative for ultralong and
high aspect ratio GNR array fabrication, which is promising in high
performance nanodevice development
Femtosecond Laser Irradiation-Mediated MoS<sub>2</sub>–Metal Contact Engineering for High-Performance Field-Effect Transistors and Photodetectors
2D materials exhibit intriguing electrical
and optical properties,
making them promising candidates for next-generation nanoelectronic
devices. However, the high contact resistance of 2D materials to electrode
material often limits the ultimate performance and potential of 2D
materials and devices. In this work, we demonstrate a localized femtosecond
(fs) laser irradiation process to substantially minimize the resistance
of MoS2–metal contacts. A reduction of the contact
resistance exceeding three orders of magnitude is achieved for mechanically
exfoliated MoS2, which remarkably improves the overall
FET performance. The underlying mechanisms of resistance reduction
are the removal of organic contamination induced by the transfer process,
as well as the lowering of Schottky barrier resistance (RSB) attributed to interface Fermi level pinning (FLP)
by Au diffusion, and the lowering of interlayer resistance (Rint) due to interlayer coupling enhancement
by Au intercalation under fs laser irradiation. By taking advantage
of the improved MoS2–metal contact behavior, a high-performance
MoS2 photodetector was developed with a photoresponsivity
of 68.8 A W–1 at quite a low Vds of 0.5 V, which is ∼80 times higher than the pristine
multilayer photodetector. This contamination-free, site-specific,
and universal photonic fabrication technique provides an effective
tool for the integration of complex 2D devices, and the mechanism
of MoS2–metal interface modification reveals a new
pathway to engineer the 2D material–metal interface
Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations
Decreasing
the interconnecting temperature is essential for 3D
and heterogeneous device integrations, which play indispensable roles
in the coming era of “more than Moore”. Although nanomaterials
exhibit a decreased onset temperature for interconnecting, such an
effect is always deeply impaired because of organic additives in practical
integrations. Meanwhile, current organic-free integration strategies
suffer from roughness and contaminants at the bonding interface. Herein,
a novel bilayer nanoarchitecture simultaneously overcomes the drawbacks
of organics and is highly tolerant to interfacial morphology, which
exhibits universal applicability for device-level integrations at
even room temperature, with the overall performance outperforming
most counterparts reported. This nanoarchitecture features a loose
nanoparticle layer with unprecedented deformability for interfacial
gap-filling, and a compact one providing firm bonding with the component
surface. The two distinct nanoparticle layers cooperatively enhance
the interconnecting performance by 73–357%. Apart from the
absence of organics, the internal abundant lattice disorders profoundly
accelerate the interconnecting process, which is supported by experiments
and molecular dynamics simulation. This nanoarchitecture is successfully
demonstrated in diversified applications including paper-based light-emitting
diodes, Cu–Cu micro-bonding, and SiC power modules. The strategy
proposed here can open a new paradigm for device integrations and
provide a fresh understanding on interconnecting mechanisms
DataSheet1_Aerosol-Assisted Deposition for TiO2 Immobilization on Photocatalytic Fibrous Filters for VOC Degradation.PDF
Atomization and spraying are well-established methods for the production of submicrometer- and micrometer- sized powders. In addition, they could be of interest to the immobilization of photocatalytic nanoparticles onto supports because they enable the formation of microporous films with photocatalytic activity. Here, we provide a comparison of aerosol-assisted immobilization methods, such as spray-drying (SD), spray atomization (SA), and spray gun (SG), which were used for the deposition of TiO2 dispersions onto fibrous filter media. The morphology, microstructure, and electronic properties of the structures with deposited TiO2 were characterized by SEM and TEM, BET and USAXS, and UV-Vis spectrometry, respectively. The photocatalytic performances of the functionalized filters were evaluated and compared to the benchmark dip-coating method. Our results showed that the SG and SA immobilization methods led to the best photocatalytic and operational performance for the degradation of toluene, whereas the SD method showed the lowest degradation efficiency and poor stability of coating. We demonstrated that TiO2 sprays using the SG and SA methods with direct deposition onto filter media involving dispersed colloidal droplets revealed to be promising alternatives to the dip-coating method owing to the ability to uniformly cover the filter fibers. In addition, the SA method allowed for fast and simple control of the coating thickness as the dispersed particles were continuously directed onto the filter media without the need for repetitive coatings, which is common for the SG and dip-coating methods. Our study highlighted the importance of the proper immobilization method for the efficient photocatalytic degradation of VOCs.</p