5 research outputs found
Junctionless Electric-Double-Layer MoS<sub>2</sub> Field-Effect Transistor with a Sub‑5 nm Thick Electrostatically Highly Doped Channel
Junctionless
transistors are suitable for sub-3 nm applications
because of their extremely simple structure and high electrical performance,
which compensate for short-channel effects. Two-dimensional semiconductor
transition-metal dichalcogenide materials, such as MoS2, may also resolve technical and fundamental issues for Si-based
technology. Here, we present the first junctionless electric-double-layer
field-effect transistor with an electrostatically highly doped 5 nm
thick MoS2 channel. A double-gated MoS2 transistor
with an ionic-liquid top gate and a conventional bottom gate demonstrated
good transfer characteristics with a 104 on–off
current ratio, a 70 mV dec–1 subthreshold swing
at a 0 V bottom-gate bias, and drain-current versus top-gate-voltage
characteristics were shifted left significantly with increasing bottom-gate
bias due to an electrostatically increased overall charge carrier
concentration in the MoS2 channel. When a bottom-gate bias
of 80 V was applied, a shoulder and two clear peak features were identified
in the transconductance and its derivative, respectively; this outcome
is typical of Si-based junctionless transistors. Furthermore, the
decrease in electron mobility induced by a transverse electric field
was reduced with increasing bottom-gate bias. Numerical simulations
and analytical models were used to support these findings, which clarify
the operation of junctionless MoS2 transistors with an
electrostatically highly doped channel
Few-Layer Black Phosphorus Field-Effect Transistors with Reduced Current Fluctuation
We investigated the reduction of current fluctuations in few-layer black phosphorus (BP) field-effect transistors resulting from Al<sub>2</sub>O<sub>3</sub> passivation. In order to verify the effect of Al<sub>2</sub>O<sub>3</sub> passivation on device characteristics, measurements and analyses were conducted on thermally annealed devices before and after the passivation. More specifically, static and low-frequency noise analyses were used in monitoring the charge transport characteristics in the devices. The carrier number fluctuation (CNF) model, which is related to the charge trapping/detrapping process near the interface between the channel and gate dielectric, was employed to describe the current fluctuation phenomena. Noise reduction due to the Al<sub>2</sub>O<sub>3</sub> passivation was expressed in terms of the reduced interface trap density values <i>D</i><sub>it</sub> and <i>N</i><sub>it</sub>, extracted from the subthreshold slope (SS) and the CNF model, respectively. The deviations between the interface trap density values extracted using the SS value and CNF model are elucidated in terms of the role of the Schottky barrier between the few-layer BP and metal contact. Furthermore, the preservation of the Al<sub>2</sub>O<sub>3</sub>-passivated few-layer BP flakes in ambient air for two months was confirmed by identical Raman spectra
Energy-Efficient III–V Tunnel FET-Based Synaptic Device with Enhanced Charge Trapping Ability Utilizing Both Hot Hole and Hot Electron Injections for Analog Neuromorphic Computing
A charge
trap device based on field-effect transistors (FET) is
a promising candidate for artificial synapses because of its high
reliability and mature fabrication technology. However, conventional
MOSFET-based charge trap synapses require a strong stimulus for synaptic
update because of their inefficient hot-carrier injection into the
charge trapping layer, consequently causing a slow speed operation
and large power consumption. Here, we propose a highly efficient charge
trap synapse using III–V materials-based tunnel field-effect
transistor (TFET). Our synaptic TFETs present superior subthreshold
swing and improved charge trapping ability utilizing both carriers
as charge trapping sources: hot holes created by impact ionization
in the narrow bandgap InGaAs after being provided from the p+-source, and band-to-band tunneling hot electrons (BBHEs) generated
at the abrupt p+n junctions in the TFETs. Thanks to these
advances, our devices achieved outstanding efficiency in synaptic
characteristics with a 5750 times faster synaptic update speed and
51 times lower sub-fJ/um2 energy consumption per single
synaptic update in comparison to the MOSFET-based synapse. An artificial
neural network (ANN) simulation also confirmed a high recognition
accuracy of handwritten digits up to ∼90% in a multilayer perceptron
neural network based on our synaptic devices
Brush-Shaped ZnO Heteronanorods Synthesized Using Thermal-Assisted Pulsed Laser Deposition
Brush-shaped ZnO heteronanostructures were synthesized using a newly designed thermal-assisted pulsed laser deposition (T-PLD) system that combines the advantages of pulsed laser deposition (PLD) and a hot furnace system. Branched ZnO nanostructures were successfully grown onto CVD-grown backbone nanowires by T-PLD. Although ZnO growth at 300 °C resulted in core–shell structures, brush-shaped hierarchical nanostructures were formed at 500–600 °C. Materials properties were studied via photoluminescence (PL), scanning electron microscopy (SEM) and transmission electron microscopy (TEM) characterizations. The enhanced photocurrent of a SnO<sub>2</sub>–ZnO heterostructures device by irradiation with 365 nm wavelength ultraviolet (UV) light was also investigated by the current–voltage characteristics
Modification of Electrical Properties of Graphene by Substrate-Induced Nanomodulation
A periodically
modulated graphene (PMG) generated by nanopatterned
surfaces is reported to profoundly modify the intrinsic electronic
properties of graphene. The temperature dependence of the sheet resistivity
and gate response measurements clearly show a semiconductor-like behavior.
Raman spectroscopy reveals significant shifts of the G and the 2D
modes induced by the interaction with the underlying grid-like nanostructure.
The influence of the periodic, alternating contact with the substrate
surface was studied in terms of strain caused by bending of graphene
and doping through chemical interactions with underlying substrate
atoms. Electronic structure calculations performed on a model of PMG
reveals that it is possible to tune a band gap within 0.14–0.19
eV by considering both the periodic mechanical bending and the surface
coordination chemistry. Therefore, the PMG can be regarded as a further
step toward band gap engineering of graphene devices
