Trialkylphosphine-Stabilized Copper(I) Dialkylaluminum(III) Ethanedithiolate Complexes: Single-Source Precursors and a Novel Modification of Copper Aluminum Disulfide

Four types of trialkylphosphine-stabilized copper dialkylaluminum ethanedithiolate complexes with the compositions [iPr3PCuSC2H4SAlR2]2 (R = Me, Et, iPr, tBu, vinyl), [(iPr3PCu)3(SC2H4S)2AlR2] (R = Et), [(Me3P)3CuSC2H4SAlR2] (R = Me, Et), and [(Me3P)4Cu]­[SC2H4SAlR2] (R = Me, Et, iPr) have been synthesized and structurally characterized by X-ray diffraction. The first series features an eight-membered (CuSAlS)2 ring as the core structure. The trimethylphosphine complexes can be distinguished as nonionic and ionic compounds, depending on the amount of trimethylphosphine. In systematic thermogravimetric studies, the complexes were converted into the ternary semiconductor CuAlS2. In this process, a novel wurtzite-type CuAlS2 phase was identified. Binary copper sulfide is observed as a minor side product in thermolysis reactions when volatile trialkylaluminum is released. The thermolysis reactions are completed at temperatures between 330 and 470 °C, depending on the aluminum alkyls. The Cu/Al ratio and phase purity of the thermolysis products were determined by Rietveld analysis of the powder X-ray diffraction patterns and by inductively coupled plasma optical emission spectroscopy measurements. To our knowledge, this is the first study of molecular single-source precursors for CuAlS2

Trialkylphosphine-Stabilized Copper(I) Dialkylaluminum(III) Ethanedithiolate Complexes: Single-Source Precursors and a Novel Modification of Copper Aluminum Disulfide

Four types of trialkylphosphine-stabilized copper dialkylaluminum ethanedithiolate complexes with the compositions [iPr3PCuSC2H4SAlR2]2 (R = Me, Et, iPr, tBu, vinyl), [(iPr3PCu)3(SC2H4S)2AlR2] (R = Et), [(Me3P)3CuSC2H4SAlR2] (R = Me, Et), and [(Me3P)4Cu]­[SC2H4SAlR2] (R = Me, Et, iPr) have been synthesized and structurally characterized by X-ray diffraction. The first series features an eight-membered (CuSAlS)2 ring as the core structure. The trimethylphosphine complexes can be distinguished as nonionic and ionic compounds, depending on the amount of trimethylphosphine. In systematic thermogravimetric studies, the complexes were converted into the ternary semiconductor CuAlS2. In this process, a novel wurtzite-type CuAlS2 phase was identified. Binary copper sulfide is observed as a minor side product in thermolysis reactions when volatile trialkylaluminum is released. The thermolysis reactions are completed at temperatures between 330 and 470 °C, depending on the aluminum alkyls. The Cu/Al ratio and phase purity of the thermolysis products were determined by Rietveld analysis of the powder X-ray diffraction patterns and by inductively coupled plasma optical emission spectroscopy measurements. To our knowledge, this is the first study of molecular single-source precursors for CuAlS2

Trialkylphosphine-Stabilized Copper(I) Dialkylaluminum(III) Ethanedithiolate Complexes: Single-Source Precursors and a Novel Modification of Copper Aluminum Disulfide

Four types of trialkylphosphine-stabilized copper dialkylaluminum ethanedithiolate complexes with the compositions [iPr3PCuSC2H4SAlR2]2 (R = Me, Et, iPr, tBu, vinyl), [(iPr3PCu)3(SC2H4S)2AlR2] (R = Et), [(Me3P)3CuSC2H4SAlR2] (R = Me, Et), and [(Me3P)4Cu]­[SC2H4SAlR2] (R = Me, Et, iPr) have been synthesized and structurally characterized by X-ray diffraction. The first series features an eight-membered (CuSAlS)2 ring as the core structure. The trimethylphosphine complexes can be distinguished as nonionic and ionic compounds, depending on the amount of trimethylphosphine. In systematic thermogravimetric studies, the complexes were converted into the ternary semiconductor CuAlS2. In this process, a novel wurtzite-type CuAlS2 phase was identified. Binary copper sulfide is observed as a minor side product in thermolysis reactions when volatile trialkylaluminum is released. The thermolysis reactions are completed at temperatures between 330 and 470 °C, depending on the aluminum alkyls. The Cu/Al ratio and phase purity of the thermolysis products were determined by Rietveld analysis of the powder X-ray diffraction patterns and by inductively coupled plasma optical emission spectroscopy measurements. To our knowledge, this is the first study of molecular single-source precursors for CuAlS2

Trialkylphosphine-Stabilized Copper(I) Dialkylaluminum(III) Ethanedithiolate Complexes: Single-Source Precursors and a Novel Modification of Copper Aluminum Disulfide

Four types of trialkylphosphine-stabilized copper dialkylaluminum ethanedithiolate complexes with the compositions [^<i>i</i>Pr₃PCuSC₂H₄SAlR₂]₂ (R = Me, Et, ^<i>i</i>Pr, ^<i>t</i>Bu, vinyl), [(^<i>i</i>Pr₃PCu)₃(SC₂H₄S)₂AlR₂] (R = Et), [(Me₃P)₃CuSC₂H₄SAlR₂] (R = Me, Et), and [(Me₃P)₄Cu]­[SC₂H₄SAlR₂] (R = Me, Et, ^<i>i</i>Pr) have been synthesized and structurally characterized by X-ray diffraction. The first series features an eight-membered (CuSAlS)₂ ring as the core structure. The trimethylphosphine complexes can be distinguished as nonionic and ionic compounds, depending on the amount of trimethylphosphine. In systematic thermogravimetric studies, the complexes were converted into the ternary semiconductor CuAlS₂. In this process, a novel wurtzite-type CuAlS₂ phase was identified. Binary copper sulfide is observed as a minor side product in thermolysis reactions when volatile trialkylaluminum is released. The thermolysis reactions are completed at temperatures between 330 and 470 °C, depending on the aluminum alkyls. The Cu/Al ratio and phase purity of the thermolysis products were determined by Rietveld analysis of the powder X-ray diffraction patterns and by inductively coupled plasma optical emission spectroscopy measurements. To our knowledge, this is the first study of molecular single-source precursors for CuAlS₂

Trialkylphosphine-Stabilized Copper(I) Dialkylaluminum(III) Ethanedithiolate Complexes: Single-Source Precursors and a Novel Modification of Copper Aluminum Disulfide

Four types of trialkylphosphine-stabilized copper dialkylaluminum ethanedithiolate complexes with the compositions [^<i>i</i>Pr₃PCuSC₂H₄SAlR₂]₂ (R = Me, Et, ^<i>i</i>Pr, ^<i>t</i>Bu, vinyl), [(^<i>i</i>Pr₃PCu)₃(SC₂H₄S)₂AlR₂] (R = Et), [(Me₃P)₃CuSC₂H₄SAlR₂] (R = Me, Et), and [(Me₃P)₄Cu]­[SC₂H₄SAlR₂] (R = Me, Et, ^<i>i</i>Pr) have been synthesized and structurally characterized by X-ray diffraction. The first series features an eight-membered (CuSAlS)₂ ring as the core structure. The trimethylphosphine complexes can be distinguished as nonionic and ionic compounds, depending on the amount of trimethylphosphine. In systematic thermogravimetric studies, the complexes were converted into the ternary semiconductor CuAlS₂. In this process, a novel wurtzite-type CuAlS₂ phase was identified. Binary copper sulfide is observed as a minor side product in thermolysis reactions when volatile trialkylaluminum is released. The thermolysis reactions are completed at temperatures between 330 and 470 °C, depending on the aluminum alkyls. The Cu/Al ratio and phase purity of the thermolysis products were determined by Rietveld analysis of the powder X-ray diffraction patterns and by inductively coupled plasma optical emission spectroscopy measurements. To our knowledge, this is the first study of molecular single-source precursors for CuAlS₂

The Influence of Surface Topography and Surface Chemistry on the Anti-Adhesive Performance of Nanoporous Monoliths

We designed spongy monoliths allowing liquid delivery to their surfaces through continuous nanopore systems (mean pore diameter ∼40 nm). These nanoporous monoliths were flat or patterned with microspherical structures a few tens of microns in diameter, and their surfaces consisted of aprotic polymer or of TiO2 coatings. Liquid may reduce adhesion forces FAd; possible reasons include screening of solid–solid interactions and poroelastic effects. Softening-induced deformation of flat polymeric monoliths upon contact formation in the presence of liquids enhanced the work of separation WSe. On flat TiO2-coated monoliths, WSe was smaller under wet conditions than under dry conditions, possibly because of liquid-induced screening of solid–solid interactions. Under dry conditions, WSe is larger on flat TiO2-coated monoliths than on flat monoliths with a polymeric surface. However, under wet conditions, liquid-induced softening results in larger WSe on flat monoliths with a polymeric surface than on flat monoliths with an oxidic surface. Monolithic microsphere arrays show antiadhesive properties; FAd and WSe are reduced by at least 1 order of magnitude as compared to flat nanoporous counterparts. On nanoporous monolithic microsphere arrays, capillarity (WSe is larger under wet than under dry conditions) and solid–solid interactions (WSe is larger on oxide than on polymer) dominate contact mechanics. Thus, the microsphere topography reduces the impact of softening-induced surface deformation and screening of solid–solid interactions associated with liquid supply. Overall, simple modifications of surface topography and chemistry combined with delivery of liquid to the contact interface allow adjusting WSe and FAd over at least 1 order of magnitude. Adhesion management with spongy monoliths exploiting deployment (or drainage) of interfacial liquids as well as induction or prevention of liquid-induced softening of the monoliths may pave the way for the design of artificial surfaces with tailored contact mechanics. Moreover, the results reported here may contribute to better understanding of the contact mechanics of biological surfaces