2,866 research outputs found
Characterisation of a Thin Fully Depleted SOI Pixel Sensor with High Momentum Charged Particles
This paper presents the results of the characterisation of a thin, fully
depleted pixel sensor manufactured in SOI technology on high-resistivity
substrate with high momentum charged particles. The sensor is thinned to 70
m and a thin phosphor layer contact is implanted on the back-plane. Its
response is compared to that of thick sensors of same design in terms of signal
and noise, detection efficiency and single point resolution based on data
collected with 300 GeV pions at the CERN SPS. We observe that the charge
collected and the signal-to-noise ratio scale according to the estimated
thickness of the sensitive volume and the efficiency and single point
resolution of the thinned chip are comparable to those measured for the thick
sensors.Comment: 8 pages, 3 figures, submitted to Nucl. Instr. and Meth., section
Characterisation of a Thin Fully-Depleted SOI Pixel Sensor with Soft X-ray Radiation
This paper presents the results of the characterisation of a back-illuminated
pixel sensor manufactured in Silicon-On-Insulator technology on a
high-resistivity substrate with soft X-rays. The sensor is thinned and a thin
Phosphor layer contact is implanted on the back-plane. The response to X-rays
from 2.12 up to 8.6 keV is evaluated with fluorescence radiation at the LBNL
Advanced Light Source.Comment: 9 pages, 5 figures, submitted to Nuclear Instruments and Methods
Monolithic Pixel Sensors in Deep-Submicron SOI Technology with Analog and Digital Pixels
This paper presents the design and test results of a prototype monolithic
pixel sensor manufactured in deep-submicron fully-depleted Silicon-On-Insulator
(SOI) CMOS technology. In the SOI technology, a thin layer of integrated
electronics is insulated from a (high-resistivity) silicon substrate by a
buried oxide. Vias etched through the oxide allow to contact the substrate from
the electronics layer, so that pixel implants can be created and a reverse bias
can be applied. The prototype chip, manufactured in OKI 0.15 micron SOI
process, features both analog and digital pixels on a 10 micron pitch. Results
of tests performed with infrared laser and 1.35 GeV electrons and a first
assessment of the effect of ionising and non-ionising doses are discussed.Comment: 5 pages, 7 figures, submitted to Nuclear Instruments and Methods
Measurement of the Associated Production Cross Section in Collisions at TeV
We present the first measurement of associated direct photon + muon
production in hadronic collisions, from a sample of 1.8 TeV
collisions recorded with the Collider Detector at Fermilab. Quantum
chromodynamics (QCD) predicts that these events are primarily from the Compton
scattering process , with the final state charm quark producing
a muon. Hence this measurement is sensitive to the charm quark content of the
proton. The measured cross section of is compared to a
leading-order QCD parton shower model as well as a next-to-leading-order QCD
calculation.Comment: 12 pages, 4 figures Added more detailed description of muon
background estimat
Inclusive jet cross section in collisions at TeV
The inclusive jet differential cross section has been measured for jet
transverse energies, , from 15 to 440 GeV, in the pseudorapidity region
0.10.7. The results are based on 19.5 pb of data
collected by the CDF collaboration at the Fermilab Tevatron collider. The data
are compared with QCD predictions for various sets of parton distribution
functions. The cross section for jets with GeV is significantly
higher than current predictions based on O() perturbative QCD
calculations. Various possible explanations for the high- excess are
discussed.Comment: 8 pages with 2 eps uu-encoded figures Submitted to Physical Review
Letter
Measurement of Dijet Angular Distributions at CDF
We have used 106 pb^-1 of data collected in proton-antiproton collisions at
sqrt(s)=1.8 TeV by the Collider Detector at Fermilab to measure jet angular
distributions in events with two jets in the final state. The angular
distributions agree with next to leading order (NLO) predictions of Quantum
Chromodynamics (QCD) in all dijet invariant mass regions. The data exclude at
95% confidence level (CL) a model of quark substructure in which only up and
down quarks are composite and the contact interaction scale is Lambda_ud(+) <
1.6 TeV or Lambda_ud(-) < 1.4 TeV. For a model in which all quarks are
composite the excluded regions are Lambda(+) < 1.8 TeV and Lambda(-) < 1. 6
TeV.Comment: 16 pages, 2 figures, 2 tables, LaTex, using epsf.sty. Submitted to
Physical Review Letters on September 17, 1996. Postscript file of full paper
available at http://www-cdf.fnal.gov/physics/pub96/cdf3773_dijet_angle_prl.p
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