3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations

3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations

3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations

Additive manufacturing: unlocking the evolution of energy materials

The global energy infrastructure is undergoing a drastic transformation towards renewable energy, posing huge challenges on the energy materials research, development and manufacturing. Additive manufacturing has shown its promise to change the way how future energy system can be designed and delivered. It offers capability in manufacturing complex 3D structures, with near-complete design freedom and high sustainability due to minimal use of materials and toxic chemicals. Recent literatures have reported that additive manufacturing could unlock the evolution of energy materials and chemistries with unprecedented performance in the way that could never be achieved by conventional manufacturing techniques. This comprehensive review will fill the gap in communicating on recent breakthroughs in additive manufacturing for energy material and device applications. It will underpin the discoveries on what 3D functional energy structures can be created without design constraints, which bespoke energy materials could be additively manufactured with customised solutions, and how the additively manufactured devices could be integrated into energy systems. This review will also highlight emerging and important applications in energy additive manufacturing, including fuel cells, batteries, hydrogen, solar cell as well as carbon capture and storage

Additive Manufacturing: Unlocking the Evolution of Energy Materials

The global energy infrastructure is undergoing a drastic transformation towards renewable energy, posing huge challenges on the energy materials research, development and manufacturing. Additive manufacturing has shown its promise to change the way how future energy system can be designed and delivered. It offers capability in manufacturing complex 3D structures, with near-complete design freedom and high sustainability due to minimal use of materials and toxic chemicals. Recent literatures have reported that additive manufacturing could unlock the evolution of energy materials and chemistries with unprecedented performance in the way that could never be achieved by conventional manufacturing techniques. This comprehensive review will fill the gap in communicating on recent breakthroughs in additive manufacturing for energy material and device applications. It will underpin the discoveries on what 3D functional energy structures can be created without design constraints, which bespoke energy materials could be additively manufactured with customised solutions, and how the additively manufactured devices could be integrated into energy systems. This review will also highlight emerging and important applications in energy additive manufacturing, including fuel cells, batteries, hydrogen, solar cell as well as carbon capture and storage

Conformable light emitting modules

As we become increasingly aware that there is more to light than the image it forms on our retina, and as we become more environmentally aware, the value of non-image-forming light increases along with the need for various new light related appliances. In particular, some lighting related applications are emerging which demand conformability (flexibility and stretchability). Well-being, automotive or wearable electronic applications are just a few examples where these trends can be observed. We are finding that conformability could bring various benefits to both users (tactile and optical comfort, optical efficiency, multi-functionality, work/living space savings) as well as manufacturers (heterogeneous integration, light-weight, design freedom, differentiation and less stringent tolerancing). Developed by Ghent University, the SMI (Stretchable Molded Interconnect) technology attempts to address these demands and has been the main focus of this work. With the SMI technology it was possible to design highly conformable circuits using fabrication methods similar to these found in the PCB and FCB industries and standard off-the-shelf electronic components. The goal of this work was to characterize the technology materials in terms of mechanical, optical and reliability performance as well as define a set of design rules to support creation of robust and efficient light modules, also using a set of new, commercially available elastomeric, polymer materials. The developments are illustrated with demonstration devices

From melt- to solid-stage polycondensation: how to revolutionize the design of environmentally friendly polymers with advanced properties

editorial reviewe

Transparent Silver Nanowire Bottom Electrodes in Organic Solar Cells

Organic solar cells (OSCs) is an emerging photovoltaic technology that opens up new application areas where common inorganic techniques are not able to score. Some of those key features are flexibility, light weight, semitransparency, and low cost processing. The current industry-standard for the transparent electrode, indium tin oxide (ITO), cannot provide these properties because it is brittle and expensive. This thesis aims to investigate an alternative type of promising transparent electrode: silver nanowire (AgNW) networks. They exhibit similar or even better optical and electrical performance than ITO down to a sheet resistance of 12 Ohm/sq at 84% transmission (including the glass substrate). Furthermore, AgNWs are more flexible, solution-processable, and more cost-effective than ITO. However, two challenges occur during implementation as bottom electrode in OSCs. First, their inherently high roughness causes devices to shunt. Second, the AgNW network structure exhibits – in contrast to the continuous ITO – µm²-sized voids that have to be bridged electrically by the organic layers. In the first part of this thesis, solution-processed small molecule charge transport layers are investigated. In the case of hole transport layers (HTL), the host BF-DPB and the dopant NDP9 are investigated using tetrahydrofuran as a solvent. It is shown that BF-DPB is already doped by NDP9 in solution via the formation of a hybrid molecule complex. Solution-processed layers exhibit similar conductivities as compared to the reference deposition, which is thermal evaporation in high vacuum. The layers sufficiently smoothen the AgNW electrode such that DCV5T-Me:C60 organic solar cells with an efficiency up to 4.4% are obtained. Moreover, the influence of the square micrometer large network voids is investigated using HTLs of varying conductivity. As a result, a minimum conductivity of 1e−4 S/cm is needed to avoid macroscopic performance losses. Equivalent circuit simulations are performed to confirm these results. As a second planarization method, the AgNWs are buried in an insulating polymer that serves concurrently as flexible and ultrathin substrate. Out of three different polymers tested, the optical adhesive ’NOA63’ gives the best results. The roughness is strongly reduced from 30 nm down to (2 ± 1) nm. Two different OSC types are employed as testing devices with fully-flexible alumina encapsulation against moisture ingress. Maximum power conversion efficiencies of 5.0% and 5.6% are achieved with a fullerene-free cascade layer architecture and a DCV5T-Me:C60 OSC, respectively. To evaluate the applicability of these fully-flexible and encapsulated devices, degradation studies are performed under continuous illumination and a humid climate. Although employing the intrinsically stable DCV5T-Me:C60 stack design, within one day a fast degradation of the fully-flexible solar cells is observed. The degradation is attributed to AgNW electrode failure that results from photo-oxidation and -sulfurization, photo-migration, and electromigration. It is further shown that the cascade organic solar cell lacks intrinsic stability. In summary, efficient, fully-flexible, and encapsulated devices are shown. However, in terms of competitive OSCs, the low stability of AgNW electrodes is a challenge to be taken care of. In current research, this issue needs to be addressed more frequently.Organische Solarzellen (OSZ) sind ein junges Forschungsgebiet der Photovoltaik, welches neue Anwendungsgebiete erschließt, für die herkömmliche anorganische Solarzellen nicht einsetzbar sind. Einige der Haupteigenschaften sind Flexibilität, niedriges Gewicht, Teiltransparenz und geringe Herstellungskosten. Indiumzinnoxid (ITO), der aktuelle Industriestandard transparenter Elektrodentechnologie, ist nicht in der Lage, diese Eigenschaften zu gewährleisten. Dies liegt vor allem an der Brüchigkeit von ITO und der begrenzten Verfügbarkeit von Indium, welche mit einem hohen Preis einhergeht. Das Ziel dieser Dissertation ist die Integration einer alternativen und vielversprechenden Elektrodentechnologie: Netzwerke aus Silbernanodrähten (AgNWs). Mit einem Schichtwiderstand von 12 Ohm/sq bei einer Transmission von 84% (inklusive Glassubstrat) besitzen sie ähnliche oder sogar bessere optische und elektrische Eigenschaften als ITO. Des Weiteren sind AgNW-Elektroden flexibler und kostengünstiger als ITO und aus flüssiger Phase prozessierbar. Es gibt allerdings zwei Herausforderungen, welche die Integration als Grundelektrode in OSZ erschweren. Zum einen sind AgNW-Netzwerke sehr rauh, sodass organische Bauteile kurzgeschlossen werden. Zum anderen weisen AgNW-Elektroden, im Gegensatz zu einer vollflächigen ITO-Schicht, Lücken zwischen den einzelnen Drähten auf. Diese Lücken müssen von den organischen Schichten der OSZ elektrisch überbrückt werden. Im ersten Teil der Arbeit werden daher flüssigprozessierte Ladungsträgertransportschichten aus kleinen Molekülen untersucht, welche die AgNW-Elektroden glätten und die verhältnismäßig großen Lücken füllen sollen. Im Falle von Lochleitschichten (HTL) wird BF-DPB als Matrix und NDP9 als Dotand in Tetrahydrofuran gelöst und zur Anwendung gebracht. BF-DPB wird dabei schon in Lösung von NDP9 dotiert, wobei sich ein Hybridmolekülkomplex ausbildet. Die Leitfähigkeit der entstehenden Schichten ist ähnlich zu Referenzschichten, die durch thermisches Verdampfen im Hochvakuum hergestellt wurden. Die erhaltenen HTLs glätten die AgNW-Elektroden, sodass DCV5T-Me:C60-Solarzellen mit einer Effizienz von maximal 4.4% hergestellt werden können. Weiterhin wird der Einfluss der quadratmikrometergroßen Löcher auf die makroskopische Effizienz der Solarzelle in Abhängigkeit der HTL Leitfähigkeit untersucht. Um signifikante Effizienzverluste zu verhindern, muss der HTL eine minimale Leitfähigkeit von etwa 1e−4 S/cm aufweisen. Simulationen eines Ersatzschaltkreises bestätigen hierbei die experimentellen Ergebnisse. Im zweiten Teil der Arbeit wird eine Planarisierungsmethode untersucht, in welcher die AgNWs in nichtleitfähigen Polymeren eingebettet werden. Diese Polymere fungieren anschließend als flexibles Substrat. Der optische Kleber ”NOA63” erzielt hierbei die besten Ergebnisse. Die Rauheit der AgNW-Elektroden wird von etwa 30 nm auf 1 bis 3 nm stark reduziert. Anschließend werden diese AgNW-Elektroden in zwei unterschiedlichen OSZ Konfigurationen getestet und mit einer vollflexiblen Schicht aus Aluminiumoxid gegen Wasserdampfpermeation verkapselt. Somit können maximale Effizienzen von 5% mithilfe einer organischen Kaskadenstruktur und 5.6% mit DCV5T-Me:C60 OSZ erreicht werden. Um die Anwendbarkeit dieser vollflexiblen und verkapselten OSZ zu bewerten, werden Alterungsstudien unter konstanter Beleuchtung und feuchtem Klima durchgeführt. Es wird gezeigt, dass die in das Polymer eingebettete AgNW-Elektrode aufgrund von Photooxidation und -schwefelung und Photo- und Elektromigration instabil ist. Dieser Sachverhalt ist für die Anwendung von AgNW-Elektroden in kommerziellen OSZ von großer Bedeutung und wurde in der Forschung bisher nicht ausreichend thematisiert

Inorganic micro/nanostructures-based high-performance flexible electronics for electronic skin application

Electronics in the future will be printed on diverse substrates, benefiting several emerging applications such as electronic skin (e-skin) for robotics/prosthetics, flexible displays, flexible/conformable biosensors, large area electronics, and implantable devices. For such applications, electronics based on inorganic micro/nanostructures (IMNSs) from high mobility materials such as single crystal silicon and compound semiconductors in the form of ultrathin chips, membranes, nanoribbons (NRs), nanowires (NWs) etc., offer promising high-performance solutions compared to conventional organic materials. This thesis presents an investigation of the various forms of IMNSs for high-performance electronics. Active components (from Silicon) and sensor components (from indium tin oxide (ITO), vanadium pentaoxide (V2O5), and zinc oxide (ZnO)) were realised based on the IMNS for application in artificial tactile skin for prosthetics/robotics. Inspired by human tactile sensing, a capacitive-piezoelectric tandem architecture was realised with indium tin oxide (ITO) on a flexible polymer sheet for achieving static (upto 0.25 kPa-1 sensitivity) and dynamic (2.28 kPa-1 sensitivity) tactile sensing. These passive tactile sensors were interfaced in extended gate mode with flexible high-performance metal oxide semiconductor field effect transistors (MOSFETs) fabricated through a scalable process. The developed process enabled wafer scale transfer of ultrathin chips (UTCs) of silicon with various devices (ultrathin chip resistive samples, metal oxide semiconductor (MOS) capacitors and n‐channel MOSFETs) on flexible substrates up to 4″ diameter. The devices were capable of bending upto 1.437 mm radius of curvature and exhibited surface mobility above 330 cm2/V-s, on-to-off current ratios above 4.32 decades, and a subthreshold slope above 0.98 V/decade, under various bending conditions. While UTCs are useful for realizing high-density high-performance micro-electronics on small areas, high-performance electronics on large area flexible substrates along with low-cost fabrication techniques are also important for realizing e-skin. In this regard, two other IMNS forms are investigated in this thesis, namely, NWs and NRs. The controlled selective source/drain doping needed to obtain transistors from such structure remains a bottleneck during post transfer printing. An attractive solution to address this challenge based on junctionless FETs (JLFETs), is investigated in this thesis via technology computer-aided design (TCAD) simulation and practical fabrication. The TCAD optimization implies a current of 3.36 mA for a 15 μm channel length, 40 μm channel width with an on-to-off ratio of 4.02x 107. Similar to the NRs, NWs are also suitable for realizing high performance e-skin. NWs of various sizes, distribution and length have been fabricated using various nano-patterning methods followed by metal assisted chemical etching (MACE). Synthesis of Si NWs of diameter as low as 10 nm and of aspect ratio more than 200:1 was achieved. Apart from Si NWs, V2O5 and ZnO NWs were also explored for sensor applications. Two approaches were investigated for printing NWs on flexible substrates namely (i) contact printing and (ii) large-area dielectrophoresis (DEP) assisted transfer printing. Both approaches were used to realize electronic layers with high NW density. The former approach resulted in 7 NWs/μm for bottom-up ZnO and 3 NWs/μm for top-down Si NWs while the latter approach resulted in 7 NWs/μm with simultaneous assembly on 30x30 electrode patterns in a 3 cm x 3 cm area. The contact-printing system was used to fabricate ZnO and Si NW-based ultraviolet (UV) photodetectors (PDs) with a Wheatstone bridge (WB) configuration. The assembled V2O5 NWs were used to realize temperature sensors with sensitivity of 0.03% /K. The sensor arrays are suitable for tactile e-skin application. While the above focuses on realizing conventional sensing and addressing elements for e-skin, processing of a large amount of data from e-skin has remained a challenge, especially in the case of large area skin. A Neural NW Field Effect Transistors (υ-NWFETs) based hardware-implementable neural network (HNN) approach for tactile data processing in e-skin is presented in the final part of this thesis. The concept is evaluated by interfacing with a fabricated kirigami-inspired e-skin. Apart from e-skin for prosthetics and robotics, the presented research will also be useful for obtaining high performance flexible circuits needed in many futuristic flexible electronics applications such as smart surgical tools, biosensors, implantable electronics/electroceuticals and flexible mobile phones