Nondestructive leak testing

Method provides opportunity to effect repairs without compromising integrity of enclosed circuitry or mechanism by loss of atmosphere or by ingestion of foreign matter or gas. It is possible to detect leaks in modules which are sealed while fully evacuated, partially evacuated, or containing some form of gas

Microwave holography for nondestructive testing

Holographic methods permit use of very large effective apertures so that weak signals can be collected over wide area and integrated to form image. Technique, modification of side-looking radar principle, can be used at very short ranges needed for nondestructive inspection of test specimens

Holographic nondestructive testing of laminates

Very small differences in laminate thickness result in interference fringes in holograph image. These indicate presence of unbonded area. Theoretical knowledge of membrane deflection may be used in conjunction with reduced number of pretest experiments to determine number of optical fringes that should appear for given laminate

Nondestructive testing using ultrasonic sensor

Nondestructive testing (NDT) is the process of inspection or evaluating materials or component without destroying the functionality, serviceability and the structure of the testing product. Therefore, after the inspection is done the testing product can still be used as usual compared to the destructive testing that can cause the damage to the testing product. In the other word destructive testing has limitation because of the technique need a sampling product rather than on the materials is already put into the service. NDT are often used to determine the properties of the materials such as strengthen ductility, porosity and toughness. Todays, NDT are widely used in industries, manufacturing, and fabrication and in service inspection to ensure the quality of the product. Besides that, NDT also can reduce production cost by minimize the damage onto the product and also can reduce the production time by without damaging the testing product. Also in construction field, there are many benefits from NDT process toward this area such as to evaluate the strength of concrete. There are many method of NDT today such as Magnetic Particle Testing, Ultrasonic Testing, and Vibration Analysis. For testing of the building basically people are used the Ultrasonic Pulse Velocity (UPV) and Rebound Hammer. This paper is specifically discussed about the Nondestructive Testing (NDT) by using Ultrasonic

Nondestructive testing of microtab welds

Introduction of sinusoidal signal across welded structure to determine reliability of integrated circuit connections is discussed. In-phase frequencies and quadrature frequency functions are used to evaluate weld reliability. Schematic diagram of test equipment and components is provided

Holographic system for nondestructive testing

A description is given of a holographic system for nondestructive testing. The system is comprised of a mirror which illuminates the test object surface; the mirror is positionable to direct illumination on an object at varying angles with respect to a line normal to the surface of the object. In this manner holograms may be produced with varying degrees of sensitivity enabling optimum observation of dimensions of deformation of an object occurring between test exposures

Handbooks describe eddy current techniques used in nondestructive testing of metal parts and components

Handbooks describe eddy current techniques used in nondestructive testing of metal parts and components

Instruction manuals for liquid penetrant nondestructive testing

Manuals provide quality control and test personnel with basic information on liquid penetrant testing. Topics covered include scope of application, equipment and materials used, test procedures, safety precautions, quality control, and comparison of liquid penetrant testing with other nondestructive testing processes

Nondestructive testing for evaluation of strength of bonded material

Nondestructive testing of adhesive bond strengt

Holographic stress analysis

Device for nondestructive testing of soldered joints correlates stress with load to predict printed circuit board lifetime