Non-invasive monitoring and control in silicon photonics by CMOS integrated electronics

As photonics breaks away from today's device level toward large scale of integration and complex systems-on-a-chip, concepts like monitoring, control and stabilization of photonic integrated circuits emerge as new paradigms. Here, we show non-invasive monitoring and feedback control of high quality factor silicon photonics resonators assisted by a transparent light detector directly integrated inside the cavity. Control operations are entirely managed by a CMOS microelectronic circuit, hosting many parallel electronic read-out channels, that is bridged to the silicon photonics chip. Advanced functionalities, such as wavelength tuning, locking, labeling and swapping are demonstrated. The non-invasive nature of the transparent monitor and the scalability of the CMOS read-out system offer a viable solution for the control of arbitrarily reconfigurable photonic integrated circuits aggregating many components on a single chip

Automated routing and control of silicon photonic switch fabrics

Automatic reconfiguration and feedback controlled routing is demonstrated in an 8×8 silicon photonic switch fabric based on Mach-Zehnder interferometers. The use of non-invasive Contactless Integrated Photonic Probes (CLIPPs) enables real-time monitoring of the state of each switching element individually. Local monitoring provides direct information on the routing path, allowing an easy sequential tuning and feedback controlled stabilization of the individual switching elements, thus making the switch fabric robust against thermal crosstalk, even in the absence of a cooling system for the silicon chip. Up to 24 CLIPPs are interrogated by a multichannel integrated ASIC wire-bonded to the photonic chip. Optical routing is demonstrated on simultaneous WDM input signals that are labelled directly on-chip by suitable pilot tones without affecting the quality of the signals. Neither preliminary circuit calibration nor lookup tables are required, being the proposed control scheme inherently insensible to channels power fluctuations

All-optical mode unscrambling on a silicon photonic chip

Propagation of light beams through scattering or multimode systems may lead to randomization of the spatial coherence of the light. Although information is not lost, its recovery requires a coherent interferometric reconstruction of the original signals, which have been scrambled into the modes of the scattering system. Here, we show that we can automatically unscramble four optical beams that have been arbitrarily mixed in a multimode waveguide, undoing the scattering and mixing between the spatial modes through a mesh of silicon photonics Mach-Zehnder interferometers. Using embedded transparent detectors and a progressive tuning algorithm, the mesh self-configures automatically and reset itself after significantly perturbing the mixing, without turning off the beams. We demonstrate the recovery of four separate 10 Gbits/s information channels, with residual cross-talk between beams of -20dB. This principle of self-configuring and self-resetting in optical systems should be applicable in a wide range of optical applications.Comment: 23 pages, 10 figure

On-Chip OSNR Monitoring with Silicon Photonics Transparent Detector

Non-invasive integrated detectors, named contactless integrated photonic probe (CLIPP), are employed to demonstrate on-chip noise-independent power monitoring of optical channels and in-band optical signal to noise ratio (OSNR) measurement. The proposed technique is based on a two-step lock-in demodulation of optical signals that are suitably labeled with low-modulation-index labels. We demonstrate OSNR measurement from 8 up to 27 dB/0.1 nm on 10-Gb/s ON-OFF keying signals with a power level ranging from -25 up to -15 dBm. This approach provides a promising tool for the monitoring of channels in reconfigurable optical networks with flexible channel allocation strategy, where the small channel separation makes the measurement of the in-band OSNR challenging

Automated routing and control of silicon photonic switch fabrics

Automatic reconfiguration and feedback controlled routing is demonstrated in an 8×8 silicon photonic switch fabric based on Mach-Zehnder interferometers. The use of non-invasive Contactless Integrated Photonic Probes (CLIPPs) enables realtime monitoring of the state of each switching element individually. Local monitoring provides direct information on the routing path, allowing an easy sequential tuning and feedback controlled stabilization of the individual switching elements, thus making the switch fabric robust against thermal crosstalk, even in the absence of a cooling system for the silicon chip. Up to 24 CLIPPs are interrogated by a multichannel integrated ASIC wirebonded to the photonic chip. Optical routing is demonstrated on simultaneous WDM input signals that are labelled directly on-chip by suitable pilot tones without affecting the quality of the signals. Neither preliminary circuit calibration nor lookup tables are required, being the proposed control scheme inherently insensible to channels power fluctuations

Vertically Aligned Graphene Prepared by Photonic Annealing for Ultrasensitive Biosensors

Graphene exhibits excellent physical, electronic, and chemical properties that are highly desirable for biosensing applications. However, most graphene biosensors are based on graphene lying flat on a substrate and therefore do not utilize its maximum specific surface area for ultrasensitive detection. Herein, we report the novel use of photonic annealing on a flexographically printed graphene–ethyl cellulose composite to produce vertically aligned graphene (VAG) biosensors for ultrasensitive detection of algal toxins in drinking water. These VAG structures, which maximized the specific surface area of graphene, were formed by partial removal of the polymeric binder upon applying intense pulsed light on the printed graphene. A label-free and low-cost VAG biosensor based on a non-faradaic electrochemical impedance spectroscopy technique was fabricated. The biosensor exhibited a limit of detection of 1.2 ng/L for microcystin-LR in local tap water. Such an ultrasensitive VAG biosensor is suitable for low-cost mass production using an integrated roll-to-roll flexographic printing with rapid photonic annealing technique

Silicon - polymer hybrid integrated microwave photonic devices for optical interconnects and electromagnetic wave detection

textThe accelerating increase in information traffic demands the expansion of optical access network systems that require high-performance optical and photonic components. In short-range communication links, optical interconnects have been widely accepted as a viable approach to solve the problems that copper based electrical interconnects have encountered in keeping up with the surge in the data rate demand over the last decades. Low cost, ease of fabrication, and integration capabilities of low optical-loss polymers make them attractive for integrated photonic applications to support futuristic data communication networks. In addition to passive wave-guiding components, electro-optic (EO) polymers consisting of a polymeric matrix doped with organic nonlinear chromophores have enabled wide-RF-bandwidth and low-power active photonic devices. Beside board level passive and active optical components, on-chip micro- or nano-photonic devices have been made possible by the hybrid integration of EO polymers onto the silicon platform. In recent years, silicon photonics have attracted a significant amount of attentions, because it offers compact device size and the potential of complementary metal–oxide–semiconductor (CMOS) compatible photonic integrated circuits. The combination of silicon photonics and EO polymers can enable miniaturized and high-performance hybrid integrated photonic devices, such as electro-optic modulators, optical interconnects, and microwave photonic sensors. Silicon photonic crystal waveguides (PCWs) exhibit slow-light effects which are beneficial for device miniaturization. Especially, EO polymer filled silicon slotted PCWs further reduce the device size and enhance the device performance by combining the best of these two systems. The potential applications of these silicon-polymer hybrid integrated devices include not only optical interconnects, but also optical sensing and microwave photonics. In this dissertation, the design, fabrication, and characterization of several types of silicon-polymer hybrid photonic devices will be presented, including EO polymer filled silicon PCW modulators for on-chip optical interconnects, antenna-coupled optical modulators for electromagnetic wave detections, and low-loss strip-to-slot PCW mode converters. In addition, some polymer-based devices and silicon-based photonic devices will also be presented, such as traveling wave electro-optic polymer modulators based on domain-inversion directional couplers, and silicon thermo-optic switches based on coupled photonic crystal microcavities. Furthermore, some microwave (or RF) components such as integrated broadband bowtie antennas for microwave photonic applications will be covered. Some on-going work or suggested future work will also be introduced, including in-device pyroelectric poling for EO polymer filled silicon slot PCWs, millimeter- or Terahertz-wave sensors based on EO polymer filled plasmonic slot waveguide, low-loss silicon-polymer hybrid slot photonic crystal waveguides fabricated by CMOS foundry, logic devices based on EO polymer microring resonators, and so on.Electrical and Computer Engineerin

Multimodal Sensing and Communication with Advanced Components, Circuit topologies, and Biosystem packaging

Monitoring of disease progression by detecting key markers at early stages and providing sufficient intervention to prevent acute and chronic conditions has been a key focus of current wearable and implantable healthcare technologies. When combined with advanced data analytics, these markers can further stratify disease outcomes based on a new set of classifiers for accurate and autonomous predictors. To enable this, the objective of this dissertation is to develop wireless multimodal biosignal monitoring with advanced circuit topologies and thin-film packaging. Specifically, the dissertation seeks to advance implantable electrocorticogram (ECoG) and wearable seismocardiogram (SCG) patches. The proposed strategy consists of three parts: advanced telemetry components for thinner and efficient communication, low-power and low-loss topologies for signal communication, and 3D package integration of a sensor-communication chain for meeting the system targets. The key fundamental advances are demonstrated through in vitro testing using phantom tissue models. This research led to three major scientific and engineering accomplishments. They are: 1) a new class of thin neural ECoG recordings using fully-embedded actives and thin-film passives in a thin flexible package that operates at low power. The recording components are embedded using a chip-first assembly to reduce package dimensions and provide shorter interconnect length for superior electrical performance. Furthermore, embedding components into the substrate can allow for packages with simpler 3D architectures, reducing the number of layers in the circuit design, resulting in thinner packages. 2) development of passive impedance transforming circuits to improve signal sensitivity for the neural recording systems, 3) integration of passive telemetry circuitry with on-skin piezo transducers that led to the first-ever demonstration of a fully-passive wireless seismocardiogram. The dissertation presents: 1) a miniaturized single-layer antenna topology to realize thin substrates for passive telemetry of weak biosignals, 2) skin-compatible PVDF sensors for improving transduction with cardiac mechanical signals, and 3) flexible interconnects with conductive elastomers for embedded-chip thin packages. These developments have resulted in a passive RF backscattering telemetry package with impedance-matched signal interfaces, compliant piezoelectric transducers, and embedded-components, all forming the building blocks towards future health-monitoring needs