Structurally Embedded Electrical Systems Using Ultrasonic Consolidation (UC)

Current research has demonstrated the use of Ultrasonic Consolidation (UC) to embed several USB-based sensors into aluminum, and is working toward embedding suites of sensors, heaters and other devices, connected via USB hubs, which can be monitored and controlled using an embedded USB capable processor. Additionally, the research has shown that electronics can be embedded at room temperature, but with some inter-layer delamination between the ultrasonically bonded aluminum layers. Embedding sensors and electronics at 300o F to overcome the delamination issues resulted in optimal bonding, and the sensors used thus far have functioned normally. Future investigation will explore other UC parameter combinations to ascertain the quality of embedding at lower temperatures.Mechanical Engineerin

Performance of Glass Resistive Plate Chambers for a high granularity semi-digital calorimeter

A new design of highly granular hadronic calorimeter using Glass Resistive Plate Chambers (GRPCs) with embedded electronics has been proposed for the future International Linear Collider (ILC) experiments. It features a 2-bit threshold semi-digital read-out. Several GRPC prototypes with their electronics have been successfully built and tested in pion beams. The design of these detectors is presented along with the test results on efficiency, pad multiplicity, stability and reproducibility.Comment: 16 pages, 15 figure

Development of an Oxygen Saturation Monitoring System by Embedded Electronics

Measuring Oxygenation of blood (SaO2) plays a vital role in patient’s health monitoring. This is often measured by pulse oximeter, which is standard measure during anesthesia, asthma, operative and post-operative recoveries. Despite all, monitoring Oxygen level is necessary for infants with respiratory problems, old people, and pregnant women and in other critical situations. This paper discusses the process of calculating the level of oxygen in blood and heart-rate detection using a non-invasive photo plethysmography also called as pulsoximeter using the MSP430FG437 microcontroller (MCU). The probe uses infrared lights to measure and should be in physical contact with any peripheral points in our body. The percentage of oxygen in the body is worked by measuring the intensity from each frequency of light after it transmits through the body and then calculating the ratio between these two intensities

Solar Panel with Embedded Electronics

Currently, inverters are needed to utilize solar panels for applications that require AC power. Unfortunately, these inverters are very costly and decrease power efficiency. In this work, two alternatives to using inverters are explored. The first method combines a buck converter with a buck-boost converter to create a sine output. The second method uses switches to change the connections of the solar cells, producing a stepped AC output. Both methods involve embedding the solar cells along with the additional electronics into a solar panel, thus eliminating the need for a separate inverter. Simulations were performed using SIMPLIS, and both methods were compared with a focus on feasibility and cost. Results of the simulation demonstrated that the DC-DC converter method performs better than the multiple switch method. More specifically, the quality of the sinusoidal output voltage from the DC-DC converter method is better than the stepped sine wave produced by the multiple switches. Furthermore, the use of many switches to produce a sine wave like output makes the multiple switch method not practical due to the complexity of circuit as well as cost. Therefore, through these comparisons, we recommend that future projects should focus on implementing prototypes for the DC-DC converter method using buck buck-boost converter

Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics

Embedded electronics and sensors are becoming increasingly important for the development of Industry 4.0. For small components, space constraints lead to full 3D integration requirements that are only achievable through Additive Manufacturing. Manufacturing metal components usually require high temperatures incompatible with electronics but Ultrasonic Additive Manufacturing (UAM) can produce components with mechanical properties close to bulk, but with the integration of internal embedded electronics, sensors or optics. This paper describes a novel manufacturing route for embedding electronics with 3D via connectors in an aluminium matrix. Metal foils with printed conductors and insulators were prepared separately from the UAM process thereby separating the electronics preparation from the part consolidation. A dual material polymer layer exhibited the best electrically insulating properties, while providing mechanical protection of printed conductive tracks stable up to 100 °C. General design and UAM process recommendations are given for 3D embedded electronics in a metal matrix

Fully embedded optical and electrical interconnections in flexible foils

This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides

Embedded Electronics In Medical Applications

Proceedings of"Conference on Recent Advances in Biomaterials Dec 17-18 '10"Held at Saveetha School of Engineering, Saveetha University, Thandalam, Chennai-602 105, Tamilnadu, IndiaTheme 10Embedded Electronics In Medical Application

Real-cases of electromagnetic immunity and reliability in embedded electronics architectures

This papers concerns works about electromagnetic immunity and reliability investigations on electronics devices, combined with different physical impacts as temperature

High Radiation Resistant DC-DC Converter Regulators for use in Magnetic fields for LHC High Luminosity Silicon Trackers

For more efficient power transport to the electronics embedded inside large colliding beam detectors, we explore the feasibility of supplying higher DC voltage and using local DC-DC conversion to 1.3 V (or lower, depending upon on the lithography of the embedded electronics) using switch mode regulators located very close to the front end electronics. These devices will be exposed to high radiation and high magnetic fields, 10 – 100 Mrads and 2 - 4 Tesla at the SLHC