Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits

Cadix, L.; Farcy, A.; Bermond, C.; Fuchs, C.; Leduc, P.; Rousseau, M.; Assous, M.; Valentian, A.; Roullard, J.; Eid, E.; Sillon, N.; Fléchet, B.; Ancey, P.

oai:HAL:hal-00602867v1

Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits

Authors: L. Cadix
A. Farcy
C. Bermond
C. Fuchs
P. Leduc
M. Rousseau
M. Assous
A. Valentian
J. Roullard
E. Eid
N. Sillon
B. Fléchet
P. Ancey
Publication date: 30 September 2009
Publisher: HAL CCSD

Abstract

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oai:HAL:hal-00602867v1

Last time updated on 10/02/2018

This paper was published in HAL-CEA.

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