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Surface and bulk nanostructure influence on dissipation in nanoelectromechanical resonators

By Orçun Ergincan


In the most general form, MEMS/NEMS consist of mechanical microstructures, microsensors, microactuators/transducers, and microelectronics, all integrated onto the same silicon chip. A sensor responds to physical stimuli such as pressure, heat, light or motion, and generates an electric signal for detection while an actuator converts an electric signal to motion. The mechanical resonator plays a central role in MEMS or NEMS devices. Examples of mechanical resonator sensors used in MEMS and NEMS are cantilevers, double clamped beams, quartz crystal tuning forks, and microdisk resonators. MEMS with their batch fabrication techniques enable components and devices to be manufactured with increased performance and reliability, combined with the obvious advantages of reduced physical size, volume, weight and cost. However, there are many challenges and technological obstacles associated with miniaturization that need to be addressed and overcome before MEMS/NEMS can realize its overwhelming potential

Year: 2014
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Provided by: NARCIS
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