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Validation of Finite Element Structural Simulation for Ohmic Microcontact

By Hong Liu, Dimitri Leray, Patrick Pons, Stéphane Colin, Adrien Broué and Julien Martegoutte

Abstract

AbstractIn the current literature, there is no model able to accurately predict the electrical resistance value of rough micro- contacts. Such model requires a coupled thermo-electro-structural analysis that is very difficult to validate in a straightforward manner. In the present approach, atomic force microscopy (AFM) scanned data of contact surface with roughness are used to build finite element (FE) model. As a first step towards multiphysics analysis, the aim of this study is to validate results of structural simulation of a rough gold micro-contact.A setup with a nanoindenter and a real microswitch is used to extract force-displacement curves. These results are compared to FE simulations which allow evaluating the effects of the main parameters. It is shown that the accuracy of these structural simulations is acceptable for an accurate evaluation of the electrical contact resistance

Publisher: Published by Elsevier Ltd.
Year: 2011
DOI identifier: 10.1016/j.proeng.2011.12.104
OAI identifier:

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