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need for substrate-surface maintenance. The purityof the plating bath was probably responsible for prevent-ing the development of twins in the deposit (7). Multi-ple twinning is believed to be responsible for the tran-sition to polycrystall inity (13). As only pH, current density, and bath-temperature values within a narrow range used in this study resulted in monocrystall ine d-posits, the necessity for maintaining the proper plating variables is evident. Conclusions 1. Stresses exceeding the yield strength result in a refinement of the structure of monocrystall ine nickel electrodeposits. 2. The stresses in a deposit can influence the value of this property in subsequent layers. 3. The dislocation-cell structure developed in the near-surface regions under stress and was related to the size of the structural feature on the surface. 4. It is possible to grow monocrystalline, nickel elec-trodeposits thicker than 100 p.m. Acknowledgments Several of the copper monocrystals were donated b

Year: 2016
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